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Read through my personal pick of news around people, our industry, important events and interesting product releases. Or click on a filter and pick your area of interest!

World's first 300 mm Power Gallium Nitride (GaN) Technology

Learn more:
infineon.com

Industry News
2024-09-11

Infineon Technologies has succeeded in developing the world's first 300 mm power gallium nitride (GaN) wafer technology, accomplished in an existing and scalable high-volume manufacturing environment - a "breakthrough" which is said to "help substantially drive the market for GaN-based power semiconductors". Chip production on 300 mm wafers offers 2.3 times more chips per wafer than on 200 mm wafers. "The technological breakthrough will be an industry game-changer and enable us to unlock the full potential of gallium nitride", Jochen Hanebeck, CEO of Infineon Technologies, says. "Infineon is mastering all three relevant materials: silicon, silicon carbide and gallium nitride. Nearly one year after the acquisition of GaN Systems, we are demonstrating again that we are determined to be a leader in the fast-growing GaN market." Infineon has succeeded in manufacturing 300 mm GaN wafers on an integrated pilot line in existing 300 mm silicon production in its power fab in Villach/Austria. The company intends to "further scale GaN capacity aligned with market needs". Infineon claims that "300 mm GaN manufacturing will put Infineon in a position to shape the growing GaN market which is estimated to reach several billion US-Dollars by the end of the decade" and that "fully scaled 300 mm GaN production will contribute to GaN cost parity with silicon on R _DS(on) level, which means cost parity for comparable Si and GaN products. The semiconductor manufacturer will present the first 300 mm GaN wafers to the public at the electronica trade show in November 2024 in Munich.

2" x 4" 250 W Medical and Industrial Power Supply Series

Learn more:
lambda.tdk.com

Product Release
2024-09-09

TDK announces additional output voltage models to the 250 W rated TDK-Lambda brand CUS250M series of power supplies in the industry standard 2" x 4" footprint. The full range now covers 12 V, 15 V, 18 V, 24 V, 28 V, 36 V and 48 V and is certified to the IEC 62368-1 and IEC 60601-1 safety standards for industrial and medical applications. This includes both Class I and Class II (no earth ground required) installations. The CUS250M has mechanical configurations that enable convection and/or conduction cooling through the product's baseplate to provide silent cooling. Applications include medical, home healthcare, dental, test, measurement, broadcast, professional audio and industrial equipment. The output can be adjusted to accommodate non-standard voltages, either by the factory or using the on-board potentiometer. The CUS250M operates across an 85 to 264 V_AC input and has a earth leakage current of less than 150 μA - including all tolerances. The touch current is <10 μA (Class I) and <70 μA (Class II). In ambient temperatures of -20 °C to +45 °C the CUS250M can deliver up to 250 W conduction cooled without external air. With appropriate derating, operation at up to +80 °C is also possible. The efficiency is up to 94%, and the average efficiency, measured at 25, 50, 75 and 100% loads, is greater than 91%, while offload power consumption is less than 0.5 W when the output is inhibited.

40 V MOSFETs in PDFN 33 Packages

Learn more:
magnachip.com

Product Release
2024-09-09

Magnachip Semiconductor released four 40V MXT MV MOSFETs designed in Power Dual Flat No-Lead (PDFN) 33 packages for automotive applications. This package reduces the area by more than 60% and the weight by approximately 75% as compared to 40 V MOSFET products packaged in PDFN56. Among these products, three models - AMDV040N029LVRH, AMDV040N036LVRH, and AMDV040N042LVRH - are distinguished by their gate threshold voltage of 1.8 V. The gate threshold voltage determines the point at which the MOSFET switches from an off-state to an on-state. A lower threshold voltage reduces the energy required to operate the MOSFET, thereby decreasing the overall power consumption of the system. For example, the AMDV040N029LVRH provides a typical/maximum R_DS(on) of 3.8 mΩ/5.0 mΩ at V_GS = 4.5 V and of 2.5 mΩ / 2.9 mΩ at V_GS = 10 V. The typical gate charge Q_g at V_GS = 10 V is specified with 30 nC.

Executive Vice President for German Electronics Specialist

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we-online.com

People
2024-09-06

With effect from 1 August 2024 Thomas Garz has been appointed Executive Vice President for the Würth Elektronik eiSos Group. The 37-year-old has been with the Würth Group since 2006. Most recently, he was Senior Vice President of the Würth Line Craft, the core business of the Würth Group, for Scandinavia and additionally responsible for International Systems of the Würth Line. The organizational structure of the Würth Elektronik eiSos Group will remain unchanged as a result of this appointment. Before taking up his position as the Senior Vice President of the Würth Line Craft for Scandinavia, Thomas Garz held various positions, including sales and shop manager, assistant to the management and auditor for Würth.

Long-Term Supply Agreement for SiC Power Devices signed

Learn more:
rohm.com

Industry News
2024-09-05

ROHM and United Automotive Electronic Systems (UAES), a Tier 1 automotive supplier in China, have recently entered into a long-term supply agreement for SiC power devices. Already since 2015, ROHM and UAES have been collaborating and carrying out detailed technical exchanges on automotive applications utilizing SiC power devices. This partnership deepened in 2020 with the establishment of the SiC Joint Research Institute at the UAES headquarters in Shanghai, China. And in 2021 ROHM's advanced SiC power devices and peripheral components were highly evaluated by UAES, resulting in ROHM being selected as a preferred supplier. The close long-standing technical partnership has led to the production and adoption of numerous automotive products equipped with ROHM SiCs, such as onboard chargers and inverters for electric vehicles. This long-term supply agreement is said to ensure UAES sufficient access to SiC power devices to meet the growing demand for SiC-based inverter modules. Going forward, both companies will deepen their collaboration, contributing to technological innovation in the automotive sector by accelerating the development of SiC power solutions for EVs.

Acquisition of Austrian Power Supply Company

Learn more:
recom-power.com

Industry News
2024-09-05

RECOM has enhanced its portfolio of products and capabilities by acquiring Leco. Like RECOM Leco is based in Austria, and according to RECOM Leco "is one of only a few companies that specialize in design and manufacture of full custom, high-end power solutions". By integrating LECO's engineering expertise and high-end power conversion products into its portfolio, RECOM enhances its market position and delivers more, comprehensive, high-end power supply solutions to its global customer base. "We are proud to have established this partnership with LECO. This provides us with an opportunity to expand our engineering capabilities and product portfolio for our customers, especially in industrial, automation & supply chain end-markets, as well as leveraging our global footprint for the sale of LECO high-end products.", Karsten Bier, CEO and Shareholder, RECOM.

Gen-3 Fast SiC to now qualified according to AEC Q101

Learn more:
navitassemi.com

Product Release
2024-09-04

Navitas Semiconductor announced several third-generation automotive-qualified SiC MOSFETs in D2PAK-7L (TO-263-7) and TOLL (TO-Leadless) surface-mount (SMT) packages. Navitas' proprietary 'trench-assisted planar' technology is claimed to provide "world-leading performance over temperature" and to deliver high-speed, cool-running operation for electric vehicle (EV) charging, traction, and DC-DC conversion. With case temperatures up to 25°C lower than conventional devices, Gen-3 Fast SiC is said to offer an operating life up to 3x longer than alternative SiC products, for high-stress EV environments. Gen-3 Fast MOSFETs are optimized for fast switching speeds at high efficiencies, and support increased power density in EV applications such as AC compressors, cabin heaters, DC-DC converters, and on-board chargers (OBCs). Navitas' EV Design Center has demonstrated already OBC system solutions up to 22 kW with 3.5 kW/l power density, and over 95.5% efficiency. Both 650 and 1,200 V ranges are now AEC Q101-qualified in the traditional SMT D2PAK-7L (TO-263-7) package. For 400 V EVs, the 650 V-rated, surface-mount TOLL package offers a 9% reduction in junction-to-case thermal resistance (R_TH,J-C), 30% smaller PCB footprint, 50% lower height, and 60% smaller size than the D2PAK-7L. This enables very high-power density solutions, while minimal package inductance of only 2 nH enables fast-switching performance and adequate dynamic package losses. 400 V-rated EV battery architectures are served by the 650 V Gen-3 Fast MOSFETs featuring R_DS(ON) ratings from 20 to 55 mΩ. The 1,200 V ranges from 18 to 135 mΩ and is optimized for 800 V systems.

Dual 5 A Low-Side MOSFET Gate Drivers for High-Frequency Applications

Learn more:
littelfuse.com

Product Release
2024-09-04

Littlefuse launched the IX4341 and IX4342 dual 5 A low-side MOSFET gate drivers, which complete the existing IX434x driver series by adding the remaining two logic input versions. The IX434x series now consists of dual non-inverting, dual inverting, and non-inverting and inverting input versions. The IX4341 and IX4342 drivers' propagation delay times of 16 ns and rise and fall times of 7 ns make them suited for high-frequency applications. Additionally, for higher current requirements, electronics designers can parallel the two channels of the IX4340 and IX4341 devices to form a single 10 A driver. Another feature of the IX434x drivers is their compatibility with TTL and CMOS logic inputs, enabling direct interfacing with most controllers. Furthermore, each output has an independent ENABLE function and under-voltage lockout circuitry (UVLO). In case of eventual insufficient supply voltage, the gate driver output is asserted low, turning the external power device off. The devices find applications in various markets, including general industrial and electrical equipment, appliances, building solutions, data centers, energy storage, and renewable energy – whenever MOSFETs in industrial applications such as switch-mode power supplies, DC-DC converters, motor controllers and power converters need to be driven. In terms of packaging a standard 8-pin SOIC, thermally enhanced 8-pin SOIC, and 3×3 mm² MSOP packages are available.

Evaluation Board for 240 W PD 3.1 Charger with Efficiency >95 %

Learn more:
eggtronic.com

Product Release
2024-09-04

Eggtronic has unveiled an evaluation board (EVB) that allows engineers to speed the development and significantly reduce the size and cost of 240 W power delivery (PD) 3.1 applications while supporting ultra-fast charging through high efficiency. The SmartEgg 240W PD 3.1 EVB has a peak efficiency above 95% and operates at over 90% efficiency from light load to full load. A single stage that combines zero voltage switching (ZVS) power factor correction (PFC) and quasi-forward isolated regulation significantly reduces bill of materials (BOM) and size of key components (including storage capacitors and magnetics) compared to traditional PFC+LLC and PFC+Asymmetric Half-Bridge (AHB) architectures. The result is a platform that delivers light-load energy savings of up to 50%, achieves a power density of 1.34W/cm3 (21.9W/in³) to support extremely compact charger designs and, most importantly, reduces BOM cost. Based on Eggtronic's SmartEgg AC/DC architecture, the EVB incorporates proprietary mixed-signal, low-power EPIC (Eggtronic Power Integrated Controller) 2.0 IC controllers and features built-in protection against overpower, overvoltage, overtemperature, short circuits and brownouts. EPIC, which is based on a 32-bit RISC-V core and a set of high-performance digital and analog peripherals, incorporates an internal structure that supports multiple independent control loops of both standard and proprietary power conversion architectures. Supplied as a dual-port module, the SmartEgg 240W PD 3.1 EVB can be directly modified for any number of charging ports thanks to the flexibility of the EPIC 2.0 controller, which supports many slave buck converters, each acting as a standalone port.

electronica 2024: The electronics Trade Show turns 60

Learn more:
electronica.de

Event News
2024-09-04

electronica celebrated its premiere in 1964 as the first trade fair in Germany devoted solely to electronic components. In the meantime, it has been accompanying innovations in the international electronics industry for six decades, providing a market overview of its latest products, technologies and solutions every two years. In 2024, this trade fair for electronics will celebrate its 60th anniversary from November 12 to 15, occupying all 18 exhibition halls for the first time ever (together with SEMICON Europe in two halls). The focus will be on the future vision of an all electric society. Already at the first edition in Munich in October 1964 a total of 407 companies from 16 countries exhibited on an area of 4,100 square meters, and around 14,000 trade visitors came to visit on the eight days of the fair. Already now the trade show organizer states that the 2024 edition of electronica "will be the biggest electronica of all time".

PCIM Asia 2024 grew significantly

Learn more:
pcimasia-expo.cn

Event News
2024-09-04

PCIM Asia 2024, an international platform for communication and exchange in power electronics, intelligent motion, renewable energy and energy management, successfully concluded late August at the Shenzhen World Exhibition and Convention Center in China. Setting new records across nearly all metrics, the 2024 edition was the largest and most comprehensive iteration of the event to date. Floor space grew by 8,000 m2 (+67 %) to a total of 20,000 m². The number of visitors (from 41 countries) increased 20 % over the 2023 edition to a total of 18,346, while the number of exhibitors (from 13 countries and regions) increased 28 % over the 2023 edition to a total of 232. To promote further dialogue and collaboration, the exhibition presented a series of industry forums, exhibitor forums and round-table discussions, covering topics ranging from wide-bandgap semiconductors and e-mobility to eVTOL development. At these sessions, representatives from several companies and researchers shared insights on development trends, new market applications and cutting-edge research. Alongside the exhibition, the PCIM Asia Conference 2024 once again featured technical advancements and applications in power electronics. 981 conference visitors listened to 3 keynote speeches, 12 oral sessions and 6 poster sessions as well as to 104 presentations. PCIM Asia is jointly organised by Guangzhou Guangya Messe Frankfurt Co Ltd and Mesago Messe Frankfurt GmbH. The next edition will take place from 14 – 16 August 2025 at the Shanghai New International Expo Centre (SNIEC) in Shanghai, China.

Power Factor Correction Chokes für up to 1000 V_DC

Learn more:
itg-electronics.com

Product Release
2024-09-03

ITG Electronics now offers a range of power factor correction chokes (PFCs) for particularly high-voltage applications. Capable of accommodating up to 1,000 V_DC and 1,500 W, the company's PFC333232DH Series includes CCM PFC boost converters with switching frequencies from 100-200 kHz. The series also can be adopted as a straightforward boosted inductor. The solutions are viable for inductance ranges from 82-1600 μH at a maximum length/width/height of 33 mm x 32 mm x 31.6 mm. Compared with traditional toroidal-shaped PFC chokes, the PFC333232DH Series features a flat wire and square core construction to save space and increase power density. The solutions are up to 50% smaller compared with toroidal-shaped PFC chokes with similar power ratings, and their flat wire technology can reduce DC resistance by as much as 40%, leading to substantially lower copper losses. The PFC chokes are applicable for AC/DC conversion in industrial, equipment and automotive applications. The high-current output chokes can handle up to 41.9 A with approximately 50% roll off.

Medically approved 4:1 input DC/DC Converters

Learn more:
xppower.com

Product Release
2024-09-03

XP Power has introduced the JMR03/10/20 series of 3 W, 10 W, and 20 W medically approved DC/DC converters that offer a 4:1 input ratio. These devices provide 2 x MOPP (Means of Patient Protection) with 2 μA leakage current, ensuring integration into both BF (Body Floating) and CF (Cardiac Floating) rated healthcare applications. Their no-load input idle current is specified down to 4 mA, depending on the model. These fully encapsulated products are suited for use in applications like medical imaging, patient monitoring, patient treatment, dentistry, and respiratory care equipment. Models within the JMR03 (3.5 W), JMR10 (10 W), and JMR20 (20 W) series are available with output voltages of 5 V, 12 V, 15 V ±12 V or ±15 V; the JMR10/20 series offer an additional ±5 V output. The dual-output models can also provide a single 10 V, 24 V or 30 V output. The single output models can also be adjusted by -10% to +10% of the output voltage for non-standard requirements. All output power and voltage combinations can operate from either a 24 V (9.0 - 36.0 V) or 48 V (18.0 - 75.0 V) input, with the JMR03/10 series additionally operating from a 12 V (4.5 – 18 V) input. The operating temperature range for the JMR03/10/20 series is from -40 °C to +100 °C. All models are protected against short circuit and overload conditions, feature a remote on/off function, and have an input-to-output isolation voltage of 5 kV_AC. Safety certification includes UL/CSA/IEC/EN 60601-1 and UL62368-1 with CE and UKCA markings for the low voltage and RoHS Directives.

Current Sensors achieve ASIL C(D) Compliance

Learn more:
melexis.com

Industry News
2024-08-29

Melexis reaches ASIL C safety compliance with its smart IVT (current, voltage, temperature) sensing platform. The Hall-effect MLX91230 and Shunt interface MLX91231 simplify the achievement of ISO 26262 ASIL C(D) architecture for critical vehicle functions such as battery management systems (BMS), smart pyrofuses, and high-voltage charging systems. Both devices integrate a wide range of smart functionality, including the microcontroller unit (MCU) with on-board flash memory that supports custom software deployment and extensive compensation of system imperfections. The diagnosable OCD allows for direct input to the Pyro-Fuse driver, enabling the simple deployment of smart pyrofuses with fewer components. Furthermore, the ASIL C safety level applies to the current sensing function and OCD, as well as the additional temperature and voltage measurement channels. The selectable LIN or UART output enables integration with 12V battery applications and power distribution modules, as well as direct communication with BMS or UART-over-CAN.

240 V/1 kA Bidirectional Power TVS Diode in a Surface Mount Package

Learn more:
bourns.com

Product Release
2024-08-29

Bourns has introduced "the industry's first 240 V/1 kA Bidirectional Power TVS (PTVS) Diode that offers the highest power density available in a surface mount package". The PTVS1-240C-M PTVS Diode offers 1 kA surge handling capability under 8/20 µs test conditions and is thus suited for a broad variety of systems that employ high-voltage DC bus architectures. These systems commonly experience high current switching transients and dynamic load behaviors where snubbing is needed, or protection of bus-powered subsystems is required. The PTVS1-240C-M PTVS Diode is a low-leakage device consuming 10 μA in standby while delivering a maximum breakdown voltage of 295 V, repetitive standoff voltage of 240 V and precise clamping voltage of 340 V. Under 10/350 μs conditions, this device is rated for 200 A peak current, and its voltage breakdown sensitivity over temperature shows a linearity of 0.1 %/°C. The company reports that the "surface mount package offers a significant reduced PCB footprint and lower inductance design advantages compared to traditional through-hole mounted Power TVS Diodes". Applications that can benefit from the features and capabilities of the Model PTVS1-240C-M include industrial power systems, motor controllers and inverters, solar inverters, battery energy storage systems, and factory automation. The device is UL497B certified and meets IEC 61000-4-5 standard specifications. It is also RoHS compliant and halogen free.

European GaN Company establishes Asian Subsidiary

Learn more:
wise-integration.com

Industry News
2024-08-28

Wise-integration, a French company active in digital control of gallium nitride ICs for power supplies, announced the launch of its subsidiary Wise-integration Ltd., based in Hong Kong to help Chinese customers achieve their power/performance/cost goals and accelerate its growing business in China. In addition to serving as the company's financial hub for regional transactions and boosting its presence generally in the Asian market, the subsidiary will enable the company to take advantage of business opportunities in China, a large and receptive market for its GaN-based power electronics solutions with digital control. In the past two years, Wise-integration announced partnerships with companies in South Korea and Taiwan to help bring its technologies to those markets. The company's product markets include consumer electronics and industrial applications like robotics, as well as data centers and electric vehicles. All of its solutions address the increasing demands for miniaturization, electrification and efficient power management. Led by James Ho, as China business development director, Wise-integration Ltd. is based in HKSTP (the Hong Kong Science and Technology Park).

Intelligent Power Device for BLDC Motor Drives

Learn more:
toshiba.semicon-storage.com

Product Release
2024-08-27

Toshiba Electronics has launched a small intelligent power device (IPD) for space-constrained brushless DC (BLDC) motor drive applications such as air conditioners, air purifiers, and pumps. The IPD, TPD4165K, has an increased maximum output current of 3 A, compared to the 2 A rating of Toshiba's existing products like TPD4163K, or TPD4164K. The device is suitable for sine-wave drive. As power supply voltage may fluctuate significantly in some regions where the IP could be used, the absolute maximum voltage rating (V_BB) has been increased to 600 V to enhance long-term reliability. This represents a 20% increase over Toshiba's previous products. TPD4165K is housed in a through-hole HDIP30 package with dimensions of 32.8 mm x 13.5 mm x 3.525 mm. This has a 21% smaller footprint than the DIP26 package used for many of Toshiba's previous products. It supports either three-shunt or single-shunt resistor circuit for current sensing. Safety features like over-current, under-voltage and thermal shutdown are already implented. Additionally, an external signal can be applied to the SD pin to control the behavior of the output stage. The DIAG output pin provides the status of the safety conditions. Designers can freely access a reference design for a sensorless BLDC motor drive circuit based upon the new TPD4165K and Toshiba's TMPM374FWUG microcontroller with vector control engine capability. The reference design data can be downloaded from Toshiba's website.

Absorber Patch Attenuates like a Shielding Cabinet

Learn more:
we-online.com

Product Release
2024-08-27

Würth Elektronik has launched its hybrid WE-EMIP EMI absorber sheet, a convenient solution for preventing electromagnetic interference. The integrated adhesive layer makes the patch easy to stick on. It offers an attenuation of more than 40 dB over a wide frequency range. Both isolated and non-isolated versions are available. The non-isolated version allows the option of earthing. The hybrid absorber sheet consisting of EMI absorber material and aluminum layer is now available in the following sizes: as a sheet 105 mm × 74 mm, 297 mm × 210 mm or as a roll 15 m × 50 mm. The patch offers up to 12 times higher attenuation than previously available absorber sheets and helps achieve attenuation values otherwise attainable only with shielding cabinets.

Joining the Global Battery Alliance

Learn more:
xcelerator.siemens.com

Industry News
2024-08-27

Siemens Digital Industries Software announced today it has joined the Global Battery Alliance (GBA), a collaboration platform that brings together international organizations, NGOs, industry actors, academics and multiple governments to align collectively in a pre-competitive approach, to drive systemic change along the entire battery manufacturing value chain. The vision of the GBA is to achieve three fundamental outcomes, which Siemens endorses and actively contributes to: establish a circular battery value chain, establish a low carbon economy in the value chain, and safeguard human rights and economic development. Through dedication to these principles, Siemens aims to bring about sustainable practices within the battery industry that not only minimize environmental impact but also create new job opportunities and generate additional economic value for communities worldwide. By joining GBA, Siemens is aligning with major stakeholders across the entire battery supply chain, spanning from material developers to cell suppliers, OEMs, and government bodies to strive towards a greener and more ethical future.

Investment in additional R&D Capabilities in Europe and Asia

Learn more:
lem.com

Industry News
2024-08-23

To satisfy the growing global demand for current and voltage sensing driven by the push towards decarbonization and greater electrification, LEM has opened new research and development facilities in Munich and Shanghai. The two sites are said to enable LEM to build greater intelligence into its sensors and to have development bases closer to key customers, while also promoting deeper collaboration on projects and the efficient sharing of vital product design information. While the China site will be kitted out with the very latest laboratory equipment, the site in Germany will focus on ASIC design and semiconductor technology that will help accelerate LEM’s innovation in integrated current sensors (ICSs). This latest investment in additional R&D facilities in Europe and Asia follows on from LEM’s recent inauguration of a factory in Malaysia. LEM’s investment in the state of Penang was an acknowledgment of the region’s expertise in ASIC technology and its specialization in semiconductor design and production. There are already 10 employees in place at Munich and this number will increase in line with LEM’s growth plans for the site. At the 1400 m² Shanghai facility, there are currently 30 staff with the capacity to more than double that number in the future, many of whom will be involved in R&D.

Ideal Diodes in small TSSPs

Learn more:
nexperia.com

Product Release
2024-08-22

Nexperia has introduced two ideal power diode ICs. The NID5100 is suitable for standard industrial and consumer applications while the NID5100-Q100 has been qualified for use in automotive applications. Ideal diodes are MOSFET-based devices that offer much lower forward voltage drop than traditional diodes and make a good replacement option to standard diodes in systems where power efficiency is paramount. The NID5100 and NID5100-Q100 ideal diodes are available in small TSSP6/SOT363-2 leaded plastic packages measuring 2.1 mm x 1.25 mm x 0.95 mm. Applications that can benefit from their electrical performance include smart meters, fire/security sensors, battery powered wearables, and automotive telematics units. The NID5100 is a PMOS based ideal diode where the gate voltage of an internal MOSFET regulates the anode-to-cathode voltage to be eight to ten times lower than the forward voltage drop of similarly rated Schottky diodes. Besides the low forward drop, the MOSFET-based ideal diode also helps to reduce reverse DC leakage current by up to 100 times compared to a typical Schottky diode. The NID5100 supports "OR-ing" multiple power supplies while retaining reverse polarity protection and provides ultra-fast response time for smooth power transfer. Its forward regulation voltage is 31 mV with forward currents up to 1.5 A.

MOSFETs in SMD Package for High Performance Applications

Learn more:
aosmd.com

Product Release
2024-08-21

Alpha and Omega Semiconductor has announced Power MOSFETs in LFPAK 5x6 packages for voltages of 40 V (AOLF66412, AOLF66413 and AOLF66417), 60 V (AOLF66610), and 100 V (AOLF66910). The devices are designed to withstand harsh environments while maintaining MOSFET performance in applications such as industrial, server power, telecommunications, and solar, where high reliability is required. The LFPAK packaging enables higher board-level reliability due to key packaging features such as gull-wing leads, which offer a ruggedized solution for board-level environmental stresses. The gull-wing leads also enable optical inspection during PCB manufacturing. Another feature enhancement is the LFPAK's larger copper clip, which improves electrical and thermal performance. Advantages of the large clip include improved current handling capabilities, reduced on-resistance, and better heat dispersion compared to wire bonding. A large clip also has low parasitic inductance, enabling lower spike voltage in switching applications. The devices operate with gate-source voltages of ±20 V at maximum junction temperatures of 175 °C. The drain current @ 25 °C and the maximum R_DS(on) both depend on the model ranging from 187 to 294 A or, respectively, 1.5 to 4.7 mΩ at a gate-source voltage of 10 V.

Industrial AC/DC Power Supplies in 2" x 3" Packages

Learn more:
tracopower.com

Product Release
2024-08-20

Traco Power released its TXO family of 45, 60 & 120 W compact AC/DC Power supplies. These are the first 3 power levels of a TXO family of power supplies that will eventually go to 500 W. The TXO line specifically focuses on providing cost-efficient industrial power supplies. Efficiencies of up to 92 % allow for a compact design, and these models are designed to meet the ErP directive (< 0.3 W no load power consumption). Features include an internal EN55032 class B filter, as well as EMC characteristics dedicated for applications in industrial/automation and test & measurement fields. Basic features include a 2" x 3" open-frame construction, a universal input range of 85 – 264 VAC, 3000 VAC reinforced I/O isolation, an internal EN55032 class B filter, short circuit and overvoltage protection, IEC/EN/UL 62368-1 safety approvals and EN 61000-3-2 compliance. The TXO 45/60 series operates at full load convection cooled in the range of -20 °C to +50 °C, while the TXO 120 series operates as follows: 100 W convection / 120 W forced air -20 °C to +50 °C.

Online EV-Charging Resource Hub

Learn more:
arrow.com

Industry News
2024-08-19

Arrow Electronics has developed and launched a resource for EV charging for the automotive industry. Expanding its library of content, Arrow helps engineers developing the next generation of electric vehicle chargers and the corresponding software ecosystem that supports them. The hub offers design and technical support across the three electric vehicle charger categories: on-board charger, AC chargers and DC (or fast) chargers. Among the resources now available, Arrow has introduced a free eBook that delves into the latest developments in EV charging, such as costs, adapters, and the economic advantages of electric vehicles. There are also webinars available on-demand, including "Trends and Technologies for Next-Gen EV Charging Solutions".

eBook about Connectivity Needs and Technologies for Connected Homes

Learn more:
mouser.com

Industry News
2024-08-19

Mouser Electronics has released an eBook in collaboration with Qorvo, offering a detailed look at the connectivity requirements for smart homes and the different technologies used to support them. In Next-Gen Connectivity for Smart Living, experts from Mouser and Qorvo offer a deep dive into the technologies that underpin connectivity for smart homes, including Wi-Fi 7, ultra-wideband, and IoT standards like Zigbee, Thread, and Bluetooth Low Energy. The eBook features six different articles, each of which includes detailed infographics and links to relevant design tips from Qorvo including links to a dozen recommended Qorvo products.

Funding of up to $1.6 Billion in CHIPS and Science Act

Learn more:
ti.com

Industry News
2024-08-16

Texas Instruments (TI) and the U.S. Department of Commerce have signed a non-binding Preliminary Memorandum of Terms for up to $1.6 billion in proposed direct funding under the CHIPS and Science Act to support three 300 mm wafer fabs already under construction in Texas and Utah. In addition, TI expects to receive an estimated $6 billion to $8 billion from the U.S. Department of Treasury's Investment Tax Credit for qualified U.S. manufacturing investments. The proposed direct funding, coupled with the investment tax credit, would help TI provide a geopolitically dependable supply of essential analog and embedded processing semiconductors. The proposed direct funding under the CHIPS Act would support TI's investment of more than $18 billion through 2029, which is part of the company's broader investment in manufacturing. This proposed direct funding will support three new wafer fabs, two in Sherman, Texas, (SM1 and SM2) and one in Lehi, Utah (LFAB2), specifically to construct and build the SM1 cleanroom and complete pilot line for first production, to construct and build the LFAB2 cleanroom for first production and to construct the SM2 shell. They will produce semiconductors in 28 nm to 130 nm technology nodes.

Call for Papers for the 75th ECTC

Learn more:
ectc.net

Event News
2024-08-16

The IEEE Electronic Components and Technology Conference (ECTC), a major technical conference and product exhibition for the world's semiconductor packaging industry, has announced a Call for Papers for ECTC 2025, the conference's 75th anniversary. The 75th annual ECTC will take place May 27-30, 2025 at the Gaylord Texan Resort & Convention Center in Dallas. More than 2,000 scientists, engineers and business people from more than 20 countries are expected to attend. Abstract submission has already been opened and the deadline for submissions is October 7, 2024. The ECTC 2025 technical program will address new developments, trends and applications for a broad range of topics, including components, materials, assembly, reliability, modeling, interconnect design and technology, device and system packaging, heterogeneous integration, wafer level packaging, photonics and optoelectronics, IoT, 5G, quantum computing and systems, 2.5D and 3D integration technology, and other emerging technologies in electronics packaging.

High-Performance Power Module Family

Learn more:
semiq.com

Product Release
2024-08-14

SemiQ has added an S7 package to its QSiC™ family of 1200 V, half-bridge MOSFET and Schottky diode SiC power modules. The parts enhance design flexibility for power engineers by providing compact, high-efficiency, high-performance options for new designs while supporting drop-in-replacement in legacy systems that require more efficient operation. This latest announcement sees the availability of a 529A MOSFET module (GCMX003A120S7B1: RdsOn 3.0 mΩ, B1 package), a 348A MOSFET module (GCMX005A120S7B1: R_dsOn 4,9 mΩ, B1 package), and two low-noise SiC Schottky diode half-bridge modules (GHXS300A120S7D5 for 300 A and GHXS400A120S7D5 for 400 A) in an S7 package with industry-standard 62.0 mm footprints and a height of 17.0 mm. The package addresses the size, weight and power requirements of demanding applications ranging from induction heaters, welding equipment and uninterruptible power supplies (UPS) to photovoltaic and wind inverters, energy storage systems, high-voltage DC-DC converters and battery charging systems for electric vehicles (EVs). To guarantee a stable gate threshold voltage and premium gate oxide quality for each module, SemiQ conducts gate burn-in testing at the wafer level and performs various stress. All parts have undergone testing surpassing 1400 V.

New Semiconductor Material: AlYN promises more Energy-Efficiency

Learn more:
iaf.fraunhofer.de

Industry News
2024-08-14

Researchers at Fraunhofer IAF (Fraunhofer Institute for Applied Solid State Physics) have reported that they "made a breakthrough in the field of semiconductor materials": With Aluminum Yttrium Nitride (AlYN), they have succeeded in fabricating and characterizing a new and promising semiconductor material using the MOCVD process. Due to its excellent material properties and its adaptability to gallium nitride (GaN), AlYN is said to have "enormous potential for use in energy-efficient high-frequency and high-performance electronics for information and communications technology". AlYN shows outstanding material properties, however, the growth of the material has been a major challenge. Until now, AlYN could only be deposited by magnetron sputtering. Researchers at Fraunhofer IAF have now succeeded in fabricating the new material using metal-organic chemical vapor deposition (MOCVD) technology, thus enabling the development of new, diverse applications. The institute thinks that "with its promising material properties, AlYN could become a key material for future technological innovations". Recent research had already demonstrated the material properties of AlYN, such as ferroelectricity. In developing the new compound semiconductor, the researchers at Fraunhofer IAF focused primarily on its adaptability to gallium nitride (GaN) – especially in terms of the lattice structure.

AC Surge Protective Devices

Learn more:
bourns.com

Product Release
2024-08-14

Bourns' Model 1270 and 1280 Series Din-Rail AC Surge Protective Devices (SPDs) are IEC/EN 61643-11 compliant Class I + Class II / T1+T2 SPDs, and Model 1280 features an Advanced Thermal Disconnector (TD+) for enhanced protection that eliminates the need for upstream overcurrent protection. Both model series also feature a window fault indicator and remote alarm to help monitor the operating status of the surge protector. In addition, Bourns announced its Model 1430 and 1440 Series Din-Rail DC Surge Protective Devices (SPDs). The two series are IEC/EN 61643-31 compliant Class I + Class II / T1+T2 SPDs. Designed to protect DC power systems, the 14 new models offer protection voltage ranging from 48 VDC up to 1500 VDC and feature high energy MOV technology. In addition, the Model 1440 Series features an Advanced Thermal Disconnector (TD+) as well. Both model series have a replaceable modular design, and also include a window fault indicator and remote alarm, providing enhanced surge protector operating status monitoring.

Power Factor Correction Chokes für up to 3,300 W

Learn more:
itg-electronics.com

Product Release
2024-08-13

ITG Electronics has expanded its portfolio of power factor correction chokes (PFCs) with a set of solutions designed for high switching frequencies. Capable of handling up to 3,300 W the company's PFC433835B Series include CCM PFC boost converters with switching frequencies from 100 – 200 kHz. An extension of ITG Electronics' Cubic Design set of power factor correction chokes, PFC433835B Series solutions are suitable for Inductance ranges from 90 – 285 µH and have footprints up to 43 mm x 35 mm and maximum heights of 38 mm. Compared with traditional toroidal-shaped PFC chokes, the PFC433835B Series features a flat wire and square core construction to save space and increase power density. The solutions are said to be up to 50% smaller compared with toroidal-shaped PFC chokes with similar power ratings, and their flat wire technology can reduce DC resistance by as much as 40%, leading to substantially lower copper losses.

DC/DC Buck Converter deliver up to 20 A

Learn more:
tdk.com

Product Release
2024-08-13

TDK Corporation expanded its TDK-Lambda i7A series of non-isolated buck (step-down) DC/DC converters with the industry-standard 1/16th brick pinout. 20 A output models with a 500 W maximum rating are now available, offering a trimmable 3.3 – 32 V output capability and operation from 28 V up to 60 V input. An adjustable over-current limit is also available as an option, reducing stress on the converter or load when exposed to excessive overcurrent conditions and facilitating fine-tuning based on actual system requirements. The 20A i7A models can be used to derive additional high-power outputs at higher efficiency than isolated DC-DC converters. These products are suited for use in mobile robotics, drones, medical, industrial, test and measurement, communications, computing, and portable battery-powered equipment. Efficiencies of up to 96% minimize internal losses and allow the 20 A i7A models to operate in ambient temperatures of -40 °C up to +125 °C, even with low airflow conditions. The i7A's design provides low output ripple and excellent response to dynamic loads. All models have safety certification to the IEC/UL/CSA/EN 62368-1 standards, with CE and UKCA marking to the Low Voltage and RoHS Directives.

Intelligent Power Module for Industrial Motors up to 4 kW

Learn more:
infineon.com

Product Release
2024-08-12

Infineon Technologies expands its 7th generation TRENCHSTOP™ IGBT7 product family with the CIPOS™ Maxi Intelligent Power Module (IPM) series for low-power motor drives. The IM12BxxxC1 series is based on the TRENCHSTOP IGBT7 1200 V and rapid diode EmCon 7 technology. Thanks to the latest micro-pattern trench design, it offers exceptional control and performance. This results in significant loss reduction, increased efficiency, and higher power density. The portfolio includes three new products in variants ranging from 10 A to 20 A for power ratings of up to 4.0 kW: IM12B10CC1, IM12B15CC1 and IM12B20EC1. The IM12BxxxC1 series is packaged in a DIP 36x23D housing. It integrates various power and control components. This makes it "the smallest package for 1200 V IPMs with the highest power density and best performance in its class", the company says. The IM12BxxxC1 series is particularly suitable for low-power drives in applications such as motors, pumps, fans, heat pumps and outdoor fans for heating, ventilation, and air conditioning. The IPM series offers an isolated dual-in-line molded housing also meets the EMI and overload protection requirements of demanding designs. In addition to the protection features, the IPM is equipped with an independent UL-certified temperature thermistor.

Connect with the Advanced Battery and Electric & Hybrid Vehicle Technology Community

Learn more:
thebatteryshow.com

Event News
2024-08-10

Join North America's largest advanced battery event, The Battery Show and Electric & Hybrid Vehicle Technology Expo, October 7-10, 2024, at Huntington Place, Detroit. Discover the latest technologies and solutions from over 1,150 exhibitors including industry heavy hitters such as Dow, Parker, Hongfa America, Henkel, Honeywell, Siemens, Ampherr, Sabic, Trumpf and more across multiple sectors including automotive stationary, medical, aerospace, commercial, and industrial applications. Experience live product showcases and visit Pavilions on the show floor, including the new Lead and Recycling Pavilions, for industry-specific innovations. Enhance your knowledge with free educational sessions at the Battery Tech Theatre and Open Tech Forum. For a deeper dive, upgrade to our five-track conference covering advanced battery design, manufacturing, market forecasts, and regulatory trends. Network with over 19,000 professionals in the advanced battery and H/EV community through various expo events. Don't miss the ''Welcome to Detroit: An Electrifying Evening in the Motor City" where we celebrate the new home of The Battery Show and Electric & Hybrid Vehicle Technology Expo in Downtown Detroit. We can't wait to see you there! Register now to secure your FREE expo pass or enjoy a $100 discount on conference passes with code BOD.

Automotive DC/DC Converters with "highest Power Density"

Learn more:
infineon.com

Industry News
2024-08-09

Vitesco Technologies created a new generation of DC/DC converters that are claimed to “set new standards in power density (efficiency of over 96 percent) and sustainability for power grids, power supplies, and OBC (On-Board Chargers)”. For this design Vitesco has selected the CoolGaN™ Transistors 650 V from Infineon. With GaN Transistors, Vitesco Technlogies was able to design its Gen5+ GaN Air DC/DC converters with passive cooling, which reduces the system's overall cost. The GaN devices also allow for simplified converter design and mechanical integration. As a result, the DC/DC converters can be flexibly positioned in the vehicle, reducing the workload for manufacturers. The use of GaN also allows the power of the converters to be scaled up to 3.6 kW and the power density to be increased to over 4.2 kW/l. The Gen5+ GaN Air DC/DC converters offer an efficiency of over 96 percent and improved thermal behavior compared to the Gen5 Liquid-Cooled converters. They provide a two-phase output of 248 A at 14.5 V continuous. The phases can be combined to achieve the maximum output power. Still, it is also possible to switch off one phase under partial load conditions and interleave the switching frequency between the two phases.

Partnering on new Capacitor-based Energy Storage Systems (CESS)

Learn more:
musashienergysolutions.com

Industry News
2024-08-08

Flex and Musashi Energy Solutions announced an extensive collaboration to supply Flex-designed and manufactured Capacitor-based Energy Storage Systems (CESS) featuring Musashi's Hybrid SuperCapacitor (HSC) technology. These systems are designed to integrate with server rack power systems to address significant challenges with utility power in artificial intelligence (AI) data centers. First to market with Musashi's HSC technology, Flex has collaborated with Musashi to develop strategic technology and product development roadmaps for current and future products that enable hyperscale operators to mitigate utility power fluctuations in data centers deploying AI workloads. Flex's CESS solutions are designed to balance peak power and protect the grid from intense power surges and line disturbances during AI training and inference activities taking place in data center environments. Musashi's HSCs are designed to provide high-reliability energy storage in many applications. The technology is said to reduce equipment size, weight and total cost of ownership. The new solution is announced to offer "a significantly longer lifespan than current battery energy storage systems, with ability to provide multi-million charge/discharge cycles – essential for high-performance capacity and dependability needed in the data center". Furthermore, it provides a wide operating temperature and inherent safety as the cells are able to operate in temperature ranges from -30 to over +70 °C, plus UL 810A certification and completion of UL 9540A testing for thermal runaway at the cell level.

Personnel Change in Executive Board

Learn more:
rohde-schwarz.com

People
2024-08-08

Peter Riedel has decided to resign from his position as President and COO of Rohde & Schwarz for personal reasons, and he has already left the company, however, he will remain associated with Rohde & Schwarz in an advisory role. After the departure of Peter Riedel, the Executive Board of the Munich technology company now consists of Christian Leicher as President and Chief Executive Officer and CTO Andreas Pauly. For the time being, Andreas Pauly will assume the tasks of Chief Operating Officer on an interim basis. Peter Riedel had been on the Executive Board as Chief Operating Officer since 2014.

SiC Power Semiconductor Fab in Malaysia

Learn more:
infineon.com

Industry News
2024-08-08

As global decarbonization efforts drive demand for power semiconductors, Infineon Technologies has officially opened the first phase of a new fab in Malaysia that will become the world's largest and most competitive 200-millimeter silicon carbide (SiC) power semiconductor fab. Malaysian Prime Minister YAB Dato' Seri Anwar Ibrahim and Chief Minister of the state of Kedah YAB Dato' Seri Haji Muhammad Sanusi Haji Mohd Nor joined Infineon CEO Jochen Hanebeck, to symbolically launch production. The highly efficient 200-millimeter SiC power fab will strengthen Infineon's role as the global leader in power semiconductors. The first phase of the fab, with an investment volume of two billion euros, will focus on the production of silicon carbide power semiconductors and will include gallium nitride (GaN) epitaxy. SiC semiconductors have revolutionized high-power applications because they switch electricity even more efficiently and enable even smaller designs. SiC semiconductors increase efficiency in electric vehicles, fast charging stations and trains as well as renewable energy systems and AI data centers. 900 high-value jobs will be created already in the first phase. The second phase, with an investment of up to five billion euros, will create the world's largest and most efficient 200-millimeter SiC power fab. Overall, up to 4.000 jobs will be created with the project.

Electric Vehicle Charger Reference Designs

Learn more:
microchip.com

Product Release
2024-08-07

To accelerate the time to market of an EV charger, Microchip Technology now offers three flexible and scalable EV Charger Reference Designs including a Single-Phase AC Residential, a Three-Phase AC Commercial (up to 22 kW) with Open Charge Point Protocol (OCPP) and System-on-Chip (SoC) and a Three-Phase AC Commercial with OCPP and Display. Most of the active components for the EV charger reference designs are available from Microchip, including the microcontroller (MCU), analog front-end, memory, connectivity and power conversion. This significantly streamlines the integration process, enabling manufacturers to speed time to market for new charging solutions. These reference designs offer complete hardware design files and source code with software stacks that are tested and compliant to communication protocols, including OCPP. OCPP offers manufacturers a standard protocol to communicate between the charge point or charging station and a central system. This protocol is designed to enable interoperability of the charging applications regardless of the network or vendor. The EV Reference Designs are supported by MPLAB X Integrated Development Environment (IDE) to help designers minimize development time, as well as MPLAB Harmony v3 and MPLAB Code Configurator.

Series of Wire-Wound Ferrites extended

Learn more:
we-online.com

Product Release
2024-08-07

Würth Elektronik now offers its WE-RFI inductors in sizes 0402 and 0603, which can be used as inductors for RF applications or as ferrites for interference suppression. Here the manufacturer responds to increasing miniaturization and complements the existing sizes 0805 and 1008. The components are suitable as low-pass filters (for filtering high-frequency noise), data line filters, supply voltage decoupling, low-frequency radio applications, and RFID. As wire-wound ferrites, the WE-RFI inductors attain higher impedances than normal ferrites, even at high frequencies, and over a wider bandwidth. Unlike multilayer ferrites, they show no DC bias behavior. As RF inductors, they offer high inductance values from 20 nH up to 47 µH. They are characterized by low RDC and consequently a high rated current of up to 1.91 A at ΔT = 40 K. A design kit is available for this component group, which Würth Elektronik will always replenish free of charge, so developers always have inductances of different values to hand.

High-Power Semiconductor Company: President Change

Learn more:
semikron-danfoss.com

People
2024-08-07

Dominic Dorfner will take over as president Semikron Danfoss, when Claus A. Petersen retires on August 31, after 40 years in the Danfoss Group. He has been leading Danfoss Silicon Power and Semikron Danfoss for the last 26 years. Dominic Dorfner has been named new president of the company and will start working in his new position on September 1, 2024. He joined Semikron Danfoss in 2021 as head of the industry business in Danfoss Silicon Power, and for the past 13 months he has been leading the automotive division in Semikron Danfoss. Though now retiring as company president, Claus A. Petersen is not completely leaving Semikron Danfoss, as he has joined the board of directors.

President of Energy Business

Learn more:
abb.com

People
2024-08-05

Effective from the beginning of August 2024, Per Erik Holsten is the president of ABB Energy Industries. He moves into the role from the position of hub manager for Northern Europe at ABB Energy Industries. Per Erik succeeds Brandon Spencer, who has become president of the ABB Motion business area. Per Erik offers vast experience within the energy sector, from traditional sources through to key energy transition industries including hydrogen, offshore wind and Power-to-X. Per Erik Holsten holds an MBA of International Business from the University of East London, UK. He also studied Engineering at Sør-Trøndelag University College (HiST), Norway. He is based in Oslo, Norway.

SiC MOSFETs for High-Voltage Drives in EVs

Learn more:
starpowereurope.com

Product Release
2024-08-05

With three half-bridge modules in SiC MOSFET technology, the manufacturer StarPower is expanding its range of power semiconductors for use in the drivetrain of electric vehicles. The devices, dubbed MD19HFC120N6HT, MD22HFC120N6HY and MD29HFC120N6HT, are characterized by a blocking voltage (V_DSS) of 1200 V. This means that the products can be used in environments with an 800 V on-board power supply. The individual models of the MOSFET family differ in their on-resistance (R_DS(ON)), which covers the range between 1.8 mΩ and a maximum of 2.82 mΩ depending on the type. All models in this product family can be connected in parallel to increase the current. These MOSFETS are supplied in a 2-in-1 housing, which is optimized for low parasitic inductance in order to suppress unwanted oscillation tendencies. Heat loss is dissipated via a solid copper base plate with PINFIN structures for optimum cooling. The ceramic material silicon nitride (S₃N₄) is used as the carrier substrate, employing the sophisticated AMB (Active Metal Brazing) process.

32-bit-DSCs with more Peripherals for Power Applications

Learn more:
microchip.com

Product Release
2024-07-30

Microchip has launched its dsPIC33A Core family of Digital Signal Controllers (DSCs) which well-suited for motor control, power supply, charging and sensing systems. Built around a 32-bit CPU architecture with a 200 MHz operating speed, the DSC family's core includes a Double-Precision Floating-Point Unit (DP FPU) and DSP instructions for numerically intensive tasks in many closed-loop control algorithms. The architecture enables real-time control coupled with a comprehensive development tool ecosystem to streamline and accelerate the design process. The DSCs provide additional math and data processing, higher code efficiency, faster context switching and reduced latency than former members of the family. This allows for a faster response time to transient and safety-critical events. New and upgraded peripherals - such as high-resolution PWMs specifically engineered for motor control and digital power conversion - are designed to support progressive technology development in various markets including automotive, industrial, consumer, E-Mobility, data center and sustainable solutions segments. The dsPIC33A family features integrated analog peripherals, including 12-bit ADCs capable of conversion rates up to 40 Msps, comparators and operational amplifiers. These analog peripherals, in conjunction with Core Independent Peripherals (CIPs), allow for sophisticated sensing and high-performance control. In addition, the CIPs enable interaction among the peripherals without the need for CPU involvement.

High-Current Inductor for Automotive Applications

Learn more:
we-online.com

Product Release
2024-07-25

Würth Elektronik offers WE-LHCA (Low Profile High Current Automotive Inductor) – a particularly flat and temperature-tough inductor in four sizes with different inductance values. The power inductors are designed for an extended temperature range of -55 to +155 °C and are constructed to avoid thermal degradation. The AEC-Q200-certified inductor is suitable for applications such as high-current power supplies, start-stop systems, power distribution modules, on-board chargers, infotainment or HVAC systems. The members of this inductor family are available in the following sizes: 7030 (L = 0.47 - 22 µH), 1040 (L = 1 - 68 µH), 1365 (L = 1 - 47 µH) and 1770 (L = 4.7 - 82 µH). These components feature a low-profile shielded construction with a distributed air gap in iron alloy powder.

Aluminum Polymer rectangular Capacitors for 48 V

Learn more:
rutronik.com

Product Release
2024-07-25

KEMET's aluminum polymer rectangular capacitors of the APL90 series are now available from Rutronik. The capacitors are AEC-Q200 qualified and are particularly suitable for meeting the requirements of 48 V vehicle applications and platforms. The APL90 series currently offers a capacitance of 1,100 µF, a rated voltage of 63 VDC, as well as 20 g vibration resistance and ripple current capability up to 26 A. An important area of application for the APL90 series is the automotive sector, e. g. as a DC link in 48 V inverters for mild hybrid electric vehicles (MHEVs). These capacitors are suited for use in data centers, e. g. as input capacitors in power supply units for 48 V systems. Suitable for use at operating temperatures from -55 °C to +125 °C, the component is shaped for efficient arrangement in modules and can be positioned both horizontally and vertically. Its lifetime is specified with 2,000 hours at +125 °C (with V_R and I_R applied).

Thermal Pads Protect EV Battery Packs

Learn more:
parker.com

Product Release
2024-07-25

The Chomerics Division of Parker Hannifin has introduced its THERM-A-GAP™ PAD 30 thermally conductive gap filler pads for EV battery packs that fits seamlessly into robotic assembly processes. THERM-A-GAP PAD 30 thermally conductive gap filler pads for EV battery pack applications are claimed to “provide exceptional performance and conformability”. During assembly, vision sensors can see THERM-A-GAP pads which enables effective quality control and fast production. The pads release directly from their liner for pick-and-place robots, making them well-suited for high-volume applications, and come in specially designed packaging to ensure safe shipment. The pads provide a soft (34 Shore 00) solution with 3.2 W/m-K of thermal conductivity and are claimed to offer low outgassing, ensuring an effective thermal interface between heat sinks and electronic devices where there are uneven surfaces, air gaps and rough surface textures. The supporting electrical properties of this RoHS-compliant thermal gap filler pad include: 5.9 kV_AC/mm dielectric strength (ASTM D149 test method), 10¹³ Ωcm volume resistivity (ASTM D257), 7.7 dielectric constant at 1,000 kHz (ASTM D150) and 0.001 dissipation factor at 1,000 kHz (Chomerics CHO-TM-TP13).

High Current Three Phase EMC Filter

Learn more:
emisglobal.com

Product Release
2024-07-25

The chassis mounting three phase EMC filter series MF423-3-3D-BB from EMIS is designed for higher current rating applications such as photovoltaic (PV) and power drive systems to meet relevant EMC Standards. Installed on the mains input side of equipment the filters improve conducted immunity and reliability. The devices are fitted with busbar termination. Other applications include inverters and converters, industrial three-phase systems and power supplies, large UPS, wind turbines, factory and building automation. Standard features include an operating voltage of 440/520 V_AC, a current rating of 300 A to 1000 A at 40°C, 50/60 Hz operating frequency within the operating temperature range between -25 °C and +85°C. The climatic category is 25/85/21.

High-Current eFuse with integrated Auto-Reset

Learn more:
nexperia.com

Product Release
2024-07-25

Nexperia announced the NPS3102A and NPS3102B electronic fuses (eFuses). These low-ohmic (17 mΩ), high current (13.5 A), resettable electronic fuses help to protect downstream loads from exposure to excessive voltages while also protecting power supplies from load faults and large inrush currents. They have been designed for use in various 12 V hot-swap applications including enterprise communication and storage equipment found in data centers such as drives, servers, ethernet switches and routers as well as to protect mobile communications infrastructure and industrial automation equipment like PLCs. The eFuses operate in the input voltage range up to 21 V. They are equipped with an integrated low-resistance pass MOSFET which minimizes voltage drop and power loss. The current clamp limit can be adjusted in the 2–13.5 A range using a resistor at the ILIM pin, which can also be used to measure load current in real time. Both devices include a built-in overvoltage clamp limiting the output voltage during an input overvoltage condition, with a 2 µs short-circuit protection response time. The pass-FET in the NPS3102A must be manually reset after a fault event whereas the NPS3102B integrates an auto-retry block, which safely attempts to re-enable the pass-FET without the need for user intervention.

4.5 kW Power Supply for AI GPU Racks

Learn more:
navitassemi.com

Product Release
2024-07-25

Navitas Semiconductor released its 4.5 kW AI data center power supply reference design, with GaNSafe™ and Gen-3 'Fast' (G3F) SiC power components. The design is claimed to "enable the world's highest power density with 137 W/in³ and over 97% efficiency". Next-generation AI GPUs like NVIDIA's Blackwell B100 and B200 each demand over 1 kW of power for high-power computation, 3x higher than traditional CPUs. These new demands are driving power-per-rack specifications from 30 - 40 kW up to 100 kW. The latest 4.5 kW CRPS185 design demonstrates how GaNSafe power ICs and GeneSiC™ Gen-3 'Fast' (G3F) MOSFETs enables highest power density and efficiency solution. At the heart of the design is an interleaved CCM totem-pole PFC using SiC with full-bridge LLC topology with GaN, where the fundamental strengths of each semiconductor technology are exploited for the highest frequency, coolest operation, optimized reliability and robustness, and highest power density and efficiency. The 650 V G3F SiC MOSFETs feature 'trench-assisted planar' technology which delivers "world-leading performance over temperature for the highest system efficiency and reliability in real-world applications". With a 3.2 kW power supply on the market Navitas plans to introduce an 8.5 kW design in September.

Second Generation of 1200V SiC MOSFET for High Performance Applications

Learn more:
powermastersemi.com

Product Release
2024-07-25

Power Master Semiconductor has released the 2nd generation of the 1200V e SiC MOSFET, which is intended for applications such as DC EV charging stations, solar inverters, energy storage systems, motor drives and industrial power supplies. The 1200 V devices are claimed to “offer e. g. higher power density, efficiency and less cooling effort due to its much lower power losses”. FOM characteristics such as gate charge (Q_G), stored energy in output capacitance (EOSS), reverse recovery charger (Q_RR) and output charge (Q_OSS) are improved by up to 30 % compared to previous generation. All devices are 100 % tested in terms of avalanche capability. Due to its lower miller capacitance (Q_GD) it achieved 44 % lower switching losses than the previous generation.

Supply Chain for Power Devices based on AlN established

Learn more:
iisb.fraunhofer.de

Industry News
2024-07-24

In order to make the ultra-wide band gap (UWBG) technology AlN accessible to industry in the medium term, the related existing activities in Germany have been combined in a strategic cluster. The aim is to establish a German value chain for AlN-based technology and to build up an international leadership position in this increasingly economically important field. The Ferdinand-Braun-Institut (FBH), the Fraunhofer Institute for Integrated Systems and Device Technology IISB and the company III/V-Reclaim PT GmbH drive this initiative together. They cover the entire value chain, starting with the growth of AlN crystals using the Physical Vapor Transport (PVT) process, to wafering and polishing of epi-ready AlN-wafers, and the epitaxy of the functional device layers, up to the fabrication of transistors for power electronics and millimeter-wave applications. For the first time, the consortium has now successfully demonstrated the practical implementation of a value chain for AlN devices in Germany and Europe. The first transistor generations produced with these wafers already show promising electrical properties, such as a breakdown voltage of up to 2200 V and a power density superior to SiC as well as GaN-based power-switching devices. Compared to established silicon devices, AlN/GaN HEMTs, as they have now been successfully produced on AlN wafers, offer up to three thousand times less conduction losses than with silicon and are around ten times more efficient than SiC transistors.

SEMICON Southeast Asia 2025 to be Held in Singapore

Learn more:
semiconsea.org

Event News
2024-07-24

SEMICON Southeast Asia will return to its roots in Singapore in 2025 to commemorate its 30th anniversary. With more than 18,000 delegates expected to attend from the region and around the world, SEMICON Southeast Asia has become a key platform for industry leaders, innovators, and decision-makers to connect, collaborate, and drive innovation. This special edition of the event will take place at Sands Expo & Convention Centre from 20 – 22 May 2025. Themed "Stronger Together", SEMICON Southeast Asia 2025 will feature insights into the latest industry developments, trends and innovations, and critical areas including sustainability, artificial intelligence (AI), chiplet technology, and workforce development. Since 2015, SEMICON Southeast Asia has been hosted in Malaysia, contributing significantly to the growth and advancement of the semiconductor industry in the region.

Varistor Series Offers Surge Current Protection up to 6,000 A

Learn more:
koaspeer.com

Product Release
2024-07-23

KOA Speer Electronics introduces the NV73S series multilayer type metal oxide varistor that handles a surge current of up to 6,000 A, which is five times higher than existing products. The multilayer construction can absorb a large surge. The two-way symmetries can absorb positive and negative surges. The NV73S replaces the NV732E (1210) through 2L (2220) due to its improved surge protection. Maximum peak current and sizes for the new NV73S are 400 to 800 A (1210), 500 to 1,200 A (1812), and 1,500 to 6,000 A (2220) with a working voltage range of 6 to 95 V (AC) and 9 to 127 V (DC). The varistor voltage range for the NV73S series is 12 to 150 V. The NV73S series metal oxide varistor offers protection from ESD and EMI. It also provides surge protection for motors, relays, and solenoid valves. It meets EU-RoHS requirements.

Supply Agreement: SiC MOSFETs for EVs

Learn more:
onsemi.com

Industry News
2024-07-22

onsemi has signed a multi-year deal with Volkswagen Group to be the primary supplier of a complete power box solution as part of its next-generation traction inverter for its Scalable Systems Platform (SSP). The solution features silicon carbide-based technologies in an integrated module that can scale across all power levels – from high power to low power traction inverters to be compatible for all vehicle categories. Based on the EliteSiC M3e MOSFETs, onsemi's power box solution is said to be able to handle more power in a smaller package which significantly reduces energy losses. The inclusion of three integrated half-bridge modules mounted on a cooling channel will further improve system efficiency by ensuring heat is effectively managed from the semiconductor to the coolant encasement. This leads to better performance, improved heat control, and increased efficiency, allowing EVs to drive further on a single charge.

SiC Modules for Power Grid Batteries

Learn more:
infineon.com

Industry News
2024-07-19

Infineon Technologies announced that its CoolSiC™ 2000 V modules have been selected by Daihen Corporation for their unit-type power conditioners for grid storage batteries. The unit-type power conditioner for grid storage batteries launched by Daihen earlier this year is the first product in the industry to achieve connection to storage batteries at a high DC link voltage of 1500 V. The higher voltage enables the product to be used with large-capacity storage battery facilities, which has resulted in a 40 percent reduction in the footprint of grid storage batteries compared to the conventional product. The higher power density is achieved by using Infineon's 62 mm CoolSiC MOSFET 2000 V module FF3MR20KM1H. In addition to the characteristics of SiC that enable high voltage, better thermal dissipation and high power density, Infineon's SiC products feature M1H trench technology that increases the gate drive voltage range and provides high robustness and reliability against gate voltage spikes.

150 V N-Channel Power U-MOS X-H MOSFETs

Learn more:
toshiba.semicon-storage.com

Product Release
2024-07-18

Toshiba Electronics Europe adds two 150 V N-channel power MOSFET products based upon their U-MOS X-H Trench process. The TPH1100CQ5 and TPH1400CQ5 devices are designed specifically for use in high-performance switching power supplies, such as those used in data centers and communication base stations as well as other industrial applications. With a maximum drain-source voltage (V_DSS) rating of 150 V and drain current (I_D) handling of 49 A (TPH1100CQ5) and 32A (TPH1400CQ5), the devices feature a maximum drain-source on-resistance (R_DS(ON)) of 11 mΩ and 14 mΩ, respectively. The reverse recovery charge (Qrr) of TPH1400CQ5 is 27 nC (typ.), and the typical reverse recovery time (trr) is 36 ns. Used in synchronous rectification applications, the TPH1400CQ5 reduces the power loss of switching power supplies and helps improve efficiency. When used in a circuit that operates in reverse recovery mode, the new products reduce spike voltages generated during switching, helping to improve EMI characteristics. The devices are housed in a surface-mount SOP Advance(N) package measuring 4.9 mm x 6.1 mm x 1.0 mm. A G0 SPICE model for rapid verification of the circuit function as well as highly accurate G2 SPICE models, for accurate reproduction of transient characteristics are also available.

Memorandum of Understanding to stimulate sustainable Action across the Supply Chain

Learn more:
infineon.com

Industry News
2024-07-18

Infineon Technologies has signed a Memorandum of Understanding with Amkor Technology, a provider of semiconductor packaging and test services, with a joint commitment to stimulate decarbonization and sustainability strategies across the supply chain. Expanding their partnership towards sustainability is the next step in the sustainability journey of both companies. Infineon and Amkor intend to fully leverage their classical Outsourced Semiconductor Assembly and Test (OSAT) business relationship in order to effectively tackle emissions along their supply chain. In April, both companies announced to operate a dedicated packaging and test center at Amkor's manufacturing site in Porto, Portugal. As part of the cooperation for climate protection, Infineon and Amkor will actively engage with common suppliers to help them develop and implement effective decarbonization strategies. This will involve workshops, meetings, and the sharing of best practices and learnings related to decarbonization. The aim is to identify areas for improvement and support suppliers in setting science-based emissions reduction targets in line with the Science Based Targets initiative. Both companies are committed to providing ongoing guidance, fostering exchange, and tracking progress to drive continuous improvement across the common supply chain.

PCIM Europe 2025: Call for Papers

Learn more:
pcim.com

Event News
2024-07-17

Starting now, experts from the realms of business and academia can submit their abstracts on a wide range of topics in power electronics for a chance to speak at the PCIM Conference 2025. This call for papers will be open until 15 October 2024. The PCIM Conference gives authors of first-time publications the opportunity to present their work to an international audience of more than 900 representatives from the business and scientific sides of power electronics. All those accepted will have their articles published in the PCIM Conference proceedings and databases like IEEE Xplore, IET Inspec Direct, Knovel, and Scopus. In addition, presenters at the PCIM Conference will benefit from the immediate feedback they receive from both the industry and the academic world – and they will be able to make a number of contacts in the power electronics community in the process. The PCIM Conference offers a several options to present: From 20-minute talks on the conference stages via poster presentations offering direct interaction directly with other attendees up to half-day seminars. This year's best submissions will be recognized in five categories by the Best Paper Award, the Young Engineer Award, and the Young Researcher Award.

Testing Procedure for Determining Dielectric Strength

Learn more:
we-online.com

Industry News
2024-07-17

Würth Elektronik has developed a testing procedure for determining the maximum operating voltage of molded inductors. The manufacturer of electronic and electromechanical components introduces developers to the electrical property of dielectric strength and what happens if it is exceeded in an application note. The molded inductors from the Power Magnetics product portfolio (e. g., WE-MAPI, WE-XHMI, WE-LHMI) are now successively supplemented with the value of the maximum operating voltage V_op as a new parameter in the specifications. Based on the testing procedure, Würth Elektronik defines the maximum operating voltage V_op in its data sheets. This represents the voltage at which an inductor can be operated continuously in the application without impairing performance, risking damage or overheating the inductor. The operating voltage is therefore a limit value for the input voltage, up to which the inductor can be used reliably in an application without irreversible damage. The test concept examines the behavior of inductors up to their voltage limits under realistic conditions in a DC/DC full-bridge converter (voltage transients of up to 60 V/ns and frequencies of up to 2 MHz). The approximate voltage limit is firstly evaluated using a short-term test. The operating voltage is then defined on this basis and verified in a long-term test.

Magnetic Packaging Technology for Power Modules: Cutting Size in half

Learn more:
ti.com

Product Release
2024-07-16

Texas Instruments (TI) introduced six power modules designed to improve power density, enhance efficiency and reduce EMI. These power modules leverage TI's proprietary MagPack™ integrated magnetic packaging technology, "shrinking their size by up to 23% compared to competing modules", enabling designers of industrial, enterprise and communications applications to achieve previously impossible performance levels. In fact, three of the six devices, the TPSM82866A, TPSM82866C and TPSM82816, are claimed to be "the industry's smallest 6 A power modules, supplying a power density of nearly 1A per 1 mm² of area". The magnetic packaging technology includes an integrated power inductor with proprietary, newly engineered material. As a result, engineers can now reduce temperature and radiated emissions while reducing both board space and system power losses. This is especially important in applications such as data centers, where electricity is the biggest cost factor, with some analysts predicting a 100% increase in demand for power by the end of the decade.

3-Phase Brushless Gate Driver with Power Module and Sleep Mode

Learn more:
microchip.com

Product Release
2024-07-15

Microchip has launched the MPC8027, a 3-phase brushless gate driver module with a typical sleep-mode current of 5 µA. MCP8027 integrates three half-bridge drivers to drive external NMOS/NMOS transistor pairs configured to drive a 3-phase BLDC motor, a comparator, a voltage regulator to provide bias to a companion microcontroller, power monitoring comparators, an overtemperature sensor, two level translators and three operational amplifiers for motor current monitoring. The MCP8027 buck converter is capable of delivering 750 mW of power - may be disabled if not used - for powering a companion microcontroller. The onboard 5 V and 12 V LDO regulators are capable of delivering 30 mA of current. The MCP8027 operation is specified over a temperature range of -40°C to +150°C. Package options include the 40-lead 5x5 QFN and 48-lead 7x7 TQFP. For 100 ms the transient voltage tolerance is 48 V. Thermal warning and shutdown are also integrated.

Hyperfast Recovery Rectifiers in D²PAK

Learn more:
nexperia.com

Product Release
2024-07-10

Nexperia released 650 V ultra- and hyperfast recovery rectifiers in D²PAK Real-2-Pin (R2P) packaging for use in various automotive, industrial and consumer applications including charging adapters, photovoltaic, inverters, servers and switched mode power supplies. Combining planar die technology with a state-of-the-art junction termination (JTE) design, these rectifiers offer high power density, fast switching times with soft recovery and excellent reliability. They are encapsulated in a D²PAK Real-2-Pin Package (SOT8018), which offers the same package outline as the standard D²PAK package but has only two pins instead of three (the middle cathode pin has been removed). This increases the pin-to-pin distance from 1.25 mm to over 4 mm, which allows to meet the creepage and clearance requirements stated in the IEC 60664 standard.

Opening of Wafer Testing Site in Malaysia

Learn more:
melexis.com

Industry News
2024-07-10

Melexis has opened its largest wafer testing site worldwide in Kuching, Sarawak, Malaysia. This expansion also increases Melexis' presence in the Asia-Pacific region. The expansion in Malaysia is said to allow the company to fulfil the growing global demand for semiconductors, which is expected to double in the next decade. It hosts 90 semiconductor wafer test equipments used to test ICs. Melexis will use the site for edge sensors and edge drivers aimed at current and future applications in the mobility, sustainability, robotics, and health areas. Placing the facility in Kuching - Sarawak - Malaysia, member of the Association of Southeast Asian Nations (ASEAN), between Eastern and Western markets and next to X-FAB's wafer foundry, one of Melexis' key suppliers, is a strategic move to streamline logistics and help reducing the company's ecological footprint. The 4-storey building, designed by, both award-winning, Belgian architect Sebastian Mortelmans and Sarawakian architects DNA, covers a ground surface of 4,500 square metres, making it the largest Melexis wafer testing site worldwide. The modern design referencing local longhouse architecture, incorporates energy-saving systems including a solar installation that can generate 30.000 kWh per month. The facility is designed with future expansions in mind.

Analog-Digital Fusion Control Power Supply Solution

Learn more:
rohm.com

Product Release
2024-07-10

Rohm has established LogiCoA™, a power supply solution for small to medium power industrial and consumer equipment (30 W to 1 kW class). It provides the same functionality as fully digital control power supplies at low power consumption and cost equivalent to analog power types. The LogiCoA power solution leverages the strengths of both analog and digital technologies. Low power LogiCoA MCUs are utilized to facilitate control of a variety of power supply topologies. The LogiCoA brand embodies a design philosophy of fusing digital elements to maximize the performance of analog circuits. Rohm claims that its LogiCoA power solution is "the industry's first analog-digital fusion control power supply that combines a digital control block" centered around the LogiCoA MCU with analog circuitry comprised of silicon MOSFETs and other power devices. The evaluation reference design REF66009 allows users to experience the LogiCoA power supply solution in a non-isolated buck converter circuit. Various tools necessary for evaluation are also offered, including circuit diagrams, PCB layouts, parts lists, sample software, and support documents, while actual device evaluation is possible using the optional EVK-001 evaluation board.

Several Changes in Management

Learn more:
schurter.com

People
2024-07-10

After more than 25 years at Schurter, the current Managing Director (MD), Rolf Hausheer, will retire at the end of 2024. He handed over the position of MD of Schurter AG to Steffen Lindner on 1 July 2024. Steffen Lindner is already acting as the General Manager & Vice President EMEA. Rolf Hausheer's career at Schurter began in April 1999 as the Head of Procurement. As of 2009, he was appointed to the management team, taking responsibility for Supply Chain Management, including Sourcing, Customer Service, and Warehouse. Since February 2024, Rolf Hausheer has been leading Schurter AG as MD ad interim. Despite the additional responsibility as MD, he retained leadership of Supply Chain Management and supported the strategic direction of the company as Co-Program Management Officer. Furthermore, as of July 2024, Steffen Lindner has assumed the role of MD of Schurter AG. He already manages the Schurter group company in Germany and oversees all company activities in EMEA, including Product Management, Engineering, Sales, and Production. Simultaneously, responsibility for Supply Chain Management has been handed over to Oswald Fiegl, the acting COO. Rolf Hausheer is now focusing on organizational projects within the company's strategy.

Faster Development Processes for DC Charging Stations

Learn more:
ast-international.com

Industry News
2024-07-09

The charging controller developer Vector Informatik and AST International are now offering a joint solution for the development of DC charging stations. The compatibility of the communication protocols of the Vector charging controller vSECC and the AST DC meter is ensured, which enables charging station manufacturers to offer a convenient plug-and-play solution. This shortens development times and enables complete integration. Vector's vSECC controllers control the charging communication between electric vehicles, charging station components and backend systems and support common charging standards such as CCS, NACS, CHAdeMO and MCS. The AST DC Meters provide continuous precise measurements for fast charging stations, megawatt charging systems and DC wallboxes. They are certified according to German, European and North American calibration law requirements.

Scalable Industry 4.0-ready Zero-Downtime Industrial Power Supply Series

Learn more:
camtec-powersupplies.com

Product Release
2024-07-09

The CPS-i series from CAMTEC Power Supplies is based on a specific steering and control architecture. It is designed for testing automation and high-end industrial lab power supply users. It supports production process planners as well as energy and water infrastructure or UPS-system engineers. It offers free scalability from 2000 W up to 105 kW power output, accompanied by flexible up- and downscaling and service by the customer himself. The CPS-I series connects up to 35 power supply units to form a large (DC grid) network by configuring master-slave-master to slave systems. With its modular design it is possible to scale this system to the required power. If the power supply units are decoupled from each other, the result will be independent systems, which can then be used stand-alone or in new arrangements, provided one inexpensive power supply unit is added to each new block. Configuration and maintenance are achieved via web browser. Defect LAN interfaces can be replaced by the system operator himself, as the interfaces recognize the power supply unit on their own and calibrate themselves. Defect devices, therefore, don't have to go back to the service unit, but can be repaired on-site.

Battery Protector Series to Prevent Li-ion Battery Pack Damage

Learn more:
littelfuse.com

Product Release
2024-07-09

Littelfuse announced the extension of its ITV2718 surface-mountable Li-ion battery protector series. These fuses safeguard Li-ion battery packs against overcurrent and overcharging (overvoltage) conditions - even when fast charging. The latest addition, the ITV2718, provides a five-amp, three-terminal fuse in a 2.7 mm x 1.8 mm footprint. The design utilizes an embedded fuse and heater element combination to respond quickly, interrupting the battery pack's charging or discharging circuit before overcharging or overheating conditions occur. The ITV2718 Battery Protector is suited for a wide range of consumer electronics applications, including game consoles, E-call, portable routers and modems, smartphones, notebooks and tablets. It meets industry safety requirements via UL and TÜV certifications for faster compliance approval while being halogen-free and RoHS compliant environmentally friendly components.

Optocoupler Series expanded with Opto-TRIACs

Learn more:
we-online.com

Product Release
2024-07-04

Würth Elektronik now offers a solution for phase control of AC loads, the WL-OCTR optocouplers, a safe alternative to mechanical relays. The TRIAC optocouplers are particularly suitable for use in lamp dimming functions and AC motor drivers in household appliances. They can also be used as drivers for high-current TRIACs. These optocouplers are available with and without a zero-cross function to shift the TRIAC switch-on point. The portfolio includes both THT and SMT designs in DIP4, DIP6 and SOP4 packages and offers trigger currents of 5, 10 or 15 mA. A CTI (Comparative Tracking Index) value (describing leakage current stability) of over 500 and insulation voltages of 3750 or 5000 V for the THT and SMT designs makes the optocouplers well-suited for circuit protection. Like all optocouplers from Würth Elektronik, the newest addition to the optocoupler portfolio is certified to all necessary standards: UL1577, EN IEC 60747-5-5 VDE 0884-5, CQC GB 4941.1-2022.

New Building for more SiC Wafer Production Space

Learn more:
sicrystal.de

Industry News
2024-07-04

In an important step towards strengthening the semiconductor industry and promoting sustainable technologies, SiCrystal will create additional production space in the north-east of Nuremberg, directly opposite the existing site. The new building will offer an additional 6,000 square meters of production space and will be equipped with state-of-the-art technology to further optimize the production of silicon carbide wafers. The close proximity to the existing plant will ensure close integration of the production processes. SiCrystal's total production capacity, including the existing building, will be approximately three times higher in 2027 than in 2024. "This groundbreaking ceremony marks an important milestone for SiCrystal and underlines our commitment to the metropolitan region. In this way, we can continue to supply innovative products of the highest quality for our customers in the future and make a positive contribution to global sustainability. ", said Dr. Erwin Schmitt, COO of SiCrystal. "With the additional production capacities, we will strengthen our market position and make an important contribution to technological development in the semiconductor industry."

Experts for WBG-Testing Acquired

Learn more:
microtest.net

Industry News
2024-07-03

After receiving approval from the British and Italian governments, Microtest Group announces the acquisition of ipTEST. ipTEST specializes in testing silicon carbide and gallium nitride semiconductors, with locations in Guildford (UK) and Ipoh (Malaysia) and reported €22 million in revenue in 2023. This transaction marks the fourth acquisition for the Group in just over a year - following the 2023 acquisitions of the Dutch company Test Inspire, the German company RoodMicrotec and the Italian company GEDEC. This move is part of the growth and international development strategy launched in 2022 with the support of Xenon Private Equity, aiming to make Microtest the European reference point for chip design (ASIC), test systems and in the testing of microchips on package and silicon wafers. From an industrial perspective, integrating ipTEST will bring significant expertise in innovative device development, such as the new DS5, which won the prestigious King's Award for Enterprise in 2023 and 2024 for silicon carbide and gallium nitride semiconductor testing. These frontier semiconductors are crucial for managing electric vehicle batteries and inverters, with expected growth of over 30% annually in the next five years due to the ongoing energy transition. This acquisition will enable Microtest to serve power microchip manufacturers making substantial investments to meet new sector demands, including the main IDM’s in the industry ST Microelectronics, Infineon and Wolfspeed.

Technology Acquisition Expands Power Management Solutions

Learn more:
gf.com

Industry News
2024-07-01

GlobalFoundries announced that it has acquired Tagore Technology’s proprietary and production proven Power Gallium Nitride (GaN) IP portfolio, a high-power density solution designed to push the boundaries of efficiency and performance in a wide range of power applications in automotive, internet of things (IoT) and artificial intelligence (AI) datacenter. As the digital world continues to evolve with technologies like Generative AI, GaN stands out as a pivotal solution for sustainable and efficient power management particularly in datacenters. The announcement reinforces GF’s commitment to large-scale manufacturing of GaN technology that offers a suite of benefits to help datacenters meet the increasing power demands while maintaining or improving power efficiency, reducing costs and managing heat generation. The acquisition expands GF’s power IP portfolio and broadens access to GaN IP that will enable GF customers to quickly bring differentiated products to market. As a part of the acquisition, a team of experienced engineers from Tagore, dedicated to the development of GaN technology, will be joining GF. “We are committed to being the foundation of our customers’ power applications today and for decades to come,” said Niels Anderskouv, chief business officer at GF. “With this acquisition, GF takes another step toward accelerating the availability of GaN and empowering our customers to build the next generation of power management solutions that will reshape the future of mobility, connectivity and intelligence.”

Open for Proposals for Power Event

Learn more:
apec-conf.org

Event News
2024-06-28

APEC now accepts Professional Education Seminar Proposals for APEC 2025, which will take place March 16-20, 2025 at the Georgia World Congress Center in Atlanta, GA (USA). APEC continues the tradition of focusing on the practical aspects of the power electronics profession; the Professional Education Seminars at APEC 2025 will address the need for in-depth discussions of important and complex power electronics topics. Each seminar combines practical application with theory designed to further educate the working professional in power electronics or related fields. Topics are to address the practical issues of the specification, design, manufacture and marketing of power electronic components, products, and systems. Proposals focusing on, but not limited to, any of the following areas of power electronics are welcome. All the relevant details can be found the APEC website, including submission requirements and additional details.

Attracting more People to Careers in the Semiconductor Industry

Learn more:
ecpe.org

Industry News
2024-06-28

The CHIPS of Europe (Creating Higher-Education Industry Programmes for the Semiconductor Industry of Europe) project is addressing the shortage of workforce in the EU semiconductor industry. In the next four years industry and academia will work together to increase the attractiveness of semiconductor-related study programs and careers. The need for more skilled workers in the EU semiconductor industry has increased due to the new investments via the EU Chips Act. If no action is taken, the EU semiconductor industry will face a shortage of 350,000 workers by 2030. CHIPS of Europe intends to increase the attractiveness of semiconductor-related study programmes and careers. It brings together large companies and small and medium-sized enterprises, such as Infineon, Imec, X-Fab, Cadence, Nextnano, and universities. The project includes partners from fascinating application fields such as medical and space which touch on the hearts and minds of future workforce. Involving 14 full and 7 associated partners from 10 countries spread across Europe, the project employs targeted measures in order to leave a sustainable impact on the European semiconductor ecosystem. The CHIPS of Europe project is co-funded by the European Union (Digital Europe – Reinforcing skills in semiconductors) semiconductor ecosystem. There will also be summer schools at fabs and virtual labs.

Charity Benefit from PCIM Booth for Education in Ecuador

Learn more:
vincotech.com

Industry News
2024-06-27

Vincotech staged a charity benefit at the PCIM Europe trade fair to raise funds for the NGO Plan International Germany. Visitors rose to this virtual reality (VR) challenge. Vincotech and its partners rewarded their efforts by donating €15,000 to a project to support young Ecuadorians. Vincotech has a history of hosting charity events at PCIM Europe. Ranging from wall climbing to Sudoku, these activities have been a big hit with fairgoers. This year’s event – a VR flight over mountainous terrain – was yet another audience magnet. Hundreds of PCIM Europe visitors (including a Bodo’s Power System editor) took up the challenge, with Vincotech matching all pledges to raise €15,000 for a Plan International Germany project in Ecuador. The money goes to support youngsters, especially girls, in ten communities each in the Cotopaxi and Santa Elena regions. It funds projects to convey entrepreneurial, digital, and soft skills that will help them get off to a better start in professional life, as well as health services for mothers and children. This project, which involves 2,000 individuals directly and indirectly benefits nearly 6,000 community members, is a certainly a winning proposition young Ecuadorians in the region. Plan International is an independent organization, with no religious, political or governmental affiliations, standing up for children’s rights worldwide and striving to be open, accountable and honest in what the NGO does.

Connecting Engineers to the Future of EV/HEV Technology

Learn more:
mouser.com

Industry News
2024-06-27

Mouser Electronics explores the latest developments, advancements and challenges in electric and hybrid vehicle technology through its EV/HEV resource hub. Staying ahead in this rapidly evolving industry is crucial for engineers and innovators. With advancing technologies like bi-directional charging and vehicle autonomy entering the market, it's more important than ever to stay up to speed. Mouser's EV/HEV resource hub offers a wealth of engaging content, including eBooks, blogs, articles, products, and more, all designed to keep engineers at the forefront of these technological advancements. Electric infrastructure is advancing with the use of emerging technologies, such as liquid-cooled HPC connectors, while still maintaining the latest industry standards and lowering maintenance costs. This development empowers the future of eMobility, as discussed in Mouser's interactive content series “Electrifying the Future of eMobility”, exploring how current renewable energy sources and evolving technologies like hydrogen electrolysis are driving toward a net-zero future. The EV/HEV technology content hub offers engineers access to resources from Mouser's technical team and leading manufacturers. In a recent eBook with TE Connectivity, “EV and Connected Transportation”, industry experts explain the tandem movement of e-mobility and connected travel via new standards and the use of the V2X ecosystem to make more efficient, accurate, and safer roads for vehicles.

Power Factor Correction: Chokes with High-Current Offerings

Learn more:
itg-electronics.com

Product Release
2024-06-27

ITG Electronics has expanded its portfolio of power factor correction chokes (PFCs) with a set of solutions designed for comparatively high-wattage applications. The company's PFC383637B Series solutions can handle up to 3,300 W and include CCM PFC boost converters with switching frequencies from 60 to 200 kHz. An extension of ITG Electronics' Cubic Design set of power factor correction chokes, PFC383637B Series solutions are suitable for Inductance ranges from 180 – 360 µH at footprints up to 37.5 mm x 36.5 mm with maximum heights of 36 mm. Compared with traditional toroidal-shaped PFC chokes, the PFC383637B Series features a flat wire and square core construction to save space and increase power density. The solutions are up to 50% smaller compared to toroidal-shaped PFC chokes with similar power ratings, and their flat wire technology can reduce DC resistance by as much as 40%, leading to substantially lower copper losses. The PFC383637B Series of PFC chokes is applicable for AC to DC conversion in industrial, equipment and automotive applications. Notably, the high-current output chokes can handle up to 32.4 A with approximately 50% roll off.

electronica 2024: Answers to the major Challenges facing the Automotive Industry

Learn more:
electronica.de

Event News
2024-06-26

From connected mobility to autonomous driving or sustainability – the automotive industry is facing major challenges on its path to digitalization and electrification. The most important companies in the electronics industry will network with the automotive industry and shape the future at the international platform electronica 2024 from November 12 to 15, 2024 in Munich. Despite the discontinuation of subsidies and the lack of infrastructure in some areas, the future belongs to electric drives, and electrification is progressing around the world in all vehicle classes. The software, battery and electronics industries play key roles here. When it comes to batteries, future technologies such as solid-state batteries with a higher energy density will set new standards in terms of charging time, range, fire safety and cost efficiency. In addition, electronica 2024 will focus primarily on the electronic components, technologies and solutions required for the mobility transition. Silicon carbide (SiC) and gallium nitride (GaN) semiconductors with a wide bandgap, for example, are being used more and more in electric drives due to their high efficiency level and energy efficiency, and they are becoming even more powerful. There is a further increase in the switching frequency in inverters, which boosts driving comfort and energy efficiency.

Call for Industry Session Proposals and for Plenary Session Topics and Speakers

Learn more:
apec-conf.org

Event News
2024-06-26

APEC 2025, to be held next year in Atlanta, Georgia, March 16-20, announces the call for submission of proposals for the conference’s popular Industry Session series. The Industry Session component of the conference is intended to encourage content from industry practitioners. Industry Session (IS) speakers are invited to make a presentation only, avoiding the formality of writing the papers for IEEE Xplore publication. IS tracks run in parallel with APEC Technical Sessions and the presentations are included for download by paid APEC attendees. The deadline for submission of proposals is August 23rd. Industry Session proposals may be submitted for an individual speaker presentation or for an overall session proposal. The total time allowed for each presentation is 25 minutes, including 5 minutes for Q and A. To submit a proposal for an Industry Session at APEC, presenters should prepare a 2-3-page proposal that provides a summary of the presentation content and a description of the target audience. Also, a short professional biography of the speaker should be included. If proposing for a full session, a proposal for each of the individual presentations must be submitted. Presentations should have strong technical content and commercial references should be limited and only in support of the core content.

Collaboration between Semiconductor Manufacturer and Power Supply Provider

Learn more:
ti.com

Industry News
2024-06-21

Texas Instruments (TI) announced a long-term collaboration with Delta Electronics, a global power and energy management manufacturer, to create next-generation electric vehicle (EV) onboard charging and power solutions. This work will leverage both companies’ research and development capabilities in power management and power delivery in a joint innovation laboratory in Pingzhen, Taiwan. Together, TI and Delta aim to optimize power density, performance and size to accelerate the realization of safer, faster-charging and more affordable EVs. Phase one for the collaboration focuses on Delta’s development of a lighter-weight, cost-effective 11 kW onboard charger, using TI’s latest C2000™ real-time microcontrollers and TI’s active EMI filter products. The companies are working together using TI’s products to reduce the charger’s size by 30% while achieving up to 95% power conversion efficiency. In phase two, TI and Delta will leverage the latest C2000 real-time MCUs for automotive applications to enable automakers to achieve automotive safety integrity levels (ASILs) up to ASIL D, which represents the strictest automotive safety requirements. Highly integrated automotive isolated gate drivers will further enhance the power density of onboard chargers, while also minimizing overall solution size. In phase three, the two companies will collaborate to develop the next generation of automotive power solutions by using GaN technology.

Acquisition of GaN Manufacturer completed

Learn more:
renesas.com

Industry News
2024-06-20

Renesas Electronics has completed the acquisition of Transphorm, a company which concentrates its activities on GaN power semiconductors, as of June 20, 2024. With the closing of the acquisition now completed, Renesas will immediately start offering GaN-based power products and related reference designs to meet the rising demand for wide bandgap semiconductor products. Investing in the power business is an important part of Renesas’ strategy for achieving sustainable, long-term growth. Other recent moves that Renesas has made to bolster this market segment include: the opening of the Kofu Factory, a dedicated 300-mm wafer fab for power products; ramping up a new SiC production line at the Takasaki Factory; and forging an agreement with Wolfspeed to secure a steady supply of SiC wafers over the next 10 years. With GaN technology now part of Renesas’ portfolio, Renesas is poised to offer more comprehensive power solutions to support the evolving needs of customers across a broad range of applications. On the same day that it completed the acquisition of Transphorm, Renesas rolled out 15 market-ready reference designs that combine the new GaN products with Renesas’ embedded processing, power, connectivity and analog portfolios. These include the designs of Transphorm’s automotive-grade GaN technology integrated for on-board battery chargers as well as 3-in-1 powertrain solutions for EVs. Transphorm was founded in 2007 in Goleta, California.

700 V GaN Power Transistors

Learn more:
infineon.com

Product Release
2024-06-20

Infineon introduces the CoolGaN™ Transistor 700 V G4 product family. The devices are intended for power conversion in the voltage range up to 700 V. In contrast to other GaN products on the market, the input and output figures-of-merit of these transistors are claimed to “provide a 20 percent better performance, resulting in increased efficiency, reduced power losses, and more cost-effective solutions”. The combination of electrical characteristics and packaging allows the usage in applications such as consumer chargers and notebook adapters, data center power supplies, renewable energy inverters, and battery storage. The product series comprises 13 devices with a voltage rating of 700 V and on-resistance range from 20 mΩ to 315 mΩ. The increased granularity in device specification, combined with several industry standard package options including PDFN, TOLL and TOLT allow R _DS resistance and packages to be selected according to application requirements. The devices are “characterized by a fast turn-on and turn-off speed and minimal switching losses”. The on-resistance range enables power systems from 20 W to 25,000 W. In addition, the 700 V E-mode with the industry's highest transient voltage of 850 V increases the reliability of the overall system as it offers greater robustness against anomalies in the user environment such as voltage peaks.

Distributor receives ISO 27001 Certification

Learn more:
digikey.com

Industry News
2024-06-20

DigiKey has added ISO 27001 certification to its data security program. With this certification, the company builds upon its commitment and ability to manage information securely and safely for its customers, suppliers and partners. ISO 27001 is the international industry standard for information security management systems. It assures customers, suppliers and employees of DigiKey's commitment to safeguarding information following industry best practices. In addition to ISO 27001 certification, DigiKey’s information security program offers customers and suppliers access to other robust tools such as multi-factor authentication (MFA) to protect accounts from fraud and unauthorized access.

Redundant analog TMR angle Sensor for safety-relevant Applications

Learn more:
tdk.com

Product Release
2024-06-20

TDK launched the tunnel-magnetoresistance (TMR) angle sensor TAS8240 sensor for automotive and industrial applications. It is available in both compact QFN16 (3 x 3 mm²) and TSSOP16 (5 x 6.4 mm²) packages, offering four redundant analog single-ended SIN/COS outputs. TAS8240 is a redundant TMR-based sensor consisting of 4 x Wheatstone bridges for angle detection at an angle accuracy of ±1.0° in an ambient temperature range of -40 °C to +150 °C. As a 360° angle sensor, the TAS8240 is suited to accurately measure the rotor position of BLDC motors used in safety critical applications such as power steering, brake boosters, or traction motors. The sensor contains four pairs of TMR half bridges and provides four separated SIN/COS outputs by applied magnetic field in the x-y plane. Higher system safety levels up to ASIL D can be achieved while offering higher availability of position information, even in case of a failure of one of the output signals. Depending on system architectures, fail-operational concepts can also be supported by the new sensor. The angle accuracy of the sensor remains stable at different temperatures and over the sensor’s lifetime. It provides redundant rotor position measurement needed in safety-relevant applications like power steering motors.

APEC 2025 Announces Call for Technical Program Paper Digest Submissions

Learn more:
apec-conf.org

Event News
2024-06-20

APEC 2025, to be held in Atlanta, Georgia, from March 16-20, 2025, continues the long-standing tradition of addressing issues of immediate and long-term interest to the practicing power electronics engineer. APEC is now accepting paper digest submissions for the Technical Program. Interested authors wishing to present a paper must submit a digest for consideration by August 2, 2024. Instructions for submissions are available at: https://apec-conf.org/speakers/ts-author-info/
Prospective authors of Technical Program papers are asked to submit a digest explaining the problem that will be addressed by the paper, its major results and how it is different from the closest existing literature. Technical Program Papers presented at APEC must be original material and not have been previously presented or published. The principal criteria used by reviewers in selecting digests for the program will be the usefulness of the work to the practicing power electronics professional. They also value evidence of completed experimental work. Authors should obtain any necessary company and governmental clearance prior to submission of digests. Authors will be notified of the decision of paper acceptance on September 26, 2023. Accepted papers in final form must be submitted and author registration completed by November 3, 2023.

Modern Semiconductor Technology for the Automotive Industry

Learn more:
vishay.com

Industry News
2024-06-19

Vishay Siliconix Itzehoe celebrated the topping-out ceremony for its new 300mm wafer fab, a significant milestone in the comprehensive expansion of the site. Representatives from business, politics and the workforce took part in this important event, which marks progress towards the completion and commissioning of the new production facility. Leif Henningsen, Managing Director of Vishay Siliconix Itzehoe GmbH, and Jeff Webster, Chief Operating Officer of Vishay Intertechnology, thanked all those involved in the construction and employees on behalf of the entire Vishay management for completing the shell of the building on schedule. Julia Carstens, State Secretary in the Schleswig-Holstein Ministry of Economic Affairs, and District Administrator Claudius Teske emphasized the great economic importance of the new factory for the region. It will create 150 new jobs and significantly strengthen the local economy. The heart of the new production facility is a 4,000 m² clean room, which is constantly operated at 22 degrees Celsius and 43% humidity. The fully digital factory is designed for the use of artificial intelligence and state-of-the-art automation technology. This ensures the consistently high quality for which Vishay is renowned. "We are building one of the most modern and efficient factories in the world in our technology segment," emphasizes Jeff Webster. The expansion is part of Vishay Intertechnology's global growth program.

Medium Voltage for Resource Efficiency in PV Plants

Learn more:
ise.fraunhofer.de

Industry News
2024-06-19

Enormous quantities of raw materials are required for the conversion of the energy system, for example, in the form of copper and aluminum cables to connect renewable generators to the grid. One promising approach to save raw materials is to move from the low to the medium-voltage level in renewable energy power plants. The Fraunhofer Institute for Solar Energy Systems ISE sees a huge potential for savings with higher system voltages, especially in large PV power plants. The institute is planning first pilot power plants with this technology and is aiming for a broad market launch together with industry. To kick-off its research topic "Medium Voltage – A Resource-Efficient Way to Interconnect", Fraunhofer ISE presented a medium-voltage PV string inverter and a medium-voltage battery inverter at the Smarter E trade fair in Munich. The move to medium voltage (MV) was first made possible by the development of high voltage silicon carbide (SiC) components with high switching speeds. SiC components up to 3.3 kV are now available on the market. In 2023, Fraunhofer ISE developed the world's first medium-voltage photovoltaic (MS-PV) string inverter in the "MS-LeiKra" project and successfully put it into operation on the grid. The two-stage inverter has an output voltage of 1,500 V_AC at a power of 250 kVA.

SiC Manufacturing Facility planned to be built in Czech Republic

Learn more:
onsemi.com

Industry News
2024-06-19

onsemi announced plans to establish a state-of-the-art, vertically integrated silicon carbide (SiC) manufacturing facility in the Czech Republic. The site would produce the company’s intelligent power semiconductors that are essential for improving the energy efficiency of applications in electric vehicles, renewable energy and AI data centers. onsemi’s plan to expand SiC manufacturing with a multi-year brownfield investment of up to $2 billion (44 billion CZK) is part of the company’s previously disclosed long-term capital expenditure target. This investment would build on the company’s current operations in the Czech Republic, which include silicon crystal growth, silicon and silicon carbide wafer manufacturing (polished and EPI) and a silicon wafer fab. Today, the site can produce more than three million wafers annually, including more than one billion power devices. Upon completion, the operation would contribute annually more than $270 million USD (6 billion CZK) to the country’s GDP. Pending all final regulatory and incentive approvals, this would be one of the largest private sector investments in the Czech Republic’s history and would further contribute to the prosperity and economic dynamism of the Zlín region.

Partnering in EMC Solutions for Aerospace, Defense and Medical Electronics

Learn more:
anritsu.com

Industry News
2024-06-18

Anritsu Company has partnered with Y.I.C. Technologies to develop tools that support companies performing EMC pre-compliance measurements. Anritsu’s Field Master spectrum analyzers compliment the Y.I.C EMScanners and EMViewer application software to provide a fully integrated solution. Design engineers developing advanced electronics face increased EMC challenges from high-speed data circuits and RF components. Efficient design processes necessitate early insight into the EMC performance of the circuits. The Y.I.C scanners and EMViewer software coupled with Anritsu spectrum analyzers provide a 3D heat map of all radiated signals. Circuit layout and shielding materials can be optimized before submitting the product to a certified test house, maximizing the chances of a first-time pass and minimizing repeated submissions.

Power Tradeshow in Shenzhen, China

Learn more:
pcimasia-expo.cn

Event News
2024-06-18

PCIM Asia, the exhibition and conference for power electronics, intelligent motion, renewable energy and energy management, will return to the Shenzhen World Exhibition and Convention Center from 28 – 30 August 2024. More than 80% of available booth space has already been reserved at the event’s 2024 edition, as exhibitors look to highlight their latest advancements across a wide range of market segments including e-mobility, clean energy and energy storage, wide-bandgap (WBG) devices and more. The event will facilitate industry discussion on these high-growth application areas through a series of themed forums, as well as through its industry-leading conference program. At PCIM Asia 2024, participants will find these trends and technologies explored across multiple channels, including on the exhibition floor, through a series of forums and at the PCIM Asia Conference. The event brings together industry stakeholders from throughout the power electronics supply chain – from manufacturers and suppliers to researchers and industry experts – to network, share expertise and discover new products and solutions. Alongside the main exhibition, PCIM Asia hosts a selection of concurrent forums that provide additional opportunities for learning and interaction. The Exhibitor Forums provide a platform for exhibitors to promote their latest technologies, while the Industry Forums feature invited speakers, including researchers and subject matter experts, who discuss developments, innovations and challenges in the power electronics field across selected application areas. PCIM Asia is jointly organised by Guangzhou Guangya Messe Frankfurt Co Ltd and Mesago Messe Frankfurt GmbH.

High-density Power Modules for Deep-Sea ROVs

Learn more:
vicorpower.com

Industry News
2024-06-18

Historically, commercial divers have taken great risks to inspect oil and gas pipelines, high-voltage electrical cables, wind turbines and other critical infrastructure deep undersea. Saab has eliminated that risk bringing deep-sea exploration expertise to commercial underwater applications. With a mission to keep people and society safe, the Seaeye range of ROVs has been developed with more agile and modular systems designs. Saab UK’s Seaeye systems are capable of performing a wide range of tasks from observation and inspection to more complex functions like underwater maintenance. This evolution has culminated in the development of a system which is claimed to be “the world's most advanced all-electric work-class ROV (eWROV)”, which combines versatility and maneuverability. Unlike traditional hydraulic ROVs, the eWROV eliminates the need for large amounts of hydraulic fluid, thereby mitigating environmental risks. Critical specifications for the eWROV’s power converter are size, mass and thermal dissipation, given that the electronic systems are housed in sealed enclosures where space is at a premium and conventional convection cooling is not possible. To meet these requirements, Saab chose Vicor power modules for their high density and efficiency. These modules enable efficient power distribution to various eWROV subsystems such as thrusters, manipulators and onboard electronics. The use of Vicor power modules allows Saab to customize Seaeye subsystems according to specific industry-standard 24V and 48V levels required by onboard computers, sensors, video cameras, lights and navigation equipment.

SIC Research Cooperation between Industry and University

Learn more:
lee.tf.fau.de

Industry News
2024-06-14

Sanan Semiconductor has entered into a Research Partnership with the Institute for Power Electronics (LEE) at FAU Erlangen-Nürnberg university. This research will focus on advanced innovation in power electronic systems focusing on SiC technology. "Sanan Semiconductor is a vertically integrated SiC supplier with inhouse development and manufacturing of SiC substrates, epitaxial wafers, Diode/MOSFET dies and packaged products. This partnership with one of Germany's leading research institutes for SiC puts Sanan Semiconductor in a strong position", says Mr. Tony Chiang, CEO of Sanan Semiconductor. Dr. Ming-Che Kao, General Manager of Sanan Europe comments: "Europe is a key market for us, and this partnership aims at strengthening our system innovation." Dr. Ajay Poonjal Pai, Head of WBG Innovation, adds: "Compared to traditional Silicon-based technologies, SiC offers significant efficiency and power density improvements in various applications. Despite the increasing adoption of SiC in power electronic applications, several system-level barriers still inhibit the full potential of SiC. This collaboration is a step towards overcoming these barriers." Prof. Martin März, Director of the institute says, "We are pleased to have a strong partner in Sanan, whose innovative SiC devices will enable us to advance into new performance regions."

Rugged 650 V and 1200 V IGBTs

Learn more:
ween-semi.com

Product Release
2024-06-12

WeEn Semiconductors has introduced IGBTs with voltage ratings of 650 V and 1200 V, which incorporate a fast recovery anti-parallel diode and show “extremely low leakage currents and exceptional conduction and switching characteristics at both high and low junction temperatures”, the company says. Based on fine trench gate field-stop (FS) technology, the IGBTs are said to provide a more uniform electric field within the chip, support higher breakdown voltages and offer improved dynamic control. WeEn claims that the devices offer “optimum trade-off between conduction and switching losses, as well as an enhanced EMI design”. The IGBTs offer ratings of 650V/75A, 1200V/40A and 1200V/75A and are supplied in TO247 or TO247-4L packages depending on the selected device. All of the devices will operate with a maximum junction temperature (T_j) of 175 °C and have undergone high-voltage H3TRB (high-humidity, high-temperature and high-voltage reverse bias) and 100%-biased HTRB (high-temperature reverse bias) tests up to this maximum. Target applications include solar inverters, motor control systems, uninterruptible power supplies (UPS) and welding. A positive temperature coefficient simplifies parallel operation in applications where higher performance is required, while options for bare die, discrete and module product variants provide flexibility for a wide variety of target designs.

BLDC Motor Hardware-Software Combo

Learn more:
power.com

Product Release
2024-06-11

Power Integrations complemented its hardware-software bundle for brushless DC motors (BLDC) with BridgeSwitch™-2, a high-voltage integrated half-bridge (IHB) motor-driver IC family targeting applications up to 1 HP (746 W). The ICs, which feature high- and low-side drivers and advanced FREDFETs with integrated lossless current sensing, deliver inverter efficiency of up to 99 percent. The IHB architecture eliminates hot spots, which increases design flexibility and reliability, slashes component count and saves PCB area. BridgeSwitch-2 is supported by Power Integrations’ MotorXpert™ software suite which includes single-phase trapezoidal control and three-phase sensor-less Field Oriented Control (FOC) modules, speeding inverter development. BridgeSwitch-2 ICs handle operational exceptions in hardware, which permits the use of IEC 60730 Class A safety software, reducing certification time by months. Quiescent BLDC inverters can be ordered into sleep-mode, reducing driver power consumption to less than 10 mW; this leaves more power available under regulated standby power limits to be allocated for loads such as network access and monitoring. The IHB architecture reduces component count by 50 percent and PCB space by 30 percent over discrete designs by eliminating shunt resistors and associated signal conditioning circuits. Shunt losses are also eliminated, improving efficiency. Precise motor control is achieved with the built-in real-time reporting of phase current (IPH) information. Accurate turn-on/off gate drive and a soft-body diode result in a typical EMI profile 10 dB lower than existing drivers, so a smaller EMI filter can be selected.

2-in-1 SiC Molded Module

Learn more:
rohm.com

Product Release
2024-06-11

Rohm Semiconductor introduced four models as part of the TRCDRIVE pack™ series with 2-in-1 SiC molded modules (two 750V-rated, BSTxxxD08P4A1x4; two 1200V-rated, BSTxxxD12P4A1x1) optimized for electric vehicle traction inverters. TRCDRIVE pack supports up to 300 kW and features high power density and a unique terminal configuration, helping solve the key challenges of traction inverters in terms of miniaturization, higher efficiency, and fewer person-hours. A trademark brand for ROHM SiC molded type modules developed specifically for traction inverter drive applications, TRCDRIVE pack reduces size by utilizing a unique structure that maximizes heat dissipation area. In addition, ROHM’s 4th generation SiC MOSFETs with low ON resistance are built in, resulting in an “industry-leading power density” 1.5 times higher than that of general SiC molded modules, while contributing to the miniaturization of xEV inverters. The modules are also equipped with control signal terminals using press-fit pins, enabling easy connection by simply pushing the gate driver board from the top, considerably reducing installation time. In addition, low inductance (5.7 nH) is achieved by maximizing the current path and utilizing a two-layer bus-bar structure for the main wiring, contributing to lower losses during switching. Despite developing modules, Rohm has established a mass production system similar to discrete products, making it possible to increase production capacity by 30 times compared to conventional SiC case-type modules.

16/24-Channel Automotive LED Driver

Learn more:
novosns.com

Product Release
2024-06-11

Novosense Microelectronics has developed the 16/24-channel driver IC NSL21916/24 for automotive LED applications. It offers a variety of driving options for up to 16/24 channels and features flexible dimming and control capabilities. Target applications include rear lights, exterior lights and general automotive interior and body lighting. At PCIM 2024, NOVOSENSE provided a live demonstration of the IC in a rear lighting application. Qualified to AEC-Q100 Grade 1(T_j from -40 °C to 150 °C), the NSL21916/24 supports individual control and high-side currents of up to 100 mA for each channel. A 2-bit global and 6-bit individual current setting combined with 12-bit independent PWM dimming and phase shift PWM dimming capabilities enable LED brightness control. On-board programmable EEPROM allows the same device to be configured for different applications, while a built-in UART/ digital interface supports several control and diagnostic functions. Addition of a standard CAN physical layer allows this interface to be used for long-distance, off-board communications without any impact on EMC. The NSL21916/24 is supplied in a HTSSOP38 package, has a dropout voltage of 600 mV max. (@ 50 mA) and provides multiple regulation with LED open-circuit, LED short-to-ground and single LED short-circuit diagnostics.

“Industry’s first GaN IPM”

Learn more:
ti.com

Product Release
2024-06-11

Texas Instruments introduced “the industry’s first 650 V three-phase GaN IPM for 250 W motor drive applications”. The GaN IPM addresses many of the design and performance compromises engineers typically face when designing major home appliances and heating, ventilation and air-conditioning (HVAC) systems. The DRV7308 GaN IPM, which is integrated in a 12mm-by-12mm package, enables more than 99% inverter efficiency, optimized acoustic performance, reduced solution size and lower system costs. In addition, the DRV7308 is claimed to achieve “industry-low dead time and low propagation delay, both less than 200ns, enabling higher pulse-width modulation (PWM) switching frequencies that reduce audible noise and system vibration”. This also reduces motor heating, which can improve reliability and extend the lifetime of the system.

1700V SiC Schottky Discretes and Dual Diode Modules

Learn more:
semiq.com

Product Release
2024-06-11

Semiq has announced the addition of 1700 V SiC Schottky discrete diodes and dual diode packs to its QSiC™ product line. The GP3D050B170X (bare die) and GP3D050B170B (TO-247-2L package) discrete diode is rated for respective maximum forward currents of 110 A and 151 A. Device design supports easy parallel configurations, enhancing flexibility and scalability for various power applications. The new devices meet the size and power demands of a wide range of demanding applications including switched-mode power supplies, uninterruptible power supplies (UPS), induction heaters, welding equipment, DC/DC converters, solar inverters and electric vehicle (EV) charging stations. Featuring zero reverse recovery current and near-zero switching loss, Semiq’s 1700 V SiC Schottky diode technologies offer enhanced thermal management that reduces the need for cooling. As a result, engineers can implement highly efficient, high-performance designs that minimize system heat dissipation, allow the use of smaller heatsinks and lead to cost and space savings. All of the new products support fast switching across operating junction temperatures (T_j) of -55 °C to 175 °C.

One Channel Power Supply for Current Transducers

Learn more:
danisense.com

Product Release
2024-06-11

Danisense has launched a compact size one channel power supply suitable for its DT, DS, DN and DM series of current transducers. The DSSIU-1 power supply is specified with dimensions of 130 mm x 116 mm x 56 mm, +/- 15 V supply voltage and 1.2 A DCCT nominal current. The position of DSUB and banana connectors on the front side facilitates the set-up. The DSSIU-1 power supply already features TEDS functionality for the next generation of current transducers allowing automatic set-up with compatible instruments.

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World's first 300 mm Power Gallium Nitride (GaN) Technology	Infineon Technologies has succeeded in developing ...	12090	Industry News	World's first 300 mm Power Gallium Nitride (GaN) Technology	Infineon Technologies has succeeded in developing the world's first 300 mm power gallium nitride (GaN) wafer technology, accomplished in an existing and scalable high-volume manufacturing environment - a "breakthrough" which is said to "help substantially drive the market for GaN-based power semiconductors". Chip production on 300 mm wafers offers 2.3 times more chips per wafer than on 200 mm wafers. "The technological breakthrough will be an industry game-changer and enable us to unlock the full potential of gallium nitride", Jochen Hanebeck, CEO of Infineon Technologies, says. "Infineon is mastering all three relevant materials: silicon, silicon carbide and gallium nitride. Nearly one year after the acquisition of GaN Systems, we are demonstrating again that we are determined to be a leader in the fast-growing GaN market." Infineon has succeeded in manufacturing 300 mm GaN wafers on an integrated pilot line in existing 300 mm silicon production in its power fab in Villach/Austria. The company intends to "further scale GaN capacity aligned with market needs". Infineon claims that "300 mm GaN manufacturing will put Infineon in a position to shape the growing GaN market which is estimated to reach several billion US-Dollars by the end of the decade" and that "fully scaled 300 mm GaN production will contribute to GaN cost parity with silicon on R <sub>DS(on)</sub> level, which means cost parity for comparable Si and GaN products. The semiconductor manufacturer will present the first 300 mm GaN wafers to the public at the electronica trade show in November 2024 in Munich.	11.09.2024 06:00:00	Sep	news_2024-09-15_1.jpg	\images\news_2024-09-15_1.jpg	https://www.infineon.com/cms/en/about-infineon/press/press-releases/2024/INFXX202409-142.html	infineon.com
2" x 4" 250 W Medical and Industrial Power Supply Series	TDK announces additional output voltage models to ...	12105	Product Release	2" x 4" 250 W Medical and Industrial Power Supply Series	TDK announces additional output voltage models to the 250 W rated TDK-Lambda brand CUS250M series of power supplies in the industry standard 2" x 4" footprint. The full range now covers 12 V, 15 V, 18 V, 24 V, 28 V, 36 V and 48 V and is certified to the IEC 62368-1 and IEC 60601-1 safety standards for industrial and medical applications. This includes both Class I and Class II (no earth ground required) installations. The CUS250M has mechanical configurations that enable convection and/or conduction cooling through the product's baseplate to provide silent cooling. Applications include medical, home healthcare, dental, test, measurement, broadcast, professional audio and industrial equipment. The output can be adjusted to accommodate non-standard voltages, either by the factory or using the on-board potentiometer. The CUS250M operates across an 85 to 264 V<sub>AC</sub> input and has a earth leakage current of less than 150 μA - including all tolerances. The touch current is <10 μA (Class I) and <70 μA (Class II). In ambient temperatures of -20 °C to +45 °C the CUS250M can deliver up to 250 W conduction cooled without external air. With appropriate derating, operation at up to +80 °C is also possible. The efficiency is up to 94%, and the average efficiency, measured at 25, 50, 75 and 100% loads, is greater than 91%, while offload power consumption is less than 0.5 W when the output is inhibited.	09.09.2024 11:30:00	Sep	news_2024-09-15_16.jpg	\images\news_2024-09-15_16.jpg	https://product.tdk.com/system/files/dam/doc/product/power/switching-power/ac-dc-converter/catalog/cus250m_e.pdf	lambda.tdk.com
40 V MOSFETs in PDFN 33 Packages	Magnachip Semiconductor released four 40V MXT MV M...	12103	Product Release	40 V MOSFETs in PDFN 33 Packages	Magnachip Semiconductor released four 40V MXT MV MOSFETs designed in Power Dual Flat No-Lead (PDFN) 33 packages for automotive applications. This package reduces the area by more than 60% and the weight by approximately 75% as compared to 40 V MOSFET products packaged in PDFN56. Among these products, three models - AMDV040N029LVRH, AMDV040N036LVRH, and AMDV040N042LVRH - are distinguished by their gate threshold voltage of 1.8 V. The gate threshold voltage determines the point at which the MOSFET switches from an off-state to an on-state. A lower threshold voltage reduces the energy required to operate the MOSFET, thereby decreasing the overall power consumption of the system. For example, the AMDV040N029LVRH provides a typical/maximum R<sub>DS(on)</sub> of 3.8 m&ohm;/5.0 m&ohm; at V<sub>GS</sub> = 4.5 V and of 2.5 m&ohm; / 2.9 m&ohm; at V<sub>GS</sub> = 10 V. The typical gate charge Q<sub>g</sub> at V<sub>GS</sub> = 10 V is specified with 30 nC.	09.09.2024 09:30:00	Sep	news_2024-09-15_14.jpg	\images\news_2024-09-15_14.jpg	https://www.magnachip.com/automotive-solutions/	magnachip.com
Executive Vice President for German Electronics Specialist	With effect from 1 August 2024 Thomas Garz has bee...	12092	People	Executive Vice President for German Electronics Specialist	With effect from 1 August 2024 Thomas Garz has been appointed Executive Vice President for the Würth Elektronik eiSos Group. The 37-year-old has been with the Würth Group since 2006. Most recently, he was Senior Vice President of the Würth Line Craft, the core business of the Würth Group, for Scandinavia and additionally responsible for International Systems of the Würth Line. The organizational structure of the Würth Elektronik eiSos Group will remain unchanged as a result of this appointment. Before taking up his position as the Senior Vice President of the Würth Line Craft for Scandinavia, Thomas Garz held various positions, including sales and shop manager, assistant to the management and auditor for Würth.	06.09.2024 07:00:00	Sep	news_2024-09-15_3.jpg	\images\news_2024-09-15_3.jpg	https://www.we-online.com/en/news-center/press?instance_ID=5506&d=thomas-garz	we-online.com
Long-Term Supply Agreement for SiC Power Devices signed	ROHM and United Automotive Electronic Systems (UAE...	12095	Industry News	Long-Term Supply Agreement for SiC Power Devices signed	ROHM and United Automotive Electronic Systems (UAES), a Tier 1 automotive supplier in China, have recently entered into a long-term supply agreement for SiC power devices. Already since 2015, ROHM and UAES have been collaborating and carrying out detailed technical exchanges on automotive applications utilizing SiC power devices. This partnership deepened in 2020 with the establishment of the SiC Joint Research Institute at the UAES headquarters in Shanghai, China. And in 2021 ROHM's advanced SiC power devices and peripheral components were highly evaluated by UAES, resulting in ROHM being selected as a preferred supplier. The close long-standing technical partnership has led to the production and adoption of numerous automotive products equipped with ROHM SiCs, such as onboard chargers and inverters for electric vehicles. This long-term supply agreement is said to ensure UAES sufficient access to SiC power devices to meet the growing demand for SiC-based inverter modules. Going forward, both companies will deepen their collaboration, contributing to technological innovation in the automotive sector by accelerating the development of SiC power solutions for EVs.	05.09.2024 08:30:00	Sep	news_2024-09-15_6.jpg	\images\news_2024-09-15_6.jpg	https://www.rohm.com/news-detail?news-title=2024-09-05_news&defaultGroupId=false	rohm.com
Acquisition of Austrian Power Supply Company	RECOM has enhanced its portfolio of products and c...	12094	Industry News	Acquisition of Austrian Power Supply Company	RECOM has enhanced its portfolio of products and capabilities by acquiring Leco. Like RECOM Leco is based in Austria, and according to RECOM Leco "is one of only a few companies that specialize in design and manufacture of full custom, high-end power solutions". By integrating LECO's engineering expertise and high-end power conversion products into its portfolio, RECOM enhances its market position and delivers more, comprehensive, high-end power supply solutions to its global customer base. "We are proud to have established this partnership with LECO. This provides us with an opportunity to expand our engineering capabilities and product portfolio for our customers, especially in industrial, automation & supply chain end-markets, as well as leveraging our global footprint for the sale of LECO high-end products.", Karsten Bier, CEO and Shareholder, RECOM.	05.09.2024 08:00:00	Sep	news_2024-09-15_5.jpg	\images\news_2024-09-15_5.jpg	https://recom-power.com/en/company/newsroom/rec-n-recom-expands-expertise-in-high-end-power-product-design-and-manufacture-with-the-acquisition-of-leco-385.html?7	recom-power.com
Gen-3 Fast SiC to now qualified according to AEC Q101	Navitas Semiconductor announced several third-gene...	12109	Product Release	Gen-3 Fast SiC to now qualified according to AEC Q101	Navitas Semiconductor announced several third-generation automotive-qualified SiC MOSFETs in D2PAK-7L (TO-263-7) and TOLL (TO-Leadless) surface-mount (SMT) packages. Navitas' proprietary 'trench-assisted planar' technology is claimed to provide "world-leading performance over temperature" and to deliver high-speed, cool-running operation for electric vehicle (EV) charging, traction, and DC-DC conversion. With case temperatures up to 25°C lower than conventional devices, Gen-3 Fast SiC is said to offer an operating life up to 3x longer than alternative SiC products, for high-stress EV environments. Gen-3 Fast MOSFETs are optimized for fast switching speeds at high efficiencies, and support increased power density in EV applications such as AC compressors, cabin heaters, DC-DC converters, and on-board chargers (OBCs). Navitas' EV Design Center has demonstrated already OBC system solutions up to 22 kW with 3.5 kW/l power density, and over 95.5% efficiency. Both 650 and 1,200 V ranges are now AEC Q101-qualified in the traditional SMT D2PAK-7L (TO-263-7) package. For 400 V EVs, the 650 V-rated, surface-mount TOLL package offers a 9% reduction in junction-to-case thermal resistance (R<sub>TH,J-C</sub>), 30% smaller PCB footprint, 50% lower height, and 60% smaller size than the D2PAK-7L. This enables very high-power density solutions, while minimal package inductance of only 2 nH enables fast-switching performance and adequate dynamic package losses. 400 V-rated EV battery architectures are served by the 650 V Gen-3 Fast MOSFETs featuring R<sub>DS(ON)</sub> ratings from 20 to 55 mΩ. The 1,200 V ranges from 18 to 135 mΩ and is optimized for 800 V systems.	04.09.2024 15:30:00	Sep	news_2024-09-15_20.jpg	\images\news_2024-09-15_20.jpg	https://navitassemi.com/sic-power-fets-and-diodes/	navitassemi.com
Dual 5 A Low-Side MOSFET Gate Drivers for High-Frequency Applications	Littlefuse launched the IX4341 and IX4342 dual 5 A...	12102	Product Release	Dual 5 A Low-Side MOSFET Gate Drivers for High-Frequency Applications	Littlefuse launched the IX4341 and IX4342 dual 5 A low-side MOSFET gate drivers, which complete the existing IX434x driver series by adding the remaining two logic input versions. The IX434x series now consists of dual non-inverting, dual inverting, and non-inverting and inverting input versions. The IX4341 and IX4342 drivers' propagation delay times of 16 ns and rise and fall times of 7 ns make them suited for high-frequency applications. Additionally, for higher current requirements, electronics designers can parallel the two channels of the IX4340 and IX4341 devices to form a single 10 A driver. Another feature of the IX434x drivers is their compatibility with TTL and CMOS logic inputs, enabling direct interfacing with most controllers. Furthermore, each output has an independent ENABLE function and under-voltage lockout circuitry (UVLO). In case of eventual insufficient supply voltage, the gate driver output is asserted low, turning the external power device off. The devices find applications in various markets, including general industrial and electrical equipment, appliances, building solutions, data centers, energy storage, and renewable energy – whenever MOSFETs in industrial applications such as switch-mode power supplies, DC-DC converters, motor controllers and power converters need to be driven. In terms of packaging a standard 8-pin SOIC, thermally enhanced 8-pin SOIC, and 3×3 mm<sup>2</sup> MSOP packages are available.	04.09.2024 08:30:00	Sep	news_2024-09-15_13.jpg	\images\news_2024-09-15_13.jpg	https://www.littelfuse.com/products/integrated-circuits/gate-driver-ics/igbt-and-mosfet-driver-ics/low-side-gate-driver-ics.aspx	littelfuse.com
Evaluation Board for 240 W PD 3.1 Charger with Efficiency >95 %	Eggtronic has unveiled an evaluation board (EVB) t...	12101	Product Release	Evaluation Board for 240 W PD 3.1 Charger with Efficiency >95 %	Eggtronic has unveiled an evaluation board (EVB) that allows engineers to speed the development and significantly reduce the size and cost of 240 W power delivery (PD) 3.1 applications while supporting ultra-fast charging through high efficiency. The SmartEgg 240W PD 3.1 EVB has a peak efficiency above 95% and operates at over 90% efficiency from light load to full load. A single stage that combines zero voltage switching (ZVS) power factor correction (PFC) and quasi-forward isolated regulation significantly reduces bill of materials (BOM) and size of key components (including storage capacitors and magnetics) compared to traditional PFC+LLC and PFC+Asymmetric Half-Bridge (AHB) architectures. The result is a platform that delivers light-load energy savings of up to 50%, achieves a power density of 1.34W/cm3 (21.9W/in<sup>3</sup>) to support extremely compact charger designs and, most importantly, reduces BOM cost. Based on Eggtronic's SmartEgg AC/DC architecture, the EVB incorporates proprietary mixed-signal, low-power EPIC (Eggtronic Power Integrated Controller) 2.0 IC controllers and features built-in protection against overpower, overvoltage, overtemperature, short circuits and brownouts. EPIC, which is based on a 32-bit RISC-V core and a set of high-performance digital and analog peripherals, incorporates an internal structure that supports multiple independent control loops of both standard and proprietary power conversion architectures. Supplied as a dual-port module, the SmartEgg 240W PD 3.1 EVB can be directly modified for any number of charging ports thanks to the flexibility of the EPIC 2.0 controller, which supports many slave buck converters, each acting as a standalone port.	04.09.2024 07:30:00	Sep	news_2024-09-15_12.jpg	\images\news_2024-09-15_12.jpg	https://www.eggtronic.com/products-services/integrated-circuits/epic2acsxx/	eggtronic.com
electronica 2024: The electronics Trade Show turns 60	electronica celebrated its premiere in 1964 as the...	12093	Event News	electronica 2024: The electronics Trade Show turns 60	electronica celebrated its premiere in 1964 as the first trade fair in Germany devoted solely to electronic components. In the meantime, it has been accompanying innovations in the international electronics industry for six decades, providing a market overview of its latest products, technologies and solutions every two years. In 2024, this trade fair for electronics will celebrate its 60th anniversary from November 12 to 15, occupying all 18 exhibition halls for the first time ever (together with SEMICON Europe in two halls). The focus will be on the future vision of an all electric society. Already at the first edition in Munich in October 1964 a total of 407 companies from 16 countries exhibited on an area of 4,100 square meters, and around 14,000 trade visitors came to visit on the eight days of the fair. Already now the trade show organizer states that the 2024 edition of electronica "will be the biggest electronica of all time".	04.09.2024 07:30:00	Sep	news_2024-09-15_4.jpg	\images\news_2024-09-15_4.jpg	https://electronica.de/en/trade-fair/journalists/press-releases/detail/the-electronics-industry-turns-60.html?utm_campaign=ELE_2024_P_PMI_08_EN_MAN%20-%20Batch&utm_medium=mail_mmg&utm_source=eloqua&utm_content=ELE_2024_P_PMI_08_EN_MAN&utm_marketing_tactic=service	electronica.de
PCIM Asia 2024 grew significantly	PCIM Asia 2024, an international platform for comm...	12091	Event News	PCIM Asia 2024 grew significantly	PCIM Asia 2024, an international platform for communication and exchange in power electronics, intelligent motion, renewable energy and energy management, successfully concluded late August at the Shenzhen World Exhibition and Convention Center in China. Setting new records across nearly all metrics, the 2024 edition was the largest and most comprehensive iteration of the event to date. Floor space grew by 8,000 m2 (+67 %) to a total of 20,000 m<sup>2</sup>. The number of visitors (from 41 countries) increased 20 % over the 2023 edition to a total of 18,346, while the number of exhibitors (from 13 countries and regions) increased 28 % over the 2023 edition to a total of 232. To promote further dialogue and collaboration, the exhibition presented a series of industry forums, exhibitor forums and round-table discussions, covering topics ranging from wide-bandgap semiconductors and e-mobility to eVTOL development. At these sessions, representatives from several companies and researchers shared insights on development trends, new market applications and cutting-edge research. Alongside the exhibition, the PCIM Asia Conference 2024 once again featured technical advancements and applications in power electronics. 981 conference visitors listened to 3 keynote speeches, 12 oral sessions and 6 poster sessions as well as to 104 presentations. PCIM Asia is jointly organised by Guangzhou Guangya Messe Frankfurt Co Ltd and Mesago Messe Frankfurt GmbH. The next edition will take place from 14 – 16 August 2025 at the Shanghai New International Expo Centre (SNIEC) in Shanghai, China.	04.09.2024 06:30:00	Sep	news_2024-09-15_2.jpg	\images\news_2024-09-15_2.jpg	https://pcimasia-expo.cn.messefrankfurt.com/shenzhen/en/press/press-releases/2024/PCIM24_FR.html	pcimasia-expo.cn
Power Factor Correction Chokes für up to 1000 V_DC	ITG Electronics now offers a range of power factor...	12108	Product Release	Power Factor Correction Chokes für up to 1000 V<sub>DC</sub>	ITG Electronics now offers a range of power factor correction chokes (PFCs) for particularly high-voltage applications. Capable of accommodating up to 1,000 V<sub>DC</sub> and 1,500 W, the company's PFC333232DH Series includes CCM PFC boost converters with switching frequencies from 100-200 kHz. The series also can be adopted as a straightforward boosted inductor. The solutions are viable for inductance ranges from 82-1600 μH at a maximum length/width/height of 33 mm x 32 mm x 31.6 mm. Compared with traditional toroidal-shaped PFC chokes, the PFC333232DH Series features a flat wire and square core construction to save space and increase power density. The solutions are up to 50% smaller compared with toroidal-shaped PFC chokes with similar power ratings, and their flat wire technology can reduce DC resistance by as much as 40%, leading to substantially lower copper losses. The PFC chokes are applicable for AC/DC conversion in industrial, equipment and automotive applications. The high-current output chokes can handle up to 41.9 A with approximately 50% roll off.	03.09.2024 14:30:00	Sep	news_2024-09-15_19.jpg	\images\news_2024-09-15_19.jpg	https://itg-electronics.com/en/series/920	itg-electronics.com
Medically approved 4:1 input DC/DC Converters	XP Power has introduced the JMR03/10/20 series of ...	12104	Product Release	Medically approved 4:1 input DC/DC Converters	XP Power has introduced the JMR03/10/20 series of 3 W, 10 W, and 20 W medically approved DC/DC converters that offer a 4:1 input ratio. These devices provide 2 x MOPP (Means of Patient Protection) with 2 μA leakage current, ensuring integration into both BF (Body Floating) and CF (Cardiac Floating) rated healthcare applications. Their no-load input idle current is specified down to 4 mA, depending on the model. These fully encapsulated products are suited for use in applications like medical imaging, patient monitoring, patient treatment, dentistry, and respiratory care equipment. Models within the JMR03 (3.5 W), JMR10 (10 W), and JMR20 (20 W) series are available with output voltages of 5 V, 12 V, 15 V ±12 V or ±15 V; the JMR10/20 series offer an additional ±5 V output. The dual-output models can also provide a single 10 V, 24 V or 30 V output. The single output models can also be adjusted by -10% to +10% of the output voltage for non-standard requirements. All output power and voltage combinations can operate from either a 24 V (9.0 - 36.0 V) or 48 V (18.0 - 75.0 V) input, with the JMR03/10 series additionally operating from a 12 V (4.5 – 18 V) input. The operating temperature range for the JMR03/10/20 series is from -40 °C to +100 °C. All models are protected against short circuit and overload conditions, feature a remote on/off function, and have an input-to-output isolation voltage of 5 kV<sub>AC</sub>. Safety certification includes UL/CSA/IEC/EN 60601-1 and UL62368-1 with CE and UKCA markings for the low voltage and RoHS Directives.	03.09.2024 10:30:00	Sep	news_2024-09-15_15.jpg	\images\news_2024-09-15_15.jpg	https://www.xppower.com/product/JMR10-Series	xppower.com
Current Sensors achieve ASIL C(D) Compliance	Melexis reaches ASIL C safety compliance with its ...	12098	Industry News	Current Sensors achieve ASIL C(D) Compliance	Melexis reaches ASIL C safety compliance with its smart IVT (current, voltage, temperature) sensing platform. The Hall-effect MLX91230 and Shunt interface MLX91231 simplify the achievement of ISO 26262 ASIL C(D) architecture for critical vehicle functions such as battery management systems (BMS), smart pyrofuses, and high-voltage charging systems. Both devices integrate a wide range of smart functionality, including the microcontroller unit (MCU) with on-board flash memory that supports custom software deployment and extensive compensation of system imperfections. The diagnosable OCD allows for direct input to the Pyro-Fuse driver, enabling the simple deployment of smart pyrofuses with fewer components. Furthermore, the ASIL C safety level applies to the current sensing function and OCD, as well as the additional temperature and voltage measurement channels. The selectable LIN or UART output enables integration with 12V battery applications and power distribution modules, as well as direct communication with BMS or UART-over-CAN.	29.08.2024 10:00:00	Aug	news_2024-09-15_9.jpg	\images\news_2024-09-15_9.jpg	https://www.melexis.com/en/news/2024/29aug2024-melexis-achieves-asil-c-with-its-ivt-current-sensors	melexis.com
240 V/1 kA Bidirectional Power TVS Diode in a Surface Mount Package	Bourns has introduced "the industry's first 240 V/...	12100	Product Release	240 V/1 kA Bidirectional Power TVS Diode in a Surface Mount Package	Bourns has introduced "the industry's first 240 V/1 kA Bidirectional Power TVS (PTVS) Diode that offers the highest power density available in a surface mount package". The PTVS1-240C-M PTVS Diode offers 1 kA surge handling capability under 8/20 µs test conditions and is thus suited for a broad variety of systems that employ high-voltage DC bus architectures. These systems commonly experience high current switching transients and dynamic load behaviors where snubbing is needed, or protection of bus-powered subsystems is required. The PTVS1-240C-M PTVS Diode is a low-leakage device consuming 10 μA in standby while delivering a maximum breakdown voltage of 295 V, repetitive standoff voltage of 240 V and precise clamping voltage of 340 V. Under 10/350 μs conditions, this device is rated for 200 A peak current, and its voltage breakdown sensitivity over temperature shows a linearity of 0.1 %/°C. The company reports that the "surface mount package offers a significant reduced PCB footprint and lower inductance design advantages compared to traditional through-hole mounted Power TVS Diodes". Applications that can benefit from the features and capabilities of the Model PTVS1-240C-M include industrial power systems, motor controllers and inverters, solar inverters, battery energy storage systems, and factory automation. The device is UL497B certified and meets IEC 61000-4-5 standard specifications. It is also RoHS compliant and halogen free.	29.08.2024 06:30:00	Aug	news_2024-09-15_11.jpg	\images\news_2024-09-15_11.jpg	https://www.bourns.com/docs/product-datasheets/PTVS1-240C-M.pdf	bourns.com
European GaN Company establishes Asian Subsidiary	Wise-integration, a French company active in digit...	12099	Industry News	European GaN Company establishes Asian Subsidiary	Wise-integration, a French company active in digital control of gallium nitride ICs for power supplies, announced the launch of its subsidiary Wise-integration Ltd., based in Hong Kong to help Chinese customers achieve their power/performance/cost goals and accelerate its growing business in China. In addition to serving as the company's financial hub for regional transactions and boosting its presence generally in the Asian market, the subsidiary will enable the company to take advantage of business opportunities in China, a large and receptive market for its GaN-based power electronics solutions with digital control. In the past two years, Wise-integration announced partnerships with companies in South Korea and Taiwan to help bring its technologies to those markets. The company's product markets include consumer electronics and industrial applications like robotics, as well as data centers and electric vehicles. All of its solutions address the increasing demands for miniaturization, electrification and efficient power management. Led by James Ho, as China business development director, Wise-integration Ltd. is based in HKSTP (the Hong Kong Science and Technology Park).	28.08.2024 10:30:00	Aug	news_2024-09-15_10.jpg	\images\news_2024-09-15_10.jpg	https://wise-integration.com/wise-integration-creates-subsidiary-to-manage-asian-business-development-and-spur-growth-in-china/	wise-integration.com
Intelligent Power Device for BLDC Motor Drives	Toshiba Electronics has launched a small intellige...	12107	Product Release	Intelligent Power Device for BLDC Motor Drives	Toshiba Electronics has launched a small intelligent power device (IPD) for space-constrained brushless DC (BLDC) motor drive applications such as air conditioners, air purifiers, and pumps. The IPD, TPD4165K, has an increased maximum output current of 3 A, compared to the 2 A rating of Toshiba's existing products like TPD4163K, or TPD4164K. The device is suitable for sine-wave drive. As power supply voltage may fluctuate significantly in some regions where the IP could be used, the absolute maximum voltage rating (V<sub>BB</sub>) has been increased to 600 V to enhance long-term reliability. This represents a 20% increase over Toshiba's previous products. TPD4165K is housed in a through-hole HDIP30 package with dimensions of 32.8 mm x 13.5 mm x 3.525 mm. This has a 21% smaller footprint than the DIP26 package used for many of Toshiba's previous products. It supports either three-shunt or single-shunt resistor circuit for current sensing. Safety features like over-current, under-voltage and thermal shutdown are already implented. Additionally, an external signal can be applied to the SD pin to control the behavior of the output stage. The DIAG output pin provides the status of the safety conditions. Designers can freely access a reference design for a sensorless BLDC motor drive circuit based upon the new TPD4165K and Toshiba's TMPM374FWUG microcontroller with vector control engine capability. The reference design data can be downloaded from Toshiba's website.	27.08.2024 13:30:00	Aug	news_2024-09-15_18.jpg	\images\news_2024-09-15_18.jpg	https://toshiba.semicon-storage.com/eu/semiconductor/product/intelligent-power-ics/detail.TPD4165K.html	toshiba.semicon-storage.com
Absorber Patch Attenuates like a Shielding Cabinet	Würth Elektronik has launched its hybrid WE-EMIP E...	12106	Product Release	Absorber Patch Attenuates like a Shielding Cabinet	Würth Elektronik has launched its hybrid WE-EMIP EMI absorber sheet, a convenient solution for preventing electromagnetic interference. The integrated adhesive layer makes the patch easy to stick on. It offers an attenuation of more than 40 dB over a wide frequency range. Both isolated and non-isolated versions are available. The non-isolated version allows the option of earthing. The hybrid absorber sheet consisting of EMI absorber material and aluminum layer is now available in the following sizes: as a sheet 105 mm × 74 mm, 297 mm × 210 mm or as a roll 15 m × 50 mm. The patch offers up to 12 times higher attenuation than previously available absorber sheets and helps achieve attenuation values otherwise attainable only with shielding cabinets.	27.08.2024 12:30:00	Aug	news_2024-09-15_17.jpg	\images\news_2024-09-15_17.jpg	https://www.we-online.com/en/components/products/WE-EMIP_EMI_PATCH	we-online.com
Joining the Global Battery Alliance	Siemens Digital Industries Software announced toda...	12096	Industry News	Joining the Global Battery Alliance	Siemens Digital Industries Software announced today it has joined the Global Battery Alliance (GBA), a collaboration platform that brings together international organizations, NGOs, industry actors, academics and multiple governments to align collectively in a pre-competitive approach, to drive systemic change along the entire battery manufacturing value chain. The vision of the GBA is to achieve three fundamental outcomes, which Siemens endorses and actively contributes to: establish a circular battery value chain, establish a low carbon economy in the value chain, and safeguard human rights and economic development. Through dedication to these principles, Siemens aims to bring about sustainable practices within the battery industry that not only minimize environmental impact but also create new job opportunities and generate additional economic value for communities worldwide. By joining GBA, Siemens is aligning with major stakeholders across the entire battery supply chain, spanning from material developers to cell suppliers, OEMs, and government bodies to strive towards a greener and more ethical future.	27.08.2024 09:00:00	Aug	news_2024-09-15_7.jpg	\images\news_2024-09-15_7.jpg	https://xcelerator.siemens.com/global/en/industries/battery-manufacturing/battery-passport.html	xcelerator.siemens.com
Investment in additional R&D Capabilities in Europe and Asia	To satisfy the growing global demand for current a...	12075	Industry News	Investment in additional R&D Capabilities in Europe and Asia	To satisfy the growing global demand for current and voltage sensing driven by the push towards decarbonization and greater electrification, LEM has opened new research and development facilities in Munich and Shanghai. The two sites are said to enable LEM to build greater intelligence into its sensors and to have development bases closer to key customers, while also promoting deeper collaboration on projects and the efficient sharing of vital product design information. While the China site will be kitted out with the very latest laboratory equipment, the site in Germany will focus on ASIC design and semiconductor technology that will help accelerate LEM’s innovation in integrated current sensors (ICSs). This latest investment in additional R&D facilities in Europe and Asia follows on from LEM’s recent inauguration of a factory in Malaysia. LEM’s investment in the state of Penang was an acknowledgment of the region’s expertise in ASIC technology and its specialization in semiconductor design and production. There are already 10 employees in place at Munich and this number will increase in line with LEM’s growth plans for the site. At the 1400 m² Shanghai facility, there are currently 30 staff with the capacity to more than double that number in the future, many of whom will be involved in R&D.	23.08.2024 11:00:00	Aug	news_2024-09-01_6.jpg	\images\news_2024-09-01_6.jpg	https://www.lem.com/en	lem.com
Ideal Diodes in small TSSPs	Nexperia has introduced two ideal power diode ICs....	12086	Product Release	Ideal Diodes in small TSSPs	Nexperia has introduced two ideal power diode ICs. The NID5100 is suitable for standard industrial and consumer applications while the NID5100-Q100 has been qualified for use in automotive applications. Ideal diodes are MOSFET-based devices that offer much lower forward voltage drop than traditional diodes and make a good replacement option to standard diodes in systems where power efficiency is paramount. The NID5100 and NID5100-Q100 ideal diodes are available in small TSSP6/SOT363-2 leaded plastic packages measuring 2.1 mm x 1.25 mm x 0.95 mm. Applications that can benefit from their electrical performance include smart meters, fire/security sensors, battery powered wearables, and automotive telematics units. The NID5100 is a PMOS based ideal diode where the gate voltage of an internal MOSFET regulates the anode-to-cathode voltage to be eight to ten times lower than the forward voltage drop of similarly rated Schottky diodes. Besides the low forward drop, the MOSFET-based ideal diode also helps to reduce reverse DC leakage current by up to 100 times compared to a typical Schottky diode. The NID5100 supports "OR-ing" multiple power supplies while retaining reverse polarity protection and provides ultra-fast response time for smooth power transfer. Its forward regulation voltage is 31 mV with forward currents up to 1.5 A.	22.08.2024 12:30:00	Aug	news_2024-09-01_17.jpg	\images\news_2024-09-01_17.jpg	https://assets.nexperia.com/documents/data-sheet/NID5100.pdf	nexperia.com
MOSFETs in SMD Package for High Performance Applications	Alpha and Omega Semiconductor has announced Power ...	12089	Product Release	MOSFETs in SMD Package for High Performance Applications	Alpha and Omega Semiconductor has announced Power MOSFETs in LFPAK 5x6 packages for voltages of 40 V (AOLF66412, AOLF66413 and AOLF66417), 60 V (AOLF66610), and 100 V (AOLF66910). The devices are designed to withstand harsh environments while maintaining MOSFET performance in applications such as industrial, server power, telecommunications, and solar, where high reliability is required. The LFPAK packaging enables higher board-level reliability due to key packaging features such as gull-wing leads, which offer a ruggedized solution for board-level environmental stresses. The gull-wing leads also enable optical inspection during PCB manufacturing. Another feature enhancement is the LFPAK's larger copper clip, which improves electrical and thermal performance. Advantages of the large clip include improved current handling capabilities, reduced on-resistance, and better heat dispersion compared to wire bonding. A large clip also has low parasitic inductance, enabling lower spike voltage in switching applications. The devices operate with gate-source voltages of ±20 V at maximum junction temperatures of 175 °C. The drain current @ 25 °C and the maximum R<sub>DS(on)</sub> both depend on the model ranging from 187 to 294 A or, respectively, 1.5 to 4.7 mΩ at a gate-source voltage of 10 V.	21.08.2024 15:30:00	Aug	news_2024-09-01_20.jpg	\images\news_2024-09-01_20.jpg	https://www.aosmd.com/sites/default/files/2024-08/AOS_LFPAK_PR_1.pdf	aosmd.com
Industrial AC/DC Power Supplies in 2" x 3" Packages	Traco Power released its TXO family of 45, 60 & 12...	12088	Product Release	Industrial AC/DC Power Supplies in 2" x 3" Packages	Traco Power released its TXO family of 45, 60 & 120 W compact AC/DC Power supplies. These are the first 3 power levels of a TXO family of power supplies that will eventually go to 500 W. The TXO line specifically focuses on providing cost-efficient industrial power supplies. Efficiencies of up to 92 % allow for a compact design, and these models are designed to meet the ErP directive (< 0.3 W no load power consumption). Features include an internal EN55032 class B filter, as well as EMC characteristics dedicated for applications in industrial/automation and test & measurement fields. Basic features include a 2" x 3" open-frame construction, a universal input range of 85 – 264 VAC, 3000 VAC reinforced I/O isolation, an internal EN55032 class B filter, short circuit and overvoltage protection, IEC/EN/UL 62368-1 safety approvals and EN 61000-3-2 compliance. The TXO 45/60 series operates at full load convection cooled in the range of -20 °C to +50 °C, while the TXO 120 series operates as follows: 100 W convection / 120 W forced air -20 °C to +50 °C.	20.08.2024 14:30:00	Aug	news_2024-09-01_19.jpg	\images\news_2024-09-01_19.jpg	https://www.tracopower.com/de/txo	tracopower.com
Online EV-Charging Resource Hub	Arrow Electronics has developed and launched a res...	12077	Industry News	Online EV-Charging Resource Hub	Arrow Electronics has developed and launched a resource for EV charging for the automotive industry. Expanding its library of content, Arrow helps engineers developing the next generation of electric vehicle chargers and the corresponding software ecosystem that supports them. The hub offers design and technical support across the three electric vehicle charger categories: on-board charger, AC chargers and DC (or fast) chargers. Among the resources now available, Arrow has introduced a free eBook that delves into the latest developments in EV charging, such as costs, adapters, and the economic advantages of electric vehicles. There are also webinars available on-demand, including "Trends and Technologies for Next-Gen EV Charging Solutions".	19.08.2024 13:00:00	Aug	news_2024-09-01_8.jpg	\images\news_2024-09-01_8.jpg	https://www.arrow.com/en/ev-charging-solutions	arrow.com
eBook about Connectivity Needs and Technologies for Connected Homes	Mouser Electronics has released an eBook in collab...	12076	Industry News	eBook about Connectivity Needs and Technologies for Connected Homes	Mouser Electronics has released an eBook in collaboration with Qorvo, offering a detailed look at the connectivity requirements for smart homes and the different technologies used to support them. In Next-Gen Connectivity for Smart Living, experts from Mouser and Qorvo offer a deep dive into the technologies that underpin connectivity for smart homes, including Wi-Fi 7, ultra-wideband, and IoT standards like Zigbee, Thread, and Bluetooth Low Energy. The eBook features six different articles, each of which includes detailed infographics and links to relevant design tips from Qorvo including links to a dozen recommended Qorvo products.	19.08.2024 12:00:00	Aug	news_2024-09-01_7.jpg	\images\news_2024-09-01_7.jpg	https://resources.mouser.com/manufacturer-ebooks/qorvo-next-gen-connectivity-for-smart-living	mouser.com
Funding of up to $1.6 Billion in CHIPS and Science Act	Texas Instruments (TI) and the U.S. Department of ...	12074	Industry News	Funding of up to $1.6 Billion in CHIPS and Science Act	Texas Instruments (TI) and the U.S. Department of Commerce have signed a non-binding Preliminary Memorandum of Terms for up to $1.6 billion in proposed direct funding under the CHIPS and Science Act to support three 300 mm wafer fabs already under construction in Texas and Utah. In addition, TI expects to receive an estimated $6 billion to $8 billion from the U.S. Department of Treasury's Investment Tax Credit for qualified U.S. manufacturing investments. The proposed direct funding, coupled with the investment tax credit, would help TI provide a geopolitically dependable supply of essential analog and embedded processing semiconductors. The proposed direct funding under the CHIPS Act would support TI's investment of more than $18 billion through 2029, which is part of the company's broader investment in manufacturing. This proposed direct funding will support three new wafer fabs, two in Sherman, Texas, (SM1 and SM2) and one in Lehi, Utah (LFAB2), specifically to construct and build the SM1 cleanroom and complete pilot line for first production, to construct and build the LFAB2 cleanroom for first production and to construct the SM2 shell. They will produce semiconductors in 28 nm to 130 nm technology nodes.	16.08.2024 10:00:00	Aug	news_2024-09-01_5.jpg	\images\news_2024-09-01_5.jpg	https://news.ti.com/2024-08-16-Texas-Instruments-signs-preliminary-agreement-to-receive-up-to-1-6-billion-in-CHIPS-and-Science-Act-proposed-funding-for-semiconductor-manufacturing-in-Texas-and-Utah	ti.com
Call for Papers for the 75th ECTC	The IEEE Electronic Components and Technology Conf...	12071	Event News	Call for Papers for the 75th ECTC	The IEEE Electronic Components and Technology Conference (ECTC), a major technical conference and product exhibition for the world's semiconductor packaging industry, has announced a Call for Papers for ECTC 2025, the conference's 75th anniversary. The 75th annual ECTC will take place May 27-30, 2025 at the Gaylord Texan Resort & Convention Center in Dallas. More than 2,000 scientists, engineers and business people from more than 20 countries are expected to attend. Abstract submission has already been opened and the deadline for submissions is October 7, 2024. The ECTC 2025 technical program will address new developments, trends and applications for a broad range of topics, including components, materials, assembly, reliability, modeling, interconnect design and technology, device and system packaging, heterogeneous integration, wafer level packaging, photonics and optoelectronics, IoT, 5G, quantum computing and systems, 2.5D and 3D integration technology, and other emerging technologies in electronics packaging.	16.08.2024 07:00:00	Aug	news_2024-09-01_2.jpg	\images\news_2024-09-01_2.jpg	https://www.ectc.net/abstracts/75thCallforPapers-Web.pdf	ectc.net
High-Performance Power Module Family	SemiQ has added an S7 package to its QSiC™ f...	12087	Product Release	High-Performance Power Module Family	SemiQ has added an S7 package to its QSiC™ family of 1200 V, half-bridge MOSFET and Schottky diode SiC power modules. The parts enhance design flexibility for power engineers by providing compact, high-efficiency, high-performance options for new designs while supporting drop-in-replacement in legacy systems that require more efficient operation. This latest announcement sees the availability of a 529A MOSFET module (GCMX003A120S7B1: RdsOn 3.0 mΩ, B1 package), a 348A MOSFET module (GCMX005A120S7B1: R<sub>dsOn</sub> 4,9 mΩ, B1 package), and two low-noise SiC Schottky diode half-bridge modules (GHXS300A120S7D5 for 300 A and GHXS400A120S7D5 for 400 A) in an S7 package with industry-standard 62.0 mm footprints and a height of 17.0 mm. The package addresses the size, weight and power requirements of demanding applications ranging from induction heaters, welding equipment and uninterruptible power supplies (UPS) to photovoltaic and wind inverters, energy storage systems, high-voltage DC-DC converters and battery charging systems for electric vehicles (EVs). To guarantee a stable gate threshold voltage and premium gate oxide quality for each module, SemiQ conducts gate burn-in testing at the wafer level and performs various stress. All parts have undergone testing surpassing 1400 V.	14.08.2024 13:30:00	Aug	news_2024-09-01_18.jpg	\images\news_2024-09-01_18.jpg	https://semiq.com/module-packages	semiq.com
New Semiconductor Material: AlYN promises more Energy-Efficiency	Researchers at Fraunhofer IAF (Fraunhofer Institut...	12073	Industry News	New Semiconductor Material: AlYN promises more Energy-Efficiency	Researchers at Fraunhofer IAF (Fraunhofer Institute for Applied Solid State Physics) have reported that they "made a breakthrough in the field of semiconductor materials": With Aluminum Yttrium Nitride (AlYN), they have succeeded in fabricating and characterizing a new and promising semiconductor material using the MOCVD process. Due to its excellent material properties and its adaptability to gallium nitride (GaN), AlYN is said to have "enormous potential for use in energy-efficient high-frequency and high-performance electronics for information and communications technology". AlYN shows outstanding material properties, however, the growth of the material has been a major challenge. Until now, AlYN could only be deposited by magnetron sputtering. Researchers at Fraunhofer IAF have now succeeded in fabricating the new material using metal-organic chemical vapor deposition (MOCVD) technology, thus enabling the development of new, diverse applications. The institute thinks that "with its promising material properties, AlYN could become a key material for future technological innovations". Recent research had already demonstrated the material properties of AlYN, such as ferroelectricity. In developing the new compound semiconductor, the researchers at Fraunhofer IAF focused primarily on its adaptability to gallium nitride (GaN) – especially in terms of the lattice structure.	14.08.2024 09:00:00	Aug	news_2024-09-01_4.jpg	\images\news_2024-09-01_4.jpg	https://www.iaf.fraunhofer.de/en/media-library/press-releases/new-semiconductor-material-AlYN.html	iaf.fraunhofer.de
AC Surge Protective Devices	Bourns' Model 1270 and 1280 Series Din-Rail AC Sur...	12080	Product Release	AC Surge Protective Devices	Bourns' Model 1270 and 1280 Series Din-Rail AC Surge Protective Devices (SPDs) are IEC/EN 61643-11 compliant Class I + Class II / T1+T2 SPDs, and Model 1280 features an Advanced Thermal Disconnector (TD+) for enhanced protection that eliminates the need for upstream overcurrent protection. Both model series also feature a window fault indicator and remote alarm to help monitor the operating status of the surge protector. In addition, Bourns announced its Model 1430 and 1440 Series Din-Rail DC Surge Protective Devices (SPDs). The two series are IEC/EN 61643-31 compliant Class I + Class II / T1+T2 SPDs. Designed to protect DC power systems, the 14 new models offer protection voltage ranging from 48 VDC up to 1500 VDC and feature high energy MOV technology. In addition, the Model 1440 Series features an Advanced Thermal Disconnector (TD+) as well. Both model series have a replaceable modular design, and also include a window fault indicator and remote alarm, providing enhanced surge protector operating status monitoring.	14.08.2024 06:30:00	Aug	news_2024-09-01_11.jpg	\images\news_2024-09-01_11.jpg	http://www.bourns.com/products/surge-protective-devices/dc-power-surge-protective-devices	bourns.com
Power Factor Correction Chokes für up to 3,300 W	ITG Electronics has expanded its portfolio of powe...	12083	Product Release	Power Factor Correction Chokes für up to 3,300 W	ITG Electronics has expanded its portfolio of power factor correction chokes (PFCs) with a set of solutions designed for high switching frequencies. Capable of handling up to 3,300 W the company's PFC433835B Series include CCM PFC boost converters with switching frequencies from 100 – 200 kHz. An extension of ITG Electronics' Cubic Design set of power factor correction chokes, PFC433835B Series solutions are suitable for Inductance ranges from 90 – 285 µH and have footprints up to 43 mm x 35 mm and maximum heights of 38 mm. Compared with traditional toroidal-shaped PFC chokes, the PFC433835B Series features a flat wire and square core construction to save space and increase power density. The solutions are said to be up to 50% smaller compared with toroidal-shaped PFC chokes with similar power ratings, and their flat wire technology can reduce DC resistance by as much as 40%, leading to substantially lower copper losses.	13.08.2024 09:30:00	Aug	news_2024-09-01_14.jpg	\images\news_2024-09-01_14.jpg	https://itg-electronics.com/en/series/914	itg-electronics.com
DC/DC Buck Converter deliver up to 20 A	TDK Corporation expanded its TDK-Lambda i7A series...	12082	Product Release	DC/DC Buck Converter deliver up to 20 A	TDK Corporation expanded its TDK-Lambda i7A series of non-isolated buck (step-down) DC/DC converters with the industry-standard 1/16th brick pinout. 20 A output models with a 500 W maximum rating are now available, offering a trimmable 3.3 – 32 V output capability and operation from 28 V up to 60 V input. An adjustable over-current limit is also available as an option, reducing stress on the converter or load when exposed to excessive overcurrent conditions and facilitating fine-tuning based on actual system requirements. The 20A i7A models can be used to derive additional high-power outputs at higher efficiency than isolated DC-DC converters. These products are suited for use in mobile robotics, drones, medical, industrial, test and measurement, communications, computing, and portable battery-powered equipment. Efficiencies of up to 96% minimize internal losses and allow the 20 A i7A models to operate in ambient temperatures of -40 °C up to +125 °C, even with low airflow conditions. The i7A's design provides low output ripple and excellent response to dynamic loads. All models have safety certification to the IEC/UL/CSA/EN 62368-1 standards, with CE and UKCA marking to the Low Voltage and RoHS Directives.	13.08.2024 08:30:00	Aug	news_2024-09-01_13.jpg	\images\news_2024-09-01_13.jpg	https://product.tdk.com/system/files/dam/doc/product/power/switching-power/dc-dc-converter/catalog/i7a_e.pdf	tdk.com
Intelligent Power Module for Industrial Motors up to 4 kW	Infineon Technologies expands its 7th generation T...	12081	Product Release	Intelligent Power Module for Industrial Motors up to 4 kW	Infineon Technologies expands its 7th generation TRENCHSTOP™ IGBT7 product family with the CIPOS™ Maxi Intelligent Power Module (IPM) series for low-power motor drives. The IM12BxxxC1 series is based on the TRENCHSTOP IGBT7 1200 V and rapid diode EmCon 7 technology. Thanks to the latest micro-pattern trench design, it offers exceptional control and performance. This results in significant loss reduction, increased efficiency, and higher power density. The portfolio includes three new products in variants ranging from 10 A to 20 A for power ratings of up to 4.0 kW: IM12B10CC1, IM12B15CC1 and IM12B20EC1. The IM12BxxxC1 series is packaged in a DIP 36x23D housing. It integrates various power and control components. This makes it "the smallest package for 1200 V IPMs with the highest power density and best performance in its class", the company says. The IM12BxxxC1 series is particularly suitable for low-power drives in applications such as motors, pumps, fans, heat pumps and outdoor fans for heating, ventilation, and air conditioning. The IPM series offers an isolated dual-in-line molded housing also meets the EMI and overload protection requirements of demanding designs. In addition to the protection features, the IPM is equipped with an independent UL-certified temperature thermistor.	12.08.2024 07:30:00	Aug	news_2024-09-01_12.jpg	\images\news_2024-09-01_12.jpg	https://www.infineon.com/cms/en/about-infineon/press/market-news/2024/INFGIP202408-135.html	infineon.com
Connect with the Advanced Battery and Electric & Hybrid Vehicle Technology Community	Join North America's largest advanced battery even...	12079	Event News	Connect with the Advanced Battery and Electric & Hybrid Vehicle Technology Community	Join North America's largest advanced battery event, The Battery Show and Electric & Hybrid Vehicle Technology Expo, October 7-10, 2024, at Huntington Place, Detroit. Discover the latest technologies and solutions from over 1,150 exhibitors including industry heavy hitters such as Dow, Parker, Hongfa America, Henkel, Honeywell, Siemens, Ampherr, Sabic, Trumpf and more across multiple sectors including automotive stationary, medical, aerospace, commercial, and industrial applications. Experience live product showcases and visit Pavilions on the show floor, including the new Lead and Recycling Pavilions, for industry-specific innovations. Enhance your knowledge with free educational sessions at the Battery Tech Theatre and Open Tech Forum. For a deeper dive, upgrade to our five-track conference covering advanced battery design, manufacturing, market forecasts, and regulatory trends. Network with over 19,000 professionals in the advanced battery and H/EV community through various expo events. Don't miss the ''Welcome to Detroit: An Electrifying Evening in the Motor City" where we celebrate the new home of The Battery Show and Electric & Hybrid Vehicle Technology Expo in Downtown Detroit. We can't wait to see you there! Register now to secure your FREE expo pass or enjoy a $100 discount on conference passes with code BOD.	10.08.2024 15:00:00	Aug	news_2024-09-01_10.jpg	\images\news_2024-09-01_10.jpg	https://register.thebatteryshow.com/37t67i	thebatteryshow.com
Automotive DC/DC Converters with "highest Power Density"	Vitesco Technologies created a new generation of D...	12078	Industry News	Automotive DC/DC Converters with "highest Power Density"	Vitesco Technologies created a new generation of DC/DC converters that are claimed to “set new standards in power density (efficiency of over 96 percent) and sustainability for power grids, power supplies, and OBC (On-Board Chargers)”. For this design Vitesco has selected the CoolGaN™ Transistors 650 V from Infineon. With GaN Transistors, Vitesco Technlogies was able to design its Gen5+ GaN Air DC/DC converters with passive cooling, which reduces the system's overall cost. The GaN devices also allow for simplified converter design and mechanical integration. As a result, the DC/DC converters can be flexibly positioned in the vehicle, reducing the workload for manufacturers. The use of GaN also allows the power of the converters to be scaled up to 3.6 kW and the power density to be increased to over 4.2 kW/l. The Gen5+ GaN Air DC/DC converters offer an efficiency of over 96 percent and improved thermal behavior compared to the Gen5 Liquid-Cooled converters. They provide a two-phase output of 248 A at 14.5 V continuous. The phases can be combined to achieve the maximum output power. Still, it is also possible to switch off one phase under partial load conditions and interleave the switching frequency between the two phases.	09.08.2024 14:00:00	Aug	news_2024-09-01_9.jpg	\images\news_2024-09-01_9.jpg	https://www.infineon.com/cms/en/about-infineon/press/market-news/2024/INFPSS202408-134.html	infineon.com
Partnering on new Capacitor-based Energy Storage Systems (CESS)	Flex and Musashi Energy Solutions announced an ext...	12097	Industry News	Partnering on new Capacitor-based Energy Storage Systems (CESS)	Flex and Musashi Energy Solutions announced an extensive collaboration to supply Flex-designed and manufactured Capacitor-based Energy Storage Systems (CESS) featuring Musashi's Hybrid SuperCapacitor (HSC) technology. These systems are designed to integrate with server rack power systems to address significant challenges with utility power in artificial intelligence (AI) data centers. First to market with Musashi's HSC technology, Flex has collaborated with Musashi to develop strategic technology and product development roadmaps for current and future products that enable hyperscale operators to mitigate utility power fluctuations in data centers deploying AI workloads. Flex's CESS solutions are designed to balance peak power and protect the grid from intense power surges and line disturbances during AI training and inference activities taking place in data center environments. Musashi's HSCs are designed to provide high-reliability energy storage in many applications. The technology is said to reduce equipment size, weight and total cost of ownership. The new solution is announced to offer "a significantly longer lifespan than current battery energy storage systems, with ability to provide multi-million charge/discharge cycles – essential for high-performance capacity and dependability needed in the data center". Furthermore, it provides a wide operating temperature and inherent safety as the cells are able to operate in temperature ranges from -30 to over +70 °C, plus UL 810A certification and completion of UL 9540A testing for thermal runaway at the cell level.	08.08.2024 09:30:00	Aug	news_2024-09-15_8.jpg	\images\news_2024-09-15_8.jpg	https://musashienergysolutions.com/flex-and-musashi-partner/	musashienergysolutions.com
Personnel Change in Executive Board	Peter Riedel has decided to resign from his positi...	12072	People	Personnel Change in Executive Board	Peter Riedel has decided to resign from his position as President and COO of Rohde & Schwarz for personal reasons, and he has already left the company, however, he will remain associated with Rohde & Schwarz in an advisory role. After the departure of Peter Riedel, the Executive Board of the Munich technology company now consists of Christian Leicher as President and Chief Executive Officer and CTO Andreas Pauly. For the time being, Andreas Pauly will assume the tasks of Chief Operating Officer on an interim basis. Peter Riedel had been on the Executive Board as Chief Operating Officer since 2014.	08.08.2024 08:00:00	Aug	news_2024-09-01_3.jpg	\images\news_2024-09-01_3.jpg	https://www.rohde-schwarz.com/uk/about/news-press/all-news/personnel-change-to-the-rohde-schwarz-executive-board-press-release-detailpage_229356-1512599.html?change_c=true	rohde-schwarz.com
SiC Power Semiconductor Fab in Malaysia	As global decarbonization efforts drive demand for...	12070	Industry News	SiC Power Semiconductor Fab in Malaysia	As global decarbonization efforts drive demand for power semiconductors, Infineon Technologies has officially opened the first phase of a new fab in Malaysia that will become the world's largest and most competitive 200-millimeter silicon carbide (SiC) power semiconductor fab. Malaysian Prime Minister YAB Dato' Seri Anwar Ibrahim and Chief Minister of the state of Kedah YAB Dato' Seri Haji Muhammad Sanusi Haji Mohd Nor joined Infineon CEO Jochen Hanebeck, to symbolically launch production. The highly efficient 200-millimeter SiC power fab will strengthen Infineon's role as the global leader in power semiconductors. The first phase of the fab, with an investment volume of two billion euros, will focus on the production of silicon carbide power semiconductors and will include gallium nitride (GaN) epitaxy. SiC semiconductors have revolutionized high-power applications because they switch electricity even more efficiently and enable even smaller designs. SiC semiconductors increase efficiency in electric vehicles, fast charging stations and trains as well as renewable energy systems and AI data centers. 900 high-value jobs will be created already in the first phase. The second phase, with an investment of up to five billion euros, will create the world's largest and most efficient 200-millimeter SiC power fab. Overall, up to 4.000 jobs will be created with the project.	08.08.2024 06:00:00	Aug	news_2024-09-01_1.jpg	\images\news_2024-09-01_1.jpg	https://www.infineon.com/cms/en/about-infineon/press/press-releases/2024/INFXX202408-133.html	infineon.com
Electric Vehicle Charger Reference Designs	To accelerate the time to market of an EV charger,...	12085	Product Release	Electric Vehicle Charger Reference Designs	To accelerate the time to market of an EV charger, Microchip Technology now offers three flexible and scalable EV Charger Reference Designs including a Single-Phase AC Residential, a Three-Phase AC Commercial (up to 22 kW) with Open Charge Point Protocol (OCPP) and System-on-Chip (SoC) and a Three-Phase AC Commercial with OCPP and Display. Most of the active components for the EV charger reference designs are available from Microchip, including the microcontroller (MCU), analog front-end, memory, connectivity and power conversion. This significantly streamlines the integration process, enabling manufacturers to speed time to market for new charging solutions. These reference designs offer complete hardware design files and source code with software stacks that are tested and compliant to communication protocols, including OCPP. OCPP offers manufacturers a standard protocol to communicate between the charge point or charging station and a central system. This protocol is designed to enable interoperability of the charging applications regardless of the network or vendor. The EV Reference Designs are supported by MPLAB X Integrated Development Environment (IDE) to help designers minimize development time, as well as MPLAB Harmony v3 and MPLAB Code Configurator.	07.08.2024 11:30:00	Aug	news_2024-09-01_16.jpg	\images\news_2024-09-01_16.jpg	https://www.microchip.com/en-us/solutions/automotive-and-transportation/charging-station/ev-offboard-ac-charger-reference-designs	microchip.com
Series of Wire-Wound Ferrites extended	Würth Elektronik now offers its WE-RFI inductors i...	12084	Product Release	Series of Wire-Wound Ferrites extended	Würth Elektronik now offers its WE-RFI inductors in sizes 0402 and 0603, which can be used as inductors for RF applications or as ferrites for interference suppression. Here the manufacturer responds to increasing miniaturization and complements the existing sizes 0805 and 1008. The components are suitable as low-pass filters (for filtering high-frequency noise), data line filters, supply voltage decoupling, low-frequency radio applications, and RFID. As wire-wound ferrites, the WE-RFI inductors attain higher impedances than normal ferrites, even at high frequencies, and over a wider bandwidth. Unlike multilayer ferrites, they show no DC bias behavior. As RF inductors, they offer high inductance values from 20 nH up to 47 µH. They are characterized by low RDC and consequently a high rated current of up to 1.91 A at ΔT = 40 K. A design kit is available for this component group, which Würth Elektronik will always replenish free of charge, so developers always have inductances of different values to hand.	07.08.2024 10:30:00	Aug	news_2024-09-01_15.jpg	\images\news_2024-09-01_15.jpg	https://www.we-online.com/en/news-center/press?instance_ID=5506&d=we-rfi	we-online.com
High-Power Semiconductor Company: President Change	Dominic Dorfner will take over as president Semikr...	12056	People	High-Power Semiconductor Company: President Change	Dominic Dorfner will take over as president Semikron Danfoss, when Claus A. Petersen retires on August 31, after 40 years in the Danfoss Group. He has been leading Danfoss Silicon Power and Semikron Danfoss for the last 26 years. Dominic Dorfner has been named new president of the company and will start working in his new position on September 1, 2024. He joined Semikron Danfoss in 2021 as head of the industry business in Danfoss Silicon Power, and for the past 13 months he has been leading the automotive division in Semikron Danfoss. Though now retiring as company president, Claus A. Petersen is not completely leaving Semikron Danfoss, as he has joined the board of directors.	07.08.2024 07:00:00	Aug	news_2024-08-15_2.jpg	\images\news_2024-08-15_2.jpg	https://www.semikron-danfoss.com/about-semikron-danfoss/news-press/detail/claus-a-petersen-retiring-from-semikron-danfoss-and-has-joined-the-board-of-directors-dominic-dorfner-named-new-president.html	semikron-danfoss.com
President of Energy Business	Effective from the beginning of August 2024, Per E...	12059	People	President of Energy Business	Effective from the beginning of August 2024, Per Erik Holsten is the president of ABB Energy Industries. He moves into the role from the position of hub manager for Northern Europe at ABB Energy Industries. Per Erik succeeds Brandon Spencer, who has become president of the ABB Motion business area. Per Erik offers vast experience within the energy sector, from traditional sources through to key energy transition industries including hydrogen, offshore wind and Power-to-X. Per Erik Holsten holds an MBA of International Business from the University of East London, UK. He also studied Engineering at Sør-Trøndelag University College (HiST), Norway. He is based in Oslo, Norway.	05.08.2024 10:00:00	Aug	news_2024-08-15_5.jpg	\images\news_2024-08-15_5.jpg	https://new.abb.com/process-automation/energy-industries	abb.com
SiC MOSFETs for High-Voltage Drives in EVs	With three half-bridge modules in SiC MOSFET techn...	12062	Product Release	SiC MOSFETs for High-Voltage Drives in EVs	With three half-bridge modules in SiC MOSFET technology, the manufacturer StarPower is expanding its range of power semiconductors for use in the drivetrain of electric vehicles. The devices, dubbed MD19HFC120N6HT, MD22HFC120N6HY and MD29HFC120N6HT, are characterized by a blocking voltage (V<sub>DSS</sub>) of 1200 V. This means that the products can be used in environments with an 800 V on-board power supply. The individual models of the MOSFET family differ in their on-resistance (R<sub>DS(ON)</sub>), which covers the range between 1.8 m&ohm; and a maximum of 2.82 m&ohm; depending on the type. All models in this product family can be connected in parallel to increase the current. These MOSFETS are supplied in a 2-in-1 housing, which is optimized for low parasitic inductance in order to suppress unwanted oscillation tendencies. Heat loss is dissipated via a solid copper base plate with PINFIN structures for optimum cooling. The ceramic material silicon nitride (S<sub>3</sub>N<sub>4</sub>) is used as the carrier substrate, employing the sophisticated AMB (Active Metal Brazing) process.	05.08.2024 08:30:00	Aug	news_2024-08-15_8.jpg	\images\news_2024-08-15_8.jpg	https://www.starpowereurope.com/en/products	starpowereurope.com
32-bit-DSCs with more Peripherals for Power Applications	Microchip has launched its dsPIC33A Core family of...	12060	Product Release	32-bit-DSCs with more Peripherals for Power Applications	Microchip has launched its dsPIC33A Core family of Digital Signal Controllers (DSCs) which well-suited for motor control, power supply, charging and sensing systems. Built around a 32-bit CPU architecture with a 200 MHz operating speed, the DSC family's core includes a Double-Precision Floating-Point Unit (DP FPU) and DSP instructions for numerically intensive tasks in many closed-loop control algorithms. The architecture enables real-time control coupled with a comprehensive development tool ecosystem to streamline and accelerate the design process. The DSCs provide additional math and data processing, higher code efficiency, faster context switching and reduced latency than former members of the family. This allows for a faster response time to transient and safety-critical events. New and upgraded peripherals - such as high-resolution PWMs specifically engineered for motor control and digital power conversion - are designed to support progressive technology development in various markets including automotive, industrial, consumer, E-Mobility, data center and sustainable solutions segments. The dsPIC33A family features integrated analog peripherals, including 12-bit ADCs capable of conversion rates up to 40 Msps, comparators and operational amplifiers. These analog peripherals, in conjunction with Core Independent Peripherals (CIPs), allow for sophisticated sensing and high-performance control. In addition, the CIPs enable interaction among the peripherals without the need for CPU involvement.	30.07.2024 06:30:00	Jul	news_2024-08-15_6.jpg	\images\news_2024-08-15_6.jpg	https://www.microchip.com/en-us/about/news-releases/products/microchip-technology-introduces-a-new-core-in-the-dspic	microchip.com
High-Current Inductor for Automotive Applications	Würth Elektronik offers WE-LHCA (Low Profile High ...	12069	Product Release	High-Current Inductor for Automotive Applications	Würth Elektronik offers WE-LHCA (Low Profile High Current Automotive Inductor) – a particularly flat and temperature-tough inductor in four sizes with different inductance values. The power inductors are designed for an extended temperature range of -55 to +155 °C and are constructed to avoid thermal degradation. The AEC-Q200-certified inductor is suitable for applications such as high-current power supplies, start-stop systems, power distribution modules, on-board chargers, infotainment or HVAC systems. The members of this inductor family are available in the following sizes: 7030 (L = 0.47 - 22 µH), 1040 (L = 1 - 68 µH), 1365 (L = 1 - 47 µH) and 1770 (L = 4.7 - 82 µH). These components feature a low-profile shielded construction with a distributed air gap in iron alloy powder.	25.07.2024 15:30:00	Jul	news_2024-08-15_15.jpg	\images\news_2024-08-15_15.jpg	https://www.we-online.com/en/news-center/press?instance_ID=5506&d=we-lhca	we-online.com
Aluminum Polymer rectangular Capacitors for 48 V	KEMET's aluminum polymer rectangular capacitors of...	12068	Product Release	Aluminum Polymer rectangular Capacitors for 48 V	KEMET's aluminum polymer rectangular capacitors of the APL90 series are now available from Rutronik. The capacitors are AEC-Q200 qualified and are particularly suitable for meeting the requirements of 48 V vehicle applications and platforms. The APL90 series currently offers a capacitance of 1,100 µF, a rated voltage of 63 VDC, as well as 20 g vibration resistance and ripple current capability up to 26 A. An important area of application for the APL90 series is the automotive sector, e. g. as a DC link in 48 V inverters for mild hybrid electric vehicles (MHEVs). These capacitors are suited for use in data centers, e. g. as input capacitors in power supply units for 48 V systems. Suitable for use at operating temperatures from -55 °C to +125 °C, the component is shaped for efficient arrangement in modules and can be positioned both horizontally and vertically. Its lifetime is specified with 2,000 hours at +125 °C (with V<sub>R</sub> and I<sub>R</sub> applied).	25.07.2024 14:30:00	Jul	news_2024-08-15_14.jpg	\images\news_2024-08-15_14.jpg	https://www.rutronik.com/article/for-48-v-applications-rutronik-introduces-the-new-aluminum-polymer-rectangular-capacitors-of-the-apl90-series-from-kemet	rutronik.com
Thermal Pads Protect EV Battery Packs	The Chomerics Division of Parker Hannifin has intr...	12066	Product Release	Thermal Pads Protect EV Battery Packs	The Chomerics Division of Parker Hannifin has introduced its THERM-A-GAP™ PAD 30 thermally conductive gap filler pads for EV battery packs that fits seamlessly into robotic assembly processes. THERM-A-GAP PAD 30 thermally conductive gap filler pads for EV battery pack applications are claimed to “provide exceptional performance and conformability”. During assembly, vision sensors can see THERM-A-GAP pads which enables effective quality control and fast production. The pads release directly from their liner for pick-and-place robots, making them well-suited for high-volume applications, and come in specially designed packaging to ensure safe shipment. The pads provide a soft (34 Shore 00) solution with 3.2 W/m-K of thermal conductivity and are claimed to offer low outgassing, ensuring an effective thermal interface between heat sinks and electronic devices where there are uneven surfaces, air gaps and rough surface textures. The supporting electrical properties of this RoHS-compliant thermal gap filler pad include: 5.9 kV<sub>AC</sub>/mm dielectric strength (ASTM D149 test method), 10<sup>13</sup> &ohm;cm volume resistivity (ASTM D257), 7.7 dielectric constant at 1,000 kHz (ASTM D150) and 0.001 dissipation factor at 1,000 kHz (Chomerics CHO-TM-TP13).	25.07.2024 12:30:00	Jul	news_2024-08-15_12.jpg	\images\news_2024-08-15_12.jpg	https://www.parker.com/us/en/divisions/chomerics-division/industries/automotive/error-proofing-tim-application-for-ev-battery-packs.html?	parker.com
High Current Three Phase EMC Filter	The chassis mounting three phase EMC filter series...	12064	Product Release	High Current Three Phase EMC Filter	The chassis mounting three phase EMC filter series MF423-3-3D-BB from EMIS is designed for higher current rating applications such as photovoltaic (PV) and power drive systems to meet relevant EMC Standards. Installed on the mains input side of equipment the filters improve conducted immunity and reliability. The devices are fitted with busbar termination. Other applications include inverters and converters, industrial three-phase systems and power supplies, large UPS, wind turbines, factory and building automation. Standard features include an operating voltage of 440/520 V<sub>AC</sub>, a current rating of 300 A to 1000 A at 40°C, 50/60 Hz operating frequency within the operating temperature range between -25 °C and +85°C. The climatic category is 25/85/21.	25.07.2024 10:30:00	Jul	news_2024-08-15_10.jpg	\images\news_2024-08-15_10.jpg	https://emisglobal.com/products/emi-filters/three-phase/three-stage/mf-423-3-3d-bb/	emisglobal.com
High-Current eFuse with integrated Auto-Reset	Nexperia announced the NPS3102A and NPS3102B elect...	12063	Product Release	High-Current eFuse with integrated Auto-Reset	Nexperia announced the NPS3102A and NPS3102B electronic fuses (eFuses). These low-ohmic (17 mΩ), high current (13.5 A), resettable electronic fuses help to protect downstream loads from exposure to excessive voltages while also protecting power supplies from load faults and large inrush currents. They have been designed for use in various 12 V hot-swap applications including enterprise communication and storage equipment found in data centers such as drives, servers, ethernet switches and routers as well as to protect mobile communications infrastructure and industrial automation equipment like PLCs. The eFuses operate in the input voltage range up to 21 V. They are equipped with an integrated low-resistance pass MOSFET which minimizes voltage drop and power loss. The current clamp limit can be adjusted in the 2–13.5 A range using a resistor at the ILIM pin, which can also be used to measure load current in real time. Both devices include a built-in overvoltage clamp limiting the output voltage during an input overvoltage condition, with a 2 µs short-circuit protection response time. The pass-FET in the NPS3102A must be manually reset after a fault event whereas the NPS3102B integrates an auto-retry block, which safely attempts to re-enable the pass-FET without the need for user intervention.	25.07.2024 09:30:00	Jul	news_2024-08-15_9.jpg	\images\news_2024-08-15_9.jpg	https://www.nexperia.com/about/news-events/press-releases/nexperia-adds-new-high-current-efuse-with-superior-current-limiting-accuracy-to-its-power-device-portfolio	nexperia.com
4.5 kW Power Supply for AI GPU Racks	Navitas Semiconductor released its 4.5 kW AI data ...	12048	Product Release	4.5 kW Power Supply for AI GPU Racks	Navitas Semiconductor released its 4.5 kW AI data center power supply reference design, with GaNSafe™ and Gen-3 'Fast' (G3F) SiC power components. The design is claimed to "enable the world's highest power density with 137 W/in³ and over 97% efficiency". Next-generation AI GPUs like NVIDIA's Blackwell B100 and B200 each demand over 1 kW of power for high-power computation, 3x higher than traditional CPUs. These new demands are driving power-per-rack specifications from 30 - 40 kW up to 100 kW. The latest 4.5 kW CRPS185 design demonstrates how GaNSafe power ICs and GeneSiC™ Gen-3 'Fast' (G3F) MOSFETs enables highest power density and efficiency solution. At the heart of the design is an interleaved CCM totem-pole PFC using SiC with full-bridge LLC topology with GaN, where the fundamental strengths of each semiconductor technology are exploited for the highest frequency, coolest operation, optimized reliability and robustness, and highest power density and efficiency. The 650 V G3F SiC MOSFETs feature 'trench-assisted planar' technology which delivers "world-leading performance over temperature for the highest system efficiency and reliability in real-world applications". With a 3.2 kW power supply on the market Navitas plans to introduce an 8.5 kW design in September.	25.07.2024 09:30:00	Jul	news_2024-08-01_13.jpg	\images\news_2024-08-01_13.jpg	https://navitassemi.com/navitas-overcomes-ai-challenges-with-worlds-highest-power-density-data-center-design/	navitassemi.com
Second Generation of 1200V SiC MOSFET for High Performance Applications	Power Master Semiconductor has released the 2nd ge...	12061	Product Release	Second Generation of 1200V SiC MOSFET for High Performance Applications	Power Master Semiconductor has released the 2nd generation of the 1200V <i>e</i> SiC MOSFET, which is intended for applications such as DC EV charging stations, solar inverters, energy storage systems, motor drives and industrial power supplies. The 1200 V devices are claimed to “offer e. g. higher power density, efficiency and less cooling effort due to its much lower power losses”. FOM characteristics such as gate charge (Q<sub>G</sub>), stored energy in output capacitance (EOSS), reverse recovery charger (Q<sub>RR</sub>) and output charge (Q<sub>OSS</sub>) are improved by up to 30 % compared to previous generation. All devices are 100 % tested in terms of avalanche capability. Due to its lower miller capacitance (Q<sub>GD</sub>) it achieved 44 % lower switching losses than the previous generation.	25.07.2024 07:30:00	Jul	news_2024-08-15_7.jpg	\images\news_2024-08-15_7.jpg	https://www.powermastersemi.com/product/product04.html	powermastersemi.com
Supply Chain for Power Devices based on AlN established	In order to make the ultra-wide band gap (UWBG) te...	12043	Industry News	Supply Chain for Power Devices based on AlN established	In order to make the ultra-wide band gap (UWBG) technology AlN accessible to industry in the medium term, the related existing activities in Germany have been combined in a strategic cluster. The aim is to establish a German value chain for AlN-based technology and to build up an international leadership position in this increasingly economically important field. The Ferdinand-Braun-Institut (FBH), the Fraunhofer Institute for Integrated Systems and Device Technology IISB and the company III/V-Reclaim PT GmbH drive this initiative together. They cover the entire value chain, starting with the growth of AlN crystals using the Physical Vapor Transport (PVT) process, to wafering and polishing of epi-ready AlN-wafers, and the epitaxy of the functional device layers, up to the fabrication of transistors for power electronics and millimeter-wave applications. For the first time, the consortium has now successfully demonstrated the practical implementation of a value chain for AlN devices in Germany and Europe. The first transistor generations produced with these wafers already show promising electrical properties, such as a breakdown voltage of up to 2200 V and a power density superior to SiC as well as GaN-based power-switching devices. Compared to established silicon devices, AlN/GaN HEMTs, as they have now been successfully produced on AlN wafers, offer up to three thousand times less conduction losses than with silicon and are around ten times more efficient than SiC transistors.	24.07.2024 13:00:00	Jul	news_2024-08-01_8.jpg	\images\news_2024-08-01_8.jpg	https://www.iisb.fraunhofer.de/en/press_media/press_releases/pressearchiv/archiv_2024/AlN-value-chain.html	iisb.fraunhofer.de
SEMICON Southeast Asia 2025 to be Held in Singapore	SEMICON Southeast Asia will return to its roots in...	12058	Event News	SEMICON Southeast Asia 2025 to be Held in Singapore	SEMICON Southeast Asia will return to its roots in Singapore in 2025 to commemorate its 30th anniversary. With more than 18,000 delegates expected to attend from the region and around the world, SEMICON Southeast Asia has become a key platform for industry leaders, innovators, and decision-makers to connect, collaborate, and drive innovation. This special edition of the event will take place at Sands Expo & Convention Centre from 20 – 22 May 2025. Themed "Stronger Together", SEMICON Southeast Asia 2025 will feature insights into the latest industry developments, trends and innovations, and critical areas including sustainability, artificial intelligence (AI), chiplet technology, and workforce development. Since 2015, SEMICON Southeast Asia has been hosted in Malaysia, contributing significantly to the growth and advancement of the semiconductor industry in the region.	24.07.2024 09:00:00	Jul	news_2024-08-15_4.jpg	\images\news_2024-08-15_4.jpg	https://www.semiconsea.org/	semiconsea.org
Varistor Series Offers Surge Current Protection up to 6,000 A	KOA Speer Electronics introduces the NV73S series ...	12052	Product Release	Varistor Series Offers Surge Current Protection up to 6,000 A	KOA Speer Electronics introduces the NV73S series multilayer type metal oxide varistor that handles a surge current of up to 6,000 A, which is five times higher than existing products. The multilayer construction can absorb a large surge. The two-way symmetries can absorb positive and negative surges. The NV73S replaces the NV732E (1210) through 2L (2220) due to its improved surge protection. Maximum peak current and sizes for the new NV73S are 400 to 800 A (1210), 500 to 1,200 A (1812), and 1,500 to 6,000 A (2220) with a working voltage range of 6 to 95 V (AC) and 9 to 127 V (DC). The varistor voltage range for the NV73S series is 12 to 150 V. The NV73S series metal oxide varistor offers protection from ESD and EMI. It also provides surge protection for motors, relays, and solenoid valves. It meets EU-RoHS requirements.	23.07.2024 13:30:00	Jul	news_2024-08-01_17.jpg	\images\news_2024-08-01_17.jpg	https://www.koaspeer.com/news/1970/110/KOA_Speers_New_Varistor_Series_Offers_Surge_Current_Protection_Up_to_6000A_NV73S_Series/	koaspeer.com
Supply Agreement: SiC MOSFETs for EVs	onsemi has signed a multi-year deal with Volkswage...	12036	Industry News	Supply Agreement: SiC MOSFETs for EVs	onsemi has signed a multi-year deal with Volkswagen Group to be the primary supplier of a complete power box solution as part of its next-generation traction inverter for its Scalable Systems Platform (SSP). The solution features silicon carbide-based technologies in an integrated module that can scale across all power levels – from high power to low power traction inverters to be compatible for all vehicle categories. Based on the EliteSiC M3e MOSFETs, onsemi's power box solution is said to be able to handle more power in a smaller package which significantly reduces energy losses. The inclusion of three integrated half-bridge modules mounted on a cooling channel will further improve system efficiency by ensuring heat is effectively managed from the semiconductor to the coolant encasement. This leads to better performance, improved heat control, and increased efficiency, allowing EVs to drive further on a single charge.	22.07.2024 06:00:00	Jul	news_2024-08-01_1.jpg	\images\news_2024-08-01_1.jpg	https://investor.onsemi.com/news-releases/news-release-details/onsemi-selected-power-volkswagen-groups-next-generation-electric	onsemi.com
SiC Modules for Power Grid Batteries	Infineon Technologies announced that its CoolSiC&t...	12057	Industry News	SiC Modules for Power Grid Batteries	Infineon Technologies announced that its CoolSiC™ 2000 V modules have been selected by Daihen Corporation for their unit-type power conditioners for grid storage batteries. The unit-type power conditioner for grid storage batteries launched by Daihen earlier this year is the first product in the industry to achieve connection to storage batteries at a high DC link voltage of 1500 V. The higher voltage enables the product to be used with large-capacity storage battery facilities, which has resulted in a 40 percent reduction in the footprint of grid storage batteries compared to the conventional product. The higher power density is achieved by using Infineon's 62 mm CoolSiC MOSFET 2000 V module FF3MR20KM1H. In addition to the characteristics of SiC that enable high voltage, better thermal dissipation and high power density, Infineon's SiC products feature M1H trench technology that increases the gate drive voltage range and provides high robustness and reliability against gate voltage spikes.	19.07.2024 08:00:00	Jul	news_2024-08-15_3.jpg	\images\news_2024-08-15_3.jpg	https://www.infineon.com/cms/en/about-infineon/press/market-news/2024/INFGIP202407-026.html	infineon.com
150 V N-Channel Power U-MOS X-H MOSFETs	Toshiba Electronics Europe adds two 150 V N-channe...	12065	Product Release	150 V N-Channel Power U-MOS X-H MOSFETs	Toshiba Electronics Europe adds two 150 V N-channel power MOSFET products based upon their U-MOS X-H Trench process. The TPH1100CQ5 and TPH1400CQ5 devices are designed specifically for use in high-performance switching power supplies, such as those used in data centers and communication base stations as well as other industrial applications. With a maximum drain-source voltage (V<sub>DSS</sub>) rating of 150 V and drain current (I<sub>D</sub>) handling of 49 A (TPH1100CQ5) and 32A (TPH1400CQ5), the devices feature a maximum drain-source on-resistance (R<sub>DS(ON)</sub>) of 11 m&ohm; and 14 m&ohm;, respectively. The reverse recovery charge (Qrr) of TPH1400CQ5 is 27 nC (typ.), and the typical reverse recovery time (trr) is 36 ns. Used in synchronous rectification applications, the TPH1400CQ5 reduces the power loss of switching power supplies and helps improve efficiency. When used in a circuit that operates in reverse recovery mode, the new products reduce spike voltages generated during switching, helping to improve EMI characteristics. The devices are housed in a surface-mount SOP Advance(N) package measuring 4.9 mm x 6.1 mm x 1.0 mm. A G0 SPICE model for rapid verification of the circuit function as well as highly accurate G2 SPICE models, for accurate reproduction of transient characteristics are also available.	18.07.2024 11:30:00	Jul	news_2024-08-15_11.jpg	\images\news_2024-08-15_11.jpg	https://toshiba.semicon-storage.com/eu/company/news/2024/07/mosfet-20240718-1.html	toshiba.semicon-storage.com
Memorandum of Understanding to stimulate sustainable Action across the Supply Chain	Infineon Technologies has signed a Memorandum of U...	12038	Industry News	Memorandum of Understanding to stimulate sustainable Action across the Supply Chain	Infineon Technologies has signed a Memorandum of Understanding with Amkor Technology, a provider of semiconductor packaging and test services, with a joint commitment to stimulate decarbonization and sustainability strategies across the supply chain. Expanding their partnership towards sustainability is the next step in the sustainability journey of both companies. Infineon and Amkor intend to fully leverage their classical Outsourced Semiconductor Assembly and Test (OSAT) business relationship in order to effectively tackle emissions along their supply chain. In April, both companies announced to operate a dedicated packaging and test center at Amkor's manufacturing site in Porto, Portugal. As part of the cooperation for climate protection, Infineon and Amkor will actively engage with common suppliers to help them develop and implement effective decarbonization strategies. This will involve workshops, meetings, and the sharing of best practices and learnings related to decarbonization. The aim is to identify areas for improvement and support suppliers in setting science-based emissions reduction targets in line with the Science Based Targets initiative. Both companies are committed to providing ongoing guidance, fostering exchange, and tracking progress to drive continuous improvement across the common supply chain.	18.07.2024 08:00:00	Jul	news_2024-08-01_3.jpg	\images\news_2024-08-01_3.jpg	https://www.infineon.com/cms/en/about-infineon/press/press-releases/2024/INFXX202407-025.html	infineon.com
PCIM Europe 2025: Call for Papers	Starting now, experts from the realms of business ...	12044	Event News	PCIM Europe 2025: Call for Papers	Starting now, experts from the realms of business and academia can submit their abstracts on a wide range of topics in power electronics for a chance to speak at the PCIM Conference 2025. This call for papers will be open until 15 October 2024. The PCIM Conference gives authors of first-time publications the opportunity to present their work to an international audience of more than 900 representatives from the business and scientific sides of power electronics. All those accepted will have their articles published in the PCIM Conference proceedings and databases like IEEE Xplore, IET Inspec Direct, Knovel, and Scopus. In addition, presenters at the PCIM Conference will benefit from the immediate feedback they receive from both the industry and the academic world – and they will be able to make a number of contacts in the power electronics community in the process. The PCIM Conference offers a several options to present: From 20-minute talks on the conference stages via poster presentations offering direct interaction directly with other attendees up to half-day seminars. This year's best submissions will be recognized in five categories by the Best Paper Award, the Young Engineer Award, and the Young Researcher Award.	17.07.2024 14:00:00	Jul	news_2024-08-01_9.jpg	\images\news_2024-08-01_9.jpg	https://pcim.mesago.com/nuernberg/en/press/press-releases/pcim-press-releases/callforpapers25.html	pcim.com
Testing Procedure for Determining Dielectric Strength	Würth Elektronik has developed a testing procedure...	12040	Industry News	Testing Procedure for Determining Dielectric Strength	Würth Elektronik has developed a testing procedure for determining the maximum operating voltage of molded inductors. The manufacturer of electronic and electromechanical components introduces developers to the electrical property of dielectric strength and what happens if it is exceeded in an application note. The molded inductors from the Power Magnetics product portfolio (e. g., WE-MAPI, WE-XHMI, WE-LHMI) are now successively supplemented with the value of the maximum operating voltage V<sub>op</sub> as a new parameter in the specifications. Based on the testing procedure, Würth Elektronik defines the maximum operating voltage V<sub>op</sub> in its data sheets. This represents the voltage at which an inductor can be operated continuously in the application without impairing performance, risking damage or overheating the inductor. The operating voltage is therefore a limit value for the input voltage, up to which the inductor can be used reliably in an application without irreversible damage. The test concept examines the behavior of inductors up to their voltage limits under realistic conditions in a DC/DC full-bridge converter (voltage transients of up to 60 V/ns and frequencies of up to 2 MHz). The approximate voltage limit is firstly evaluated using a short-term test. The operating voltage is then defined on this basis and verified in a long-term test.	17.07.2024 10:00:00	Jul	news_2024-08-01_5.jpg	\images\news_2024-08-01_5.jpg	https://www.we-online.com/en/news-center/press/press-releases?d=voltage-specification	we-online.com
Magnetic Packaging Technology for Power Modules: Cutting Size in half	Texas Instruments (TI) introduced six power module...	12051	Product Release	Magnetic Packaging Technology for Power Modules: Cutting Size in half	Texas Instruments (TI) introduced six power modules designed to improve power density, enhance efficiency and reduce EMI. These power modules leverage TI's proprietary MagPack™ integrated magnetic packaging technology, "shrinking their size by up to 23% compared to competing modules", enabling designers of industrial, enterprise and communications applications to achieve previously impossible performance levels. In fact, three of the six devices, the TPSM82866A, TPSM82866C and TPSM82816, are claimed to be "the industry's smallest 6 A power modules, supplying a power density of nearly 1A per 1 mm<sup>2</sup> of area". The magnetic packaging technology includes an integrated power inductor with proprietary, newly engineered material. As a result, engineers can now reduce temperature and radiated emissions while reducing both board space and system power losses. This is especially important in applications such as data centers, where electricity is the biggest cost factor, with some analysts predicting a 100% increase in demand for power by the end of the decade.	16.07.2024 12:30:00	Jul	news_2024-08-01_16.jpg	\images\news_2024-08-01_16.jpg	https://news.ti.com/2024-07-16-TI-pioneers-new-magnetic-packaging-technology-for-power-modules,-cutting-power-solution-size-in-half	ti.com
3-Phase Brushless Gate Driver with Power Module and Sleep Mode	Microchip has launched the MPC8027, a 3-phase brus...	12045	Product Release	3-Phase Brushless Gate Driver with Power Module and Sleep Mode	Microchip has launched the MPC8027, a 3-phase brushless gate driver module with a typical sleep-mode current of 5 µA. MCP8027 integrates three half-bridge drivers to drive external NMOS/NMOS transistor pairs configured to drive a 3-phase BLDC motor, a comparator, a voltage regulator to provide bias to a companion microcontroller, power monitoring comparators, an overtemperature sensor, two level translators and three operational amplifiers for motor current monitoring. The MCP8027 buck converter is capable of delivering 750 mW of power - may be disabled if not used - for powering a companion microcontroller. The onboard 5 V and 12 V LDO regulators are capable of delivering 30 mA of current. The MCP8027 operation is specified over a temperature range of -40°C to +150°C. Package options include the 40-lead 5x5 QFN and 48-lead 7x7 TQFP. For 100 ms the transient voltage tolerance is 48 V. Thermal warning and shutdown are also integrated.	15.07.2024 06:30:00	Jul	news_2024-08-01_10.jpg	\images\news_2024-08-01_10.jpg	https://www.microchip.com/en-us/product/MCP8027	microchip.com
Hyperfast Recovery Rectifiers in D²PAK	Nexperia released 650 V ultra- and hyperfast recov...	12053	Product Release	Hyperfast Recovery Rectifiers in D²PAK	Nexperia released 650 V ultra- and hyperfast recovery rectifiers in D²PAK Real-2-Pin (R2P) packaging for use in various automotive, industrial and consumer applications including charging adapters, photovoltaic, inverters, servers and switched mode power supplies. Combining planar die technology with a state-of-the-art junction termination (JTE) design, these rectifiers offer high power density, fast switching times with soft recovery and excellent reliability. They are encapsulated in a D<sup>2</sup>PAK Real-2-Pin Package (SOT8018), which offers the same package outline as the standard D<sup>2</sup>PAK package but has only two pins instead of three (the middle cathode pin has been removed). This increases the pin-to-pin distance from 1.25 mm to over 4 mm, which allows to meet the creepage and clearance requirements stated in the IEC 60664 standard.	10.07.2024 14:30:00	Jul	news_2024-08-01_18.jpg	\images\news_2024-08-01_18.jpg	https://www.nexperia.com/about/news-events/press-releases/Nexperia-s-650-V-ultra--and-hyperfast-recovery-rectifiers-in-D2PAK-Real-2-Pin-packaging-offer-high-efficiency-and-reliability	nexperia.com
Opening of Wafer Testing Site in Malaysia	Melexis has opened its largest wafer testing site ...	12042	Industry News	Opening of Wafer Testing Site in Malaysia	Melexis has opened its largest wafer testing site worldwide in Kuching, Sarawak, Malaysia. This expansion also increases Melexis' presence in the Asia-Pacific region. The expansion in Malaysia is said to allow the company to fulfil the growing global demand for semiconductors, which is expected to double in the next decade. It hosts 90 semiconductor wafer test equipments used to test ICs. Melexis will use the site for edge sensors and edge drivers aimed at current and future applications in the mobility, sustainability, robotics, and health areas. Placing the facility in Kuching - Sarawak - Malaysia, member of the Association of Southeast Asian Nations (ASEAN), between Eastern and Western markets and next to X-FAB's wafer foundry, one of Melexis' key suppliers, is a strategic move to streamline logistics and help reducing the company's ecological footprint. The 4-storey building, designed by, both award-winning, Belgian architect Sebastian Mortelmans and Sarawakian architects DNA, covers a ground surface of 4,500 square metres, making it the largest Melexis wafer testing site worldwide. The modern design referencing local longhouse architecture, incorporates energy-saving systems including a solar installation that can generate 30.000 kWh per month. The facility is designed with future expansions in mind.	10.07.2024 12:00:00	Jul	news_2024-08-01_7.jpg	\images\news_2024-08-01_7.jpg	https://www.melexis.com/en/news/2024/10jul2024-melexis-opens-its-largest-wafer-testing-site-worldwide-in-malaysia	melexis.com
Analog-Digital Fusion Control Power Supply Solution	Rohm has established LogiCoA™, a power suppl...	12050	Product Release	Analog-Digital Fusion Control Power Supply Solution	Rohm has established LogiCoA™, a power supply solution for small to medium power industrial and consumer equipment (30 W to 1 kW class). It provides the same functionality as fully digital control power supplies at low power consumption and cost equivalent to analog power types. The LogiCoA power solution leverages the strengths of both analog and digital technologies. Low power LogiCoA MCUs are utilized to facilitate control of a variety of power supply topologies. The LogiCoA brand embodies a design philosophy of fusing digital elements to maximize the performance of analog circuits. Rohm claims that its LogiCoA power solution is "the industry's first analog-digital fusion control power supply that combines a digital control block" centered around the LogiCoA MCU with analog circuitry comprised of silicon MOSFETs and other power devices. The evaluation reference design REF66009 allows users to experience the LogiCoA power supply solution in a non-isolated buck converter circuit. Various tools necessary for evaluation are also offered, including circuit diagrams, PCB layouts, parts lists, sample software, and support documents, while actual device evaluation is possible using the optional EVK-001 evaluation board.	10.07.2024 11:30:00	Jul	news_2024-08-01_15.jpg	\images\news_2024-08-01_15.jpg	https://www.rohm.com/news-detail?news-title=2024-07-10_news_logicoa&defaultGroupId=false	rohm.com
Several Changes in Management	After more than 25 years at Schurter, the current ...	12037	People	Several Changes in Management	After more than 25 years at Schurter, the current Managing Director (MD), Rolf Hausheer, will retire at the end of 2024. He handed over the position of MD of Schurter AG to Steffen Lindner on 1 July 2024. Steffen Lindner is already acting as the General Manager & Vice President EMEA. Rolf Hausheer's career at Schurter began in April 1999 as the Head of Procurement. As of 2009, he was appointed to the management team, taking responsibility for Supply Chain Management, including Sourcing, Customer Service, and Warehouse. Since February 2024, Rolf Hausheer has been leading Schurter AG as MD ad interim. Despite the additional responsibility as MD, he retained leadership of Supply Chain Management and supported the strategic direction of the company as Co-Program Management Officer. Furthermore, as of July 2024, Steffen Lindner has assumed the role of MD of Schurter AG. He already manages the Schurter group company in Germany and oversees all company activities in EMEA, including Product Management, Engineering, Sales, and Production. Simultaneously, responsibility for Supply Chain Management has been handed over to Oswald Fiegl, the acting COO. Rolf Hausheer is now focusing on organizational projects within the company's strategy.	10.07.2024 07:00:00	Jul	news_2024-08-01_2.jpg	\images\news_2024-08-01_2.jpg	https://www.schurter.com/en/news/handover-at-schurter-ag	schurter.com
Faster Development Processes for DC Charging Stations	The charging controller developer Vector Informati...	12024	Industry News	Faster Development Processes for DC Charging Stations	The charging controller developer Vector Informatik and AST International are now offering a joint solution for the development of DC charging stations. The compatibility of the communication protocols of the Vector charging controller vSECC and the AST DC meter is ensured, which enables charging station manufacturers to offer a convenient plug-and-play solution. This shortens development times and enables complete integration. Vector's vSECC controllers control the charging communication between electric vehicles, charging station components and backend systems and support common charging standards such as CCS, NACS, CHAdeMO and MCS. The AST DC Meters provide continuous precise measurements for fast charging stations, megawatt charging systems and DC wallboxes. They are certified according to German, European and North American calibration law requirements.	09.07.2024 14:00:00	Jul	news_2024-07-15_9.jpg	\images\news_2024-07-15_9.jpg	https://www.ast-international.com/en.news.faster-development-processes-for-dc-charging-stations-thanks-to-partnership-between-vector-informatik-and-ast-international.html	ast-international.com
Scalable Industry 4.0-ready Zero-Downtime Industrial Power Supply Series	The CPS-i series from CAMTEC Power Supplies is bas...	12067	Product Release	Scalable Industry 4.0-ready Zero-Downtime Industrial Power Supply Series	The CPS-i series from CAMTEC Power Supplies is based on a specific steering and control architecture. It is designed for testing automation and high-end industrial lab power supply users. It supports production process planners as well as energy and water infrastructure or UPS-system engineers. It offers free scalability from 2000 W up to 105 kW power output, accompanied by flexible up- and downscaling and service by the customer himself. The CPS-I series connects up to 35 power supply units to form a large (DC grid) network by configuring master-slave-master to slave systems. With its modular design it is possible to scale this system to the required power. If the power supply units are decoupled from each other, the result will be independent systems, which can then be used stand-alone or in new arrangements, provided one inexpensive power supply unit is added to each new block. Configuration and maintenance are achieved via web browser. Defect LAN interfaces can be replaced by the system operator himself, as the interfaces recognize the power supply unit on their own and calibrate themselves. Defect devices, therefore, don't have to go back to the service unit, but can be repaired on-site.	09.07.2024 13:30:00	Jul	news_2024-08-15_13.jpg	\images\news_2024-08-15_13.jpg	https://www.camtec-powersupplies.com/	camtec-powersupplies.com
Battery Protector Series to Prevent Li-ion Battery Pack Damage	Littelfuse announced the extension of its ITV2718 ...	12049	Product Release	Battery Protector Series to Prevent Li-ion Battery Pack Damage	Littelfuse announced the extension of its ITV2718 surface-mountable Li-ion battery protector series. These fuses safeguard Li-ion battery packs against overcurrent and overcharging (overvoltage) conditions - even when fast charging. The latest addition, the ITV2718, provides a five-amp, three-terminal fuse in a 2.7 mm x 1.8 mm footprint. The design utilizes an embedded fuse and heater element combination to respond quickly, interrupting the battery pack's charging or discharging circuit before overcharging or overheating conditions occur. The ITV2718 Battery Protector is suited for a wide range of consumer electronics applications, including game consoles, E-call, portable routers and modems, smartphones, notebooks and tablets. It meets industry safety requirements via UL and TÜV certifications for faster compliance approval while being halogen-free and RoHS compliant environmentally friendly components.	09.07.2024 10:30:00	Jul	news_2024-08-01_14.jpg	\images\news_2024-08-01_14.jpg	https://www.littelfuse.com/about-us/news/news-releases/2024/littelfuse-adds-itv2718-5-amp-rated-battery-protector-series-to-prevent-li-ion-battery-pack-damage.aspx	littelfuse.com
Optocoupler Series expanded with Opto-TRIACs	Würth Elektronik now offers a solution for phase c...	12054	Product Release	Optocoupler Series expanded with Opto-TRIACs	Würth Elektronik now offers a solution for phase control of AC loads, the WL-OCTR optocouplers, a safe alternative to mechanical relays. The TRIAC optocouplers are particularly suitable for use in lamp dimming functions and AC motor drivers in household appliances. They can also be used as drivers for high-current TRIACs. These optocouplers are available with and without a zero-cross function to shift the TRIAC switch-on point. The portfolio includes both THT and SMT designs in DIP4, DIP6 and SOP4 packages and offers trigger currents of 5, 10 or 15 mA. A CTI (Comparative Tracking Index) value (describing leakage current stability) of over 500 and insulation voltages of 3750 or 5000 V for the THT and SMT designs makes the optocouplers well-suited for circuit protection. Like all optocouplers from Würth Elektronik, the newest addition to the optocoupler portfolio is certified to all necessary standards: UL1577, EN IEC 60747-5-5 VDE 0884-5, CQC GB 4941.1-2022.	04.07.2024 15:30:00	Jul	news_2024-08-01_19.jpg	\images\news_2024-08-01_19.jpg	https://www.we-online.com/en/news-center/press/press-releases?d=optocoupler-series-with-Opto-TRIACs	we-online.com
New Building for more SiC Wafer Production Space	In an important step towards strengthening the sem...	12018	Industry News	New Building for more SiC Wafer Production Space	In an important step towards strengthening the semiconductor industry and promoting sustainable technologies, SiCrystal will create additional production space in the north-east of Nuremberg, directly opposite the existing site. The new building will offer an additional 6,000 square meters of production space and will be equipped with state-of-the-art technology to further optimize the production of silicon carbide wafers. The close proximity to the existing plant will ensure close integration of the production processes. SiCrystal's total production capacity, including the existing building, will be approximately three times higher in 2027 than in 2024. "This groundbreaking ceremony marks an important milestone for SiCrystal and underlines our commitment to the metropolitan region. In this way, we can continue to supply innovative products of the highest quality for our customers in the future and make a positive contribution to global sustainability. ", said Dr. Erwin Schmitt, COO of SiCrystal. "With the additional production capacities, we will strengthen our market position and make an important contribution to technological development in the semiconductor industry."	04.07.2024 08:00:00	Jul	news_2024-07-15_3.jpg	\images\news_2024-07-15_3.jpg	https://www.sicrystal.de/index.php/de/news	sicrystal.de
Experts for WBG-Testing Acquired	After receiving approval from the British and Ital...	12020	Industry News	Experts for WBG-Testing Acquired	After receiving approval from the British and Italian governments, Microtest Group announces the acquisition of ipTEST. ipTEST specializes in testing silicon carbide and gallium nitride semiconductors, with locations in Guildford (UK) and Ipoh (Malaysia) and reported €22 million in revenue in 2023. This transaction marks the fourth acquisition for the Group in just over a year - following the 2023 acquisitions of the Dutch company Test Inspire, the German company RoodMicrotec and the Italian company GEDEC. This move is part of the growth and international development strategy launched in 2022 with the support of Xenon Private Equity, aiming to make Microtest the European reference point for chip design (ASIC), test systems and in the testing of microchips on package and silicon wafers. From an industrial perspective, integrating ipTEST will bring significant expertise in innovative device development, such as the new DS5, which won the prestigious King's Award for Enterprise in 2023 and 2024 for silicon carbide and gallium nitride semiconductor testing. These frontier semiconductors are crucial for managing electric vehicle batteries and inverters, with expected growth of over 30% annually in the next five years due to the ongoing energy transition. This acquisition will enable Microtest to serve power microchip manufacturers making substantial investments to meet new sector demands, including the main IDM’s in the industry ST Microelectronics, Infineon and Wolfspeed.	03.07.2024 10:00:00	Jul	news_2024-07-15_5.jpg	\images\news_2024-07-15_5.jpg	https://www.microtest.net/microtest-group-acquires-iptest/	microtest.net
Technology Acquisition Expands Power Management Solutions	GlobalFoundries announced that it has acquired Tag...	12017	Industry News	Technology Acquisition Expands Power Management Solutions	GlobalFoundries announced that it has acquired Tagore Technology’s proprietary and production proven Power Gallium Nitride (GaN) IP portfolio, a high-power density solution designed to push the boundaries of efficiency and performance in a wide range of power applications in automotive, internet of things (IoT) and artificial intelligence (AI) datacenter. As the digital world continues to evolve with technologies like Generative AI, GaN stands out as a pivotal solution for sustainable and efficient power management particularly in datacenters. The announcement reinforces GF’s commitment to large-scale manufacturing of GaN technology that offers a suite of benefits to help datacenters meet the increasing power demands while maintaining or improving power efficiency, reducing costs and managing heat generation. The acquisition expands GF’s power IP portfolio and broadens access to GaN IP that will enable GF customers to quickly bring differentiated products to market. As a part of the acquisition, a team of experienced engineers from Tagore, dedicated to the development of GaN technology, will be joining GF. “We are committed to being the foundation of our customers’ power applications today and for decades to come,” said Niels Anderskouv, chief business officer at GF. “With this acquisition, GF takes another step toward accelerating the availability of GaN and empowering our customers to build the next generation of power management solutions that will reshape the future of mobility, connectivity and intelligence.”	01.07.2024 07:00:00	Jul	news_2024-07-15_2.jpg	\images\news_2024-07-15_2.jpg	https://gf.com/gf-press-release/globalfoundries-acquires-tagore-technologys-gan-technology-to-accelerate-disruptive-powermanagement-solutions/	gf.com
Open for Proposals for Power Event	APEC now accepts Professional Education Seminar Pr...	12041	Event News	Open for Proposals for Power Event	APEC now accepts Professional Education Seminar Proposals for APEC 2025, which will take place March 16-20, 2025 at the Georgia World Congress Center in Atlanta, GA (USA). APEC continues the tradition of focusing on the practical aspects of the power electronics profession; the Professional Education Seminars at APEC 2025 will address the need for in-depth discussions of important and complex power electronics topics. Each seminar combines practical application with theory designed to further educate the working professional in power electronics or related fields. Topics are to address the practical issues of the specification, design, manufacture and marketing of power electronic components, products, and systems. Proposals focusing on, but not limited to, any of the following areas of power electronics are welcome. All the relevant details can be found the APEC website, including submission requirements and additional details.	28.06.2024 11:00:00	Jun	news_2024-08-01_6.jpg	\images\news_2024-08-01_6.jpg	https://apec-conf.org/speakers/seminar-speaker-info/	apec-conf.org
Attracting more People to Careers in the Semiconductor Industry	The CHIPS of Europe (Creating Higher-Education Ind...	12039	Industry News	Attracting more People to Careers in the Semiconductor Industry	The CHIPS of Europe (Creating Higher-Education Industry Programmes for the Semiconductor Industry of Europe) project is addressing the shortage of workforce in the EU semiconductor industry. In the next four years industry and academia will work together to increase the attractiveness of semiconductor-related study programs and careers. The need for more skilled workers in the EU semiconductor industry has increased due to the new investments via the EU Chips Act. If no action is taken, the EU semiconductor industry will face a shortage of 350,000 workers by 2030. CHIPS of Europe intends to increase the attractiveness of semiconductor-related study programmes and careers. It brings together large companies and small and medium-sized enterprises, such as Infineon, Imec, X-Fab, Cadence, Nextnano, and universities. The project includes partners from fascinating application fields such as medical and space which touch on the hearts and minds of future workforce. Involving 14 full and 7 associated partners from 10 countries spread across Europe, the project employs targeted measures in order to leave a sustainable impact on the European semiconductor ecosystem. The CHIPS of Europe project is co-funded by the European Union (Digital Europe – Reinforcing skills in semiconductors) semiconductor ecosystem. There will also be summer schools at fabs and virtual labs.	28.06.2024 09:00:00	Jun	news_2024-08-01_4.jpg	\images\news_2024-08-01_4.jpg	https://www.ecpe.org/research/chips-of-europe/chips-of-europe/	ecpe.org
Charity Benefit from PCIM Booth for Education in Ecuador	Vincotech staged a charity benefit at the PCIM Eur...	11986	Industry News	Charity Benefit from PCIM Booth for Education in Ecuador	Vincotech staged a charity benefit at the PCIM Europe trade fair to raise funds for the NGO Plan International Germany. Visitors rose to this virtual reality (VR) challenge. Vincotech and its partners rewarded their efforts by donating €15,000 to a project to support young Ecuadorians. Vincotech has a history of hosting charity events at PCIM Europe. Ranging from wall climbing to Sudoku, these activities have been a big hit with fairgoers. This year’s event – a VR flight over mountainous terrain – was yet another audience magnet. Hundreds of PCIM Europe visitors (including a Bodo’s Power System editor) took up the challenge, with Vincotech matching all pledges to raise €15,000 for a Plan International Germany project in Ecuador. The money goes to support youngsters, especially girls, in ten communities each in the Cotopaxi and Santa Elena regions. It funds projects to convey entrepreneurial, digital, and soft skills that will help them get off to a better start in professional life, as well as health services for mothers and children. This project, which involves 2,000 individuals directly and indirectly benefits nearly 6,000 community members, is a certainly a winning proposition young Ecuadorians in the region. Plan International is an independent organization, with no religious, political or governmental affiliations, standing up for children’s rights worldwide and striving to be open, accountable and honest in what the NGO does.	27.06.2024 16:00:00	Jun	news_2024-07-01_10.jpg	\images\news_2024-07-01_10.jpg	https://www.vincotech.com/news/company-news/article/vincotechs-pcim-booth-raises-eur15000-for-project.html	vincotech.com
Connecting Engineers to the Future of EV/HEV Technology	Mouser Electronics explores the latest development...	12023	Industry News	Connecting Engineers to the Future of EV/HEV Technology	Mouser Electronics explores the latest developments, advancements and challenges in electric and hybrid vehicle technology through its EV/HEV resource hub. Staying ahead in this rapidly evolving industry is crucial for engineers and innovators. With advancing technologies like bi-directional charging and vehicle autonomy entering the market, it's more important than ever to stay up to speed. Mouser's EV/HEV resource hub offers a wealth of engaging content, including eBooks, blogs, articles, products, and more, all designed to keep engineers at the forefront of these technological advancements. Electric infrastructure is advancing with the use of emerging technologies, such as liquid-cooled HPC connectors, while still maintaining the latest industry standards and lowering maintenance costs. This development empowers the future of eMobility, as discussed in Mouser's interactive content series <i>“Electrifying the Future of eMobility”</i>, exploring how current renewable energy sources and evolving technologies like hydrogen electrolysis are driving toward a net-zero future. The EV/HEV technology content hub offers engineers access to resources from Mouser's technical team and leading manufacturers. In a recent eBook with TE Connectivity, <i>“EV and Connected Transportation”</i>, industry experts explain the tandem movement of e-mobility and connected travel via new standards and the use of the V2X ecosystem to make more efficient, accurate, and safer roads for vehicles.	27.06.2024 13:00:00	Jun	news_2024-07-15_8.jpg	\images\news_2024-07-15_8.jpg	https://eu.mouser.com/newsroom/publicrelations-application-resource-ev-hev-2024final/	mouser.com
Power Factor Correction: Chokes with High-Current Offerings	ITG Electronics has expanded its portfolio of powe...	12046	Product Release	Power Factor Correction: Chokes with High-Current Offerings	ITG Electronics has expanded its portfolio of power factor correction chokes (PFCs) with a set of solutions designed for comparatively high-wattage applications. The company's PFC383637B Series solutions can handle up to 3,300 W and include CCM PFC boost converters with switching frequencies from 60 to 200 kHz. An extension of ITG Electronics' Cubic Design set of power factor correction chokes, PFC383637B Series solutions are suitable for Inductance ranges from 180 – 360 µH at footprints up to 37.5 mm x 36.5 mm with maximum heights of 36 mm. Compared with traditional toroidal-shaped PFC chokes, the PFC383637B Series features a flat wire and square core construction to save space and increase power density. The solutions are up to 50% smaller compared to toroidal-shaped PFC chokes with similar power ratings, and their flat wire technology can reduce DC resistance by as much as 40%, leading to substantially lower copper losses. The PFC383637B Series of PFC chokes is applicable for AC to DC conversion in industrial, equipment and automotive applications. Notably, the high-current output chokes can handle up to 32.4 A with approximately 50% roll off.	27.06.2024 07:30:00	Jun	news_2024-08-01_11.jpg	\images\news_2024-08-01_11.jpg	https://www.itg-electronics.com/en/category/4	itg-electronics.com
electronica 2024: Answers to the major Challenges facing the Automotive Industry	From connected mobility to autonomous driving or s...	12019	Event News	electronica 2024: Answers to the major Challenges facing the Automotive Industry	From connected mobility to autonomous driving or sustainability – the automotive industry is facing major challenges on its path to digitalization and electrification. The most important companies in the electronics industry will network with the automotive industry and shape the future at the international platform electronica 2024 from November 12 to 15, 2024 in Munich. Despite the discontinuation of subsidies and the lack of infrastructure in some areas, the future belongs to electric drives, and electrification is progressing around the world in all vehicle classes. The software, battery and electronics industries play key roles here. When it comes to batteries, future technologies such as solid-state batteries with a higher energy density will set new standards in terms of charging time, range, fire safety and cost efficiency. In addition, electronica 2024 will focus primarily on the electronic components, technologies and solutions required for the mobility transition. Silicon carbide (SiC) and gallium nitride (GaN) semiconductors with a wide bandgap, for example, are being used more and more in electric drives due to their high efficiency level and energy efficiency, and they are becoming even more powerful. There is a further increase in the switching frequency in inverters, which boosts driving comfort and energy efficiency.	26.06.2024 09:00:00	Jun	news_2024-07-15_4.jpg	\images\news_2024-07-15_4.jpg	https://electronica.de/en/trade-fair/journalists/press-releases/detail/answers-to-the-major-challenges-facing-the-automotive-industry.html	electronica.de
Call for Industry Session Proposals and for Plenary Session Topics and Speakers	APEC 2025, to be held next year in Atlanta, Georgi...	12016	Event News	Call for Industry Session Proposals and for Plenary Session Topics and Speakers	APEC 2025, to be held next year in Atlanta, Georgia, March 16-20, announces the call for submission of proposals for the conference’s popular Industry Session series. The Industry Session component of the conference is intended to encourage content from industry practitioners. Industry Session (IS) speakers are invited to make a presentation only, avoiding the formality of writing the papers for IEEE Xplore publication. IS tracks run in parallel with APEC Technical Sessions and the presentations are included for download by paid APEC attendees. The deadline for submission of proposals is August 23rd. Industry Session proposals may be submitted for an individual speaker presentation or for an overall session proposal. The total time allowed for each presentation is 25 minutes, including 5 minutes for Q and A. To submit a proposal for an Industry Session at APEC, presenters should prepare a 2-3-page proposal that provides a summary of the presentation content and a description of the target audience. Also, a short professional biography of the speaker should be included. If proposing for a full session, a proposal for each of the individual presentations must be submitted. Presentations should have strong technical content and commercial references should be limited and only in support of the core content.	26.06.2024 06:00:00	Jun	news_2024-06-01_2.jpg	\images\news_2024-06-01_2.jpg	https://apec-conf.org/speakers/is-presenter-info/	apec-conf.org
Collaboration between Semiconductor Manufacturer and Power Supply Provider	Texas Instruments (TI) announced a long-term colla...	11980	Industry News	Collaboration between Semiconductor Manufacturer and Power Supply Provider	Texas Instruments (TI) announced a long-term collaboration with Delta Electronics, a global power and energy management manufacturer, to create next-generation electric vehicle (EV) onboard charging and power solutions. This work will leverage both companies’ research and development capabilities in power management and power delivery in a joint innovation laboratory in Pingzhen, Taiwan. Together, TI and Delta aim to optimize power density, performance and size to accelerate the realization of safer, faster-charging and more affordable EVs. Phase one for the collaboration focuses on Delta’s development of a lighter-weight, cost-effective 11 kW onboard charger, using TI’s latest C2000™ real-time microcontrollers and TI’s active EMI filter products. The companies are working together using TI’s products to reduce the charger’s size by 30% while achieving up to 95% power conversion efficiency. In phase two, TI and Delta will leverage the latest C2000 real-time MCUs for automotive applications to enable automakers to achieve automotive safety integrity levels (ASILs) up to ASIL D, which represents the strictest automotive safety requirements. Highly integrated automotive isolated gate drivers will further enhance the power density of onboard chargers, while also minimizing overall solution size. In phase three, the two companies will collaborate to develop the next generation of automotive power solutions by using GaN technology.	21.06.2024 10:00:00	Jun	news_2024-07-01_4.jpg	\images\news_2024-07-01_4.jpg	https://news.ti.com/2024-06-21-Texas-Instruments-and-Delta-Electronics-announce-collaboration-to-advance-electric-vehicle-onboard-charging	ti.com
Acquisition of GaN Manufacturer completed	Renesas Electronics has completed the acquisition ...	11982	Industry News	Acquisition of GaN Manufacturer completed	Renesas Electronics has completed the acquisition of Transphorm, a company which concentrates its activities on GaN power semiconductors, as of June 20, 2024. With the closing of the acquisition now completed, Renesas will immediately start offering GaN-based power products and related reference designs to meet the rising demand for wide bandgap semiconductor products. Investing in the power business is an important part of Renesas’ strategy for achieving sustainable, long-term growth. Other recent moves that Renesas has made to bolster this market segment include: the opening of the Kofu Factory, a dedicated 300-mm wafer fab for power products; ramping up a new SiC production line at the Takasaki Factory; and forging an agreement with Wolfspeed to secure a steady supply of SiC wafers over the next 10 years. With GaN technology now part of Renesas’ portfolio, Renesas is poised to offer more comprehensive power solutions to support the evolving needs of customers across a broad range of applications. On the same day that it completed the acquisition of Transphorm, Renesas rolled out 15 market-ready reference designs that combine the new GaN products with Renesas’ embedded processing, power, connectivity and analog portfolios. These include the designs of Transphorm’s automotive-grade GaN technology integrated for on-board battery chargers as well as 3-in-1 powertrain solutions for EVs. Transphorm was founded in 2007 in Goleta, California.	20.06.2024 12:00:00	Jun	news_2024-07-01_6.jpg	\images\news_2024-07-01_6.jpg	https://www.renesas.com/us/en/about/press-room/renesas-completes-acquisition-transphorm	renesas.com
700 V GaN Power Transistors	Infineon introduces the CoolGaN™ Transistor ...	12030	Product Release	700 V GaN Power Transistors	Infineon introduces the CoolGaN™ Transistor 700 V G4 product family. The devices are intended for power conversion in the voltage range up to 700 V. In contrast to other GaN products on the market, the input and output figures-of-merit of these transistors are claimed to “provide a 20 percent better performance, resulting in increased efficiency, reduced power losses, and more cost-effective solutions”. The combination of electrical characteristics and packaging allows the usage in applications such as consumer chargers and notebook adapters, data center power supplies, renewable energy inverters, and battery storage. The product series comprises 13 devices with a voltage rating of 700 V and on-resistance range from 20 m&ohm; to 315 m&ohm;. The increased granularity in device specification, combined with several industry standard package options including PDFN, TOLL and TOLT allow R <sub>DS</sub> resistance and packages to be selected according to application requirements. The devices are “characterized by a fast turn-on and turn-off speed and minimal switching losses”. The on-resistance range enables power systems from 20 W to 25,000 W. In addition, the 700 V E-mode with the industry's highest transient voltage of 850 V increases the reliability of the overall system as it offers greater robustness against anomalies in the user environment such as voltage peaks.	20.06.2024 11:30:00	Jun	news_2024-07-15_15.jpg	\images\news_2024-07-15_15.jpg	https://www.infineon.com/cms/en/about-infineon/press/market-news/2024/INFPSS202406-120.html	infineon.com
Distributor receives ISO 27001 Certification	DigiKey has added ISO 27001 certification to its d...	11981	Industry News	Distributor receives ISO 27001 Certification	DigiKey has added ISO 27001 certification to its data security program. With this certification, the company builds upon its commitment and ability to manage information securely and safely for its customers, suppliers and partners. ISO 27001 is the international industry standard for information security management systems. It assures customers, suppliers and employees of DigiKey's commitment to safeguarding information following industry best practices. In addition to ISO 27001 certification, DigiKey’s information security program offers customers and suppliers access to other robust tools such as multi-factor authentication (MFA) to protect accounts from fraud and unauthorized access.	20.06.2024 11:00:00	Jun	news_2024-07-01_5.jpg	\images\news_2024-07-01_5.jpg	https://www.digikey.com/en/news/press-releases/2024/june/digikey-receives-iso-27001-certification-adding-to-robust-information-security-program	digikey.com
Redundant analog TMR angle Sensor for safety-relevant Applications	TDK launched the tunnel-magnetoresistance (TMR) an...	11991	Product Release	Redundant analog TMR angle Sensor for safety-relevant Applications	TDK launched the tunnel-magnetoresistance (TMR) angle sensor TAS8240 sensor for automotive and industrial applications. It is available in both compact QFN16 (3 x 3 mm<sup>2</sup>) and TSSOP16 (5 x 6.4 mm<sup>2</sup>) packages, offering four redundant analog single-ended SIN/COS outputs. TAS8240 is a redundant TMR-based sensor consisting of 4 x Wheatstone bridges for angle detection at an angle accuracy of ±1.0° in an ambient temperature range of -40 °C to +150 °C. As a 360° angle sensor, the TAS8240 is suited to accurately measure the rotor position of BLDC motors used in safety critical applications such as power steering, brake boosters, or traction motors. The sensor contains four pairs of TMR half bridges and provides four separated SIN/COS outputs by applied magnetic field in the x-y plane. Higher system safety levels up to ASIL D can be achieved while offering higher availability of position information, even in case of a failure of one of the output signals. Depending on system architectures, fail-operational concepts can also be supported by the new sensor. The angle accuracy of the sensor remains stable at different temperatures and over the sensor’s lifetime. It provides redundant rotor position measurement needed in safety-relevant applications like power steering motors.	20.06.2024 10:30:00	Jun	news_2024-07-01_15.jpg	\images\news_2024-07-01_15.jpg	https://www.tdk.com/en/news_center/press/20240620_01.html	tdk.com
APEC 2025 Announces Call for Technical Program Paper Digest Submissions	APEC 2025, to be held in Atlanta, Georgia, from Ma...	11976	Event News	APEC 2025 Announces Call for Technical Program Paper Digest Submissions	APEC 2025, to be held in Atlanta, Georgia, from March 16-20, 2025, continues the long-standing tradition of addressing issues of immediate and long-term interest to the practicing power electronics engineer. APEC is now accepting paper digest submissions for the Technical Program. Interested authors wishing to present a paper must submit a digest for consideration by August 2, 2024. Instructions for submissions are available at: https://apec-conf.org/speakers/ts-author-info/<br>Prospective authors of Technical Program papers are asked to submit a digest explaining the problem that will be addressed by the paper, its major results and how it is different from the closest existing literature. Technical Program Papers presented at APEC must be original material and not have been previously presented or published. The principal criteria used by reviewers in selecting digests for the program will be the usefulness of the work to the practicing power electronics professional. They also value evidence of completed experimental work. Authors should obtain any necessary company and governmental clearance prior to submission of digests. Authors will be notified of the decision of paper acceptance on September 26, 2023. Accepted papers in final form must be submitted and author registration completed by November 3, 2023.	20.06.2024 06:00:00	Jun	news_2024-06-01_2.jpg	\images\news_2024-06-01_2.jpg	https://apec-conf.org/speakers/ts-author-info/	apec-conf.org
Modern Semiconductor Technology for the Automotive Industry	Vishay Siliconix Itzehoe celebrated the topping-ou...	12035	Industry News	Modern Semiconductor Technology for the Automotive Industry	Vishay Siliconix Itzehoe celebrated the topping-out ceremony for its new 300mm wafer fab, a significant milestone in the comprehensive expansion of the site. Representatives from business, politics and the workforce took part in this important event, which marks progress towards the completion and commissioning of the new production facility. Leif Henningsen, Managing Director of Vishay Siliconix Itzehoe GmbH, and Jeff Webster, Chief Operating Officer of Vishay Intertechnology, thanked all those involved in the construction and employees on behalf of the entire Vishay management for completing the shell of the building on schedule. Julia Carstens, State Secretary in the Schleswig-Holstein Ministry of Economic Affairs, and District Administrator Claudius Teske emphasized the great economic importance of the new factory for the region. It will create 150 new jobs and significantly strengthen the local economy. The heart of the new production facility is a 4,000 m<sup>2</sup> clean room, which is constantly operated at 22 degrees Celsius and 43% humidity. The fully digital factory is designed for the use of artificial intelligence and state-of-the-art automation technology. This ensures the consistently high quality for which Vishay is renowned. "We are building one of the most modern and efficient factories in the world in our technology segment," emphasizes Jeff Webster. The expansion is part of Vishay Intertechnology's global growth program.	19.06.2024 16:30:00	Jun	news_2024-07-15_20.jpg	\images\news_2024-07-15_20.jpg	https://www.vishay.com/	vishay.com
Medium Voltage for Resource Efficiency in PV Plants	Enormous quantities of raw materials are required ...	12021	Industry News	Medium Voltage for Resource Efficiency in PV Plants	Enormous quantities of raw materials are required for the conversion of the energy system, for example, in the form of copper and aluminum cables to connect renewable generators to the grid. One promising approach to save raw materials is to move from the low to the medium-voltage level in renewable energy power plants. The Fraunhofer Institute for Solar Energy Systems ISE sees a huge potential for savings with higher system voltages, especially in large PV power plants. The institute is planning first pilot power plants with this technology and is aiming for a broad market launch together with industry. To kick-off its research topic "Medium Voltage – A Resource-Efficient Way to Interconnect", Fraunhofer ISE presented a medium-voltage PV string inverter and a medium-voltage battery inverter at the Smarter E trade fair in Munich. The move to medium voltage (MV) was first made possible by the development of high voltage silicon carbide (SiC) components with high switching speeds. SiC components up to 3.3 kV are now available on the market. In 2023, Fraunhofer ISE developed the world's first medium-voltage photovoltaic (MS-PV) string inverter in the "MS-LeiKra" project and successfully put it into operation on the grid. The two-stage inverter has an output voltage of 1,500 V<sub>AC</sub> at a power of 250 kVA.	19.06.2024 11:00:00	Jun	news_2024-07-15_6.jpg	\images\news_2024-07-15_6.jpg	https://www.ise.fraunhofer.de/en/press-media/press-releases/2024/fraunhofer-ise-goes-with-medium-voltage-for-resource-efficiency-in-pv-plants.html	ise.fraunhofer.de
SiC Manufacturing Facility planned to be built in Czech Republic	onsemi announced plans to establish a state-of-the...	11978	Industry News	SiC Manufacturing Facility planned to be built in Czech Republic	onsemi announced plans to establish a state-of-the-art, vertically integrated silicon carbide (SiC) manufacturing facility in the Czech Republic. The site would produce the company’s intelligent power semiconductors that are essential for improving the energy efficiency of applications in electric vehicles, renewable energy and AI data centers. onsemi’s plan to expand SiC manufacturing with a multi-year brownfield investment of up to $2 billion (44 billion CZK) is part of the company’s previously disclosed long-term capital expenditure target. This investment would build on the company’s current operations in the Czech Republic, which include silicon crystal growth, silicon and silicon carbide wafer manufacturing (polished and EPI) and a silicon wafer fab. Today, the site can produce more than three million wafers annually, including more than one billion power devices. Upon completion, the operation would contribute annually more than $270 million USD (6 billion CZK) to the country’s GDP. Pending all final regulatory and incentive approvals, this would be one of the largest private sector investments in the Czech Republic’s history and would further contribute to the prosperity and economic dynamism of the Zlín region.	19.06.2024 08:00:00	Jun	news_2024-07-01_2.jpg	\images\news_2024-07-01_2.jpg	https://www.onsemi.com/company/news-media/press-announcements/en/onsemi-selects-the-czech-republic-to-establish-end-to-end-silicon-carbide-production-for-advanced-power-semiconductors	onsemi.com
Partnering in EMC Solutions for Aerospace, Defense and Medical Electronics	Anritsu Company has partnered with Y.I.C. Technolo...	11983	Industry News	Partnering in EMC Solutions for Aerospace, Defense and Medical Electronics	Anritsu Company has partnered with Y.I.C. Technologies to develop tools that support companies performing EMC pre-compliance measurements. Anritsu’s Field Master spectrum analyzers compliment the Y.I.C EMScanners and EMViewer application software to provide a fully integrated solution. Design engineers developing advanced electronics face increased EMC challenges from high-speed data circuits and RF components. Efficient design processes necessitate early insight into the EMC performance of the circuits. The Y.I.C scanners and EMViewer software coupled with Anritsu spectrum analyzers provide a 3D heat map of all radiated signals. Circuit layout and shielding materials can be optimized before submitting the product to a certified test house, maximizing the chances of a first-time pass and minimizing repeated submissions.	18.06.2024 13:00:00	Jun	news_2024-07-01_7.jpg	\images\news_2024-07-01_7.jpg	https://www.anritsu.com/en-gb/test-measurement/news/news-releases/2024/2024-00-18-gb01	anritsu.com
Power Tradeshow in Shenzhen, China	PCIM Asia, the exhibition and conference for power...	11979	Event News	Power Tradeshow in Shenzhen, China	PCIM Asia, the exhibition and conference for power electronics, intelligent motion, renewable energy and energy management, will return to the Shenzhen World Exhibition and Convention Center from 28 – 30 August 2024. More than 80% of available booth space has already been reserved at the event’s 2024 edition, as exhibitors look to highlight their latest advancements across a wide range of market segments including e-mobility, clean energy and energy storage, wide-bandgap (WBG) devices and more. The event will facilitate industry discussion on these high-growth application areas through a series of themed forums, as well as through its industry-leading conference program. At PCIM Asia 2024, participants will find these trends and technologies explored across multiple channels, including on the exhibition floor, through a series of forums and at the PCIM Asia Conference. The event brings together industry stakeholders from throughout the power electronics supply chain – from manufacturers and suppliers to researchers and industry experts – to network, share expertise and discover new products and solutions. Alongside the main exhibition, PCIM Asia hosts a selection of concurrent forums that provide additional opportunities for learning and interaction. The Exhibitor Forums provide a platform for exhibitors to promote their latest technologies, while the Industry Forums feature invited speakers, including researchers and subject matter experts, who discuss developments, innovations and challenges in the power electronics field across selected application areas. PCIM Asia is jointly organised by Guangzhou Guangya Messe Frankfurt Co Ltd and Mesago Messe Frankfurt GmbH.	18.06.2024 09:00:00	Jun	news_2024-07-01_3.jpg	\images\news_2024-07-01_3.jpg	https://pcimasia-expo.cn.messefrankfurt.com/shenzhen/en/press/press-releases/2024/PCIM24_PR2.html	pcimasia-expo.cn
High-density Power Modules for Deep-Sea ROVs	Historically, commercial divers have taken great r...	11977	Industry News	High-density Power Modules for Deep-Sea ROVs	Historically, commercial divers have taken great risks to inspect oil and gas pipelines, high-voltage electrical cables, wind turbines and other critical infrastructure deep undersea. Saab has eliminated that risk bringing deep-sea exploration expertise to commercial underwater applications. With a mission to keep people and society safe, the Seaeye range of ROVs has been developed with more agile and modular systems designs. Saab UK’s Seaeye systems are capable of performing a wide range of tasks from observation and inspection to more complex functions like underwater maintenance. This evolution has culminated in the development of a system which is claimed to be “the world's most advanced all-electric work-class ROV (eWROV)”, which combines versatility and maneuverability. Unlike traditional hydraulic ROVs, the eWROV eliminates the need for large amounts of hydraulic fluid, thereby mitigating environmental risks. Critical specifications for the eWROV’s power converter are size, mass and thermal dissipation, given that the electronic systems are housed in sealed enclosures where space is at a premium and conventional convection cooling is not possible. To meet these requirements, Saab chose Vicor power modules for their high density and efficiency. These modules enable efficient power distribution to various eWROV subsystems such as thrusters, manipulators and onboard electronics. The use of Vicor power modules allows Saab to customize Seaeye subsystems according to specific industry-standard 24V and 48V levels required by onboard computers, sensors, video cameras, lights and navigation equipment.	18.06.2024 07:00:00	Jun	news_2024-07-01_1.jpg	\images\news_2024-07-01_1.jpg	https://www.vicorpower.com/press-room/saab-seaeye	vicorpower.com
SIC Research Cooperation between Industry and University	Sanan Semiconductor has entered into a Research Pa...	12055	Industry News	SIC Research Cooperation between Industry and University	Sanan Semiconductor has entered into a Research Partnership with the Institute for Power Electronics (LEE) at FAU Erlangen-Nürnberg university. This research will focus on advanced innovation in power electronic systems focusing on SiC technology. "Sanan Semiconductor is a vertically integrated SiC supplier with inhouse development and manufacturing of SiC substrates, epitaxial wafers, Diode/MOSFET dies and packaged products. This partnership with one of Germany's leading research institutes for SiC puts Sanan Semiconductor in a strong position", says Mr. Tony Chiang, CEO of Sanan Semiconductor. Dr. Ming-Che Kao, General Manager of Sanan Europe comments: "Europe is a key market for us, and this partnership aims at strengthening our system innovation." Dr. Ajay Poonjal Pai, Head of WBG Innovation, adds: "Compared to traditional Silicon-based technologies, SiC offers significant efficiency and power density improvements in various applications. Despite the increasing adoption of SiC in power electronic applications, several system-level barriers still inhibit the full potential of SiC. This collaboration is a step towards overcoming these barriers." Prof. Martin März, Director of the institute says, "We are pleased to have a strong partner in Sanan, whose innovative SiC devices will enable us to advance into new performance regions."	14.06.2024 06:00:00	Jun	news_2024-08-15_1.jpg	\images\news_2024-08-15_1.jpg	https://www.lee.tf.fau.de/2024/06/14/research-partnership-with-sanan/	lee.tf.fau.de
Rugged 650 V and 1200 V IGBTs	WeEn Semiconductors has introduced IGBTs with volt...	12033	Product Release	Rugged 650 V and 1200 V IGBTs	WeEn Semiconductors has introduced IGBTs with voltage ratings of 650 V and 1200 V, which incorporate a fast recovery anti-parallel diode and show “extremely low leakage currents and exceptional conduction and switching characteristics at both high and low junction temperatures”, the company says. Based on fine trench gate field-stop (FS) technology, the IGBTs are said to provide a more uniform electric field within the chip, support higher breakdown voltages and offer improved dynamic control. WeEn claims that the devices offer “optimum trade-off between conduction and switching losses, as well as an enhanced EMI design”. The IGBTs offer ratings of 650V/75A, 1200V/40A and 1200V/75A and are supplied in TO247 or TO247-4L packages depending on the selected device. All of the devices will operate with a maximum junction temperature (T<sub>j</sub>) of 175 °C and have undergone high-voltage H3TRB (high-humidity, high-temperature and high-voltage reverse bias) and 100%-biased HTRB (high-temperature reverse bias) tests up to this maximum. Target applications include solar inverters, motor control systems, uninterruptible power supplies (UPS) and welding. A positive temperature coefficient simplifies parallel operation in applications where higher performance is required, while options for bare die, discrete and module product variants provide flexibility for a wide variety of target designs.	12.06.2024 14:30:00	Jun	news_2024-07-15_18.jpg	\images\news_2024-07-15_18.jpg	https://www.ween-semi.com/en/cat/igbt	ween-semi.com
BLDC Motor Hardware-Software Combo	Power Integrations complemented its hardware-softw...	11995	Product Release	BLDC Motor Hardware-Software Combo	Power Integrations complemented its hardware-software bundle for brushless DC motors (BLDC) with BridgeSwitch™-2, a high-voltage integrated half-bridge (IHB) motor-driver IC family targeting applications up to 1 HP (746 W). The ICs, which feature high- and low-side drivers and advanced FREDFETs with integrated lossless current sensing, deliver inverter efficiency of up to 99 percent. The IHB architecture eliminates hot spots, which increases design flexibility and reliability, slashes component count and saves PCB area. BridgeSwitch-2 is supported by Power Integrations’ MotorXpert™ software suite which includes single-phase trapezoidal control and three-phase sensor-less Field Oriented Control (FOC) modules, speeding inverter development. BridgeSwitch-2 ICs handle operational exceptions in hardware, which permits the use of IEC 60730 Class A safety software, reducing certification time by months. Quiescent BLDC inverters can be ordered into sleep-mode, reducing driver power consumption to less than 10 mW; this leaves more power available under regulated standby power limits to be allocated for loads such as network access and monitoring. The IHB architecture reduces component count by 50 percent and PCB space by 30 percent over discrete designs by eliminating shunt resistors and associated signal conditioning circuits. Shunt losses are also eliminated, improving efficiency. Precise motor control is achieved with the built-in real-time reporting of phase current (IPH) information. Accurate turn-on/off gate drive and a soft-body diode result in a typical EMI profile 10 dB lower than existing drivers, so a smaller EMI filter can be selected.	11.06.2024 14:30:00	Jun	news_2024-07-01_19.jpg	\images\news_2024-07-01_19.jpg	https://investors.power.com/news/news-details/2024/Power-Integrations-Revs-Up-Motor-Drive-Offering-With-BridgeSwitch-2-BLDC-IC-Family/default.aspx	power.com
2-in-1 SiC Molded Module	Rohm Semiconductor introduced four models as part ...	11994	Product Release	2-in-1 SiC Molded Module	Rohm Semiconductor introduced four models as part of the TRCDRIVE pack™ series with 2-in-1 SiC molded modules (two 750V-rated, BSTxxxD08P4A1x4; two 1200V-rated, BSTxxxD12P4A1x1) optimized for electric vehicle traction inverters. TRCDRIVE pack supports up to 300 kW and features high power density and a unique terminal configuration, helping solve the key challenges of traction inverters in terms of miniaturization, higher efficiency, and fewer person-hours. A trademark brand for ROHM SiC molded type modules developed specifically for traction inverter drive applications, TRCDRIVE pack reduces size by utilizing a unique structure that maximizes heat dissipation area. In addition, ROHM’s 4th generation SiC MOSFETs with low ON resistance are built in, resulting in an “industry-leading power density” 1.5 times higher than that of general SiC molded modules, while contributing to the miniaturization of xEV inverters. The modules are also equipped with control signal terminals using press-fit pins, enabling easy connection by simply pushing the gate driver board from the top, considerably reducing installation time. In addition, low inductance (5.7 nH) is achieved by maximizing the current path and utilizing a two-layer bus-bar structure for the main wiring, contributing to lower losses during switching. Despite developing modules, Rohm has established a mass production system similar to discrete products, making it possible to increase production capacity by 30 times compared to conventional SiC case-type modules.	11.06.2024 13:30:00	Jun	news_2024-07-01_18.jpg	\images\news_2024-07-01_18.jpg	https://www.rohm.com/news-detail?news-title=2024-06-11_news_trcdrive-pack&defaultGroupId=false	rohm.com
16/24-Channel Automotive LED Driver	Novosense Microelectronics has developed the 16/24...	12032	Product Release	16/24-Channel Automotive LED Driver	Novosense Microelectronics has developed the 16/24-channel driver IC NSL21916/24 for automotive LED applications. It offers a variety of driving options for up to 16/24 channels and features flexible dimming and control capabilities. Target applications include rear lights, exterior lights and general automotive interior and body lighting. At PCIM 2024, NOVOSENSE provided a live demonstration of the IC in a rear lighting application. Qualified to AEC-Q100 Grade 1(T<sub>j</sub> from -40 °C to 150 °C), the NSL21916/24 supports individual control and high-side currents of up to 100 mA for each channel. A 2-bit global and 6-bit individual current setting combined with 12-bit independent PWM dimming and phase shift PWM dimming capabilities enable LED brightness control. On-board programmable EEPROM allows the same device to be configured for different applications, while a built-in UART/ digital interface supports several control and diagnostic functions. Addition of a standard CAN physical layer allows this interface to be used for long-distance, off-board communications without any impact on EMC. The NSL21916/24 is supplied in a HTSSOP38 package, has a dropout voltage of 600 mV max. (@ 50 mA) and provides multiple regulation with LED open-circuit, LED short-to-ground and single LED short-circuit diagnostics.	11.06.2024 13:30:00	Jun	news_2024-07-15_17.jpg	\images\news_2024-07-15_17.jpg	https://www.novosns.com/en/company-news-307	novosns.com
“Industry’s first GaN IPM”	Texas Instruments introduced “the industry’s first...	11993	Product Release	“Industry’s first GaN IPM”	Texas Instruments introduced “the industry’s first 650 V three-phase GaN IPM for 250 W motor drive applications”. The GaN IPM addresses many of the design and performance compromises engineers typically face when designing major home appliances and heating, ventilation and air-conditioning (HVAC) systems. The DRV7308 GaN IPM, which is integrated in a 12mm-by-12mm package, enables more than 99% inverter efficiency, optimized acoustic performance, reduced solution size and lower system costs. In addition, the DRV7308 is claimed to achieve “industry-low dead time and low propagation delay, both less than 200ns, enabling higher pulse-width modulation (PWM) switching frequencies that reduce audible noise and system vibration”. This also reduces motor heating, which can improve reliability and extend the lifetime of the system.	11.06.2024 12:30:00	Jun	news_2024-07-01_17.jpg	\images\news_2024-07-01_17.jpg	https://news.ti.com/2024-06-11-TI-unveils-industrys-first-GaN-IPM-to-enable-smaller,-more-energy-efficient-high-voltage-motors	ti.com
1700V SiC Schottky Discretes and Dual Diode Modules	Semiq has announced the addition of 1700 V SiC Sch...	11990	Product Release	1700V SiC Schottky Discretes and Dual Diode Modules	Semiq has announced the addition of 1700 V SiC Schottky discrete diodes and dual diode packs to its QSiC™ product line. The GP3D050B170X (bare die) and GP3D050B170B (TO-247-2L package) discrete diode is rated for respective maximum forward currents of 110 A and 151 A. Device design supports easy parallel configurations, enhancing flexibility and scalability for various power applications. The new devices meet the size and power demands of a wide range of demanding applications including switched-mode power supplies, uninterruptible power supplies (UPS), induction heaters, welding equipment, DC/DC converters, solar inverters and electric vehicle (EV) charging stations. Featuring zero reverse recovery current and near-zero switching loss, Semiq’s 1700 V SiC Schottky diode technologies offer enhanced thermal management that reduces the need for cooling. As a result, engineers can implement highly efficient, high-performance designs that minimize system heat dissipation, allow the use of smaller heatsinks and lead to cost and space savings. All of the new products support fast switching across operating junction temperatures (T<sub>j</sub>) of -55 °C to 175 °C.	11.06.2024 09:30:00	Jun	news_2024-07-01_14.jpg	\images\news_2024-07-01_14.jpg	https://semiq.com/pcim-2024-semiq-introduces-1700v-sic-schottky-discretes-and-dual-diode-modules/	semiq.com
One Channel Power Supply for Current Transducers	Danisense has launched a compact size one channel ...	12028	Product Release	One Channel Power Supply for Current Transducers	Danisense has launched a compact size one channel power supply suitable for its DT, DS, DN and DM series of current transducers. The DSSIU-1 power supply is specified with dimensions of 130 mm x 116 mm x 56 mm, +/- 15 V supply voltage and 1.2 A DCCT nominal current. The position of DSUB and banana connectors on the front side facilitates the set-up. The DSSIU-1 power supply already features TEDS functionality for the next generation of current transducers allowing automatic set-up with compatible instruments.	11.06.2024 09:30:00	Jun	news_2024-07-15_13.jpg	\images\news_2024-07-15_13.jpg	https://danisense.com/news/danisense-launches-compact-size-one-channel-power-supply/	danisense.com

Bodo's News

World's first 300 mm Power Gallium Nitride (GaN) Technology

2" x 4" 250 W Medical and Industrial Power Supply Series

40 V MOSFETs in PDFN 33 Packages

Executive Vice President for German Electronics Specialist

Long-Term Supply Agreement for SiC Power Devices signed

Acquisition of Austrian Power Supply Company

Gen-3 Fast SiC to now qualified according to AEC Q101

Dual 5 A Low-Side MOSFET Gate Drivers for High-Frequency Applications

Evaluation Board for 240 W PD 3.1 Charger with Efficiency >95 %

electronica 2024: The electronics Trade Show turns 60

PCIM Asia 2024 grew significantly

Power Factor Correction Chokes für up to 1000 VDC

Medically approved 4:1 input DC/DC Converters

Current Sensors achieve ASIL C(D) Compliance

240 V/1 kA Bidirectional Power TVS Diode in a Surface Mount Package

European GaN Company establishes Asian Subsidiary

Intelligent Power Device for BLDC Motor Drives

Absorber Patch Attenuates like a Shielding Cabinet

Joining the Global Battery Alliance

Investment in additional R&D Capabilities in Europe and Asia

Ideal Diodes in small TSSPs

MOSFETs in SMD Package for High Performance Applications

Industrial AC/DC Power Supplies in 2" x 3" Packages

Online EV-Charging Resource Hub

eBook about Connectivity Needs and Technologies for Connected Homes

Funding of up to $1.6 Billion in CHIPS and Science Act

Call for Papers for the 75th ECTC

High-Performance Power Module Family

New Semiconductor Material: AlYN promises more Energy-Efficiency

AC Surge Protective Devices

Power Factor Correction Chokes für up to 3,300 W

DC/DC Buck Converter deliver up to 20 A

Intelligent Power Module for Industrial Motors up to 4 kW

Connect with the Advanced Battery and Electric & Hybrid Vehicle Technology Community

Automotive DC/DC Converters with "highest Power Density"

Partnering on new Capacitor-based Energy Storage Systems (CESS)

Personnel Change in Executive Board

SiC Power Semiconductor Fab in Malaysia

Electric Vehicle Charger Reference Designs

Series of Wire-Wound Ferrites extended

High-Power Semiconductor Company: President Change

President of Energy Business

SiC MOSFETs for High-Voltage Drives in EVs

32-bit-DSCs with more Peripherals for Power Applications

High-Current Inductor for Automotive Applications

Aluminum Polymer rectangular Capacitors for 48 V

Thermal Pads Protect EV Battery Packs

High Current Three Phase EMC Filter

High-Current eFuse with integrated Auto-Reset

4.5 kW Power Supply for AI GPU Racks

Second Generation of 1200V SiC MOSFET for High Performance Applications

Supply Chain for Power Devices based on AlN established

SEMICON Southeast Asia 2025 to be Held in Singapore

Varistor Series Offers Surge Current Protection up to 6,000 A

Supply Agreement: SiC MOSFETs for EVs

SiC Modules for Power Grid Batteries

150 V N-Channel Power U-MOS X-H MOSFETs

Memorandum of Understanding to stimulate sustainable Action across the Supply Chain

PCIM Europe 2025: Call for Papers

Testing Procedure for Determining Dielectric Strength

Magnetic Packaging Technology for Power Modules: Cutting Size in half

3-Phase Brushless Gate Driver with Power Module and Sleep Mode

Hyperfast Recovery Rectifiers in D²PAK

Opening of Wafer Testing Site in Malaysia

Analog-Digital Fusion Control Power Supply Solution

Several Changes in Management

Faster Development Processes for DC Charging Stations

Scalable Industry 4.0-ready Zero-Downtime Industrial Power Supply Series

Battery Protector Series to Prevent Li-ion Battery Pack Damage

Optocoupler Series expanded with Opto-TRIACs

New Building for more SiC Wafer Production Space

Experts for WBG-Testing Acquired

Technology Acquisition Expands Power Management Solutions

Open for Proposals for Power Event

Attracting more People to Careers in the Semiconductor Industry

Charity Benefit from PCIM Booth for Education in Ecuador

Connecting Engineers to the Future of EV/HEV Technology

Power Factor Correction: Chokes with High-Current Offerings

electronica 2024: Answers to the major Challenges facing the Automotive Industry

Power Factor Correction Chokes für up to 1000 V_DC